Open Access Article
Michal
Poplinger
ab,
Dimitris
Kaltsas
c,
Chen
Stern
ab,
Pilkhaz
Nanikashvili
ab,
Adi
Levi
ab,
Rajesh K.
Yadav
ab,
Sukanta
Nandi
ab,
Yuxiao
Wu
bd,
Avinash
Patsha
e,
Ariel
Ismach
e,
Ashwin
Ramasubramaniam
fg,
Amaia
Pesquera
h,
Amaia
Zurutuza
h,
Ioanna
Zergioti
c,
Leonidas
Tsetseris
c,
Tomer
Lewi
ab and
Doron
Naveh
*ab
aFaculty of Engineering, Bar-Ilan University, Ramat-Gan 52900, Israel. E-mail: doron.naveh@biu.ac.il
bInstitute for Nanotechnology and Advanced Materials, Bar-Ilan University, Ramat-Gan 52900, Israel
cDepartment of Physics, School of Applied Mathematical and Physical Sciences, National Technical University of Athens, Athens, Greece
dDepartment of Physics, Faculty of Exact Sciences, Bar-Ilan University, Ramat-Gan 52900, Israel
eDepartment of Materials Science and Engineering, Tel Aviv University, Ramat Aviv, Tel Aviv 6997801, Israel
fDepartment of Mechanical and Industrial Engineering, University of Massachusetts, Amherst, USA
gMaterials Science and Engineering Graduate Program, University of Massachusetts, Amherst, USA
hGraphenea Headquarters, Spain
First published on 17th January 2024
Topological insulators, a class of materials possessing bulk bandgap and metallic surface states with a topological nontrivial symmetry, are considered promising candidates for emerging quantum and optoelectronic applications. However, achieving scalable growth and control over the parameters including thickness, carrier density, bulk bandgap, and defect density remains a challenge in realizing such applications. In this work, we show the scalable growth of topological insulator alloys Bi2Se(3−x)Sx and demonstrate composition-tunable bandgap, using chemical vapor deposition (CVD). A bandgap increase of up to ∼40% at a sulfur concentration of ∼15% is demonstrated. Correspondingly, the real part (n) of the refractive index is reduced in the alloy by ∼25% relative to that of Bi2Se3. Additionally, electronic transport measurements indicate a bulk p-type doping and field-effect tunable metallic surface states of the alloy. This work paves the way for the controlled growth of topological insulators, free from surface-state pinning, suitable for quantum optoelectronics and spintronics applications.
Bi2Se3 is one of the most studied three-dimensional (3D) TIs due to its
2 topology manifested in a band structure with a single Dirac cone at the gamma point and a relatively large, direct bandgap of ∼0.3 eV.11,14–17 However, the material is usually heavily n-doped, likely due to shallow defect states emerging from Se vacancies that act as donors. This results in the pinning of the Fermi level to the conduction band, leading to bulk conduction rather than surface-dominated conduction of charge carriers. This issue is one of the main challenges in device applications of Bi2Se3 and other TIs.11,14,15,18
The pursuit of TI materials having large bulk bandgaps also stems from their importance for future room-temperature spintronic applications.1,19,20 In this respect, alloying presents a promising means of tuning the electronic properties of Bi2Se3,15,21–23 with the potential to address both the problems of Fermi-level pinning and bandgap engineering. By utilizing a chemical composition of higher stability in the alloy, the density of natural chalcogen vacancies decreases and suppresses the natural n-doping of Bi2Se3.
The implementation of practical electronic and optoelectronic devices requires repeatable growth of high-quality active materials with uniformity over large areas. In this context, chemical vapor deposition (CVD) is a well-known method for scalable deposition of transition metal dichalcogenides (TMDCs),24,25 transition metal oxides (TMOs) such as wafer-scale single-layer amorphous MoO3,26,27 and has also been demonstrated on chalcogenide optical materials.28 CVD grown Bi2Se3 crystals, with sizes up to 20 μm, were previously reported as well,29 yet the synthesis of alloyed Bi2Se3 has primarily relied on solution-processed techniques and molecular beam epitaxy (MBE).15,21,30–32
Here, we show a CVD growth of Bi2Se3 alloyed with sulfur on various substrates, from isolated crystals to continuous films, uniform on a wafer-scale and with a crystal domain size up to ∼50 μm. The alloyed crystals present a wider bulk bandgap (up to 40% larger than pure Bi2Se3), p-type doping, and field-effect tunable Fermi-level while maintaining the original structural and topological properties of Bi2Se3.
| Substrate | Growth temperature [°C] | Growth time [min.] | Substrate temperature [°C] | Morphology |
|---|---|---|---|---|
| Si/SiO2 | 570 | 10 | 440 | Isolated hexagonal crystals with growth direction perpendicular to the substrate (Fig. S1a, ESI) |
| Sapphire | 580 | 180 | 450 | Hexagonal crystals on a scale of ∼50 μm clustered in vertical growth (Fig. S1b, ESI) |
| Monolayer graphene on Si/SiO2 | 580 | 60 | 460 | Isolated hexagonal crystals on a scale of up to 15 μm (Fig. S1c, ESI) |
| 120 | 440 | Isolated hexagonal crystals on a scale of up to 20 μm (Fig. S1d, ESI) | ||
| 180 | 410 | Continuous layers (Fig. S1e, ESI) |
The representative morphology of isolated crystals is presented in Fig. 1b, showing hexagonal domains on a scale of up to 50 μm. However, the morphology depends drastically on the growth substrate and exhibits large variations in the growth products. On a substrate of Si/SiO2, the hexagonal crystals are oriented vertically to the surface, having minimal contact area with the substrate (Fig. S1a, ESI†). On sapphire substrates, multiple crystalline domains grow laterally and vertically from a single seed and overlap each other (Fig. S1b, ESI†). In high-vacuum conditions, the growth is dominated by thin crystals and adlayers forming crystal seeds in the principal crystalline directions. The minimal measured thickness is attributed to such a monolayer and was found to be 1.5 nm (see the SEM micrograph and AFM topography in Fig. 1d and e). Interestingly, the growth on graphene-covered Si/SiO2 is lateral (Fig. S1c and S1d, ESI†) and tends to form continuous films (Fig. S1e, ESI†). The latter is probably a result of reduced surface reactivity and enhanced diffusivity of the reactants on the surface of graphene. In all cases, the obtained alloys maintain high uniformity (Fig. 2 and Fig. S2, ESI†), owing to the high diffusivity of sulfur in Bi2Se3 and its ability to passivate existing vacancies (see Fig. S3 and associated text, ESI†).
The Raman signature (Fig. 1c) of bulk and monolayer Bi2Se(3−x)Sx (red and yellow lines, respectively) show similar peak positions, with distinct broadening of the peaks in the monolayer crystal compared to that of a bulk crystal. Both thin and thick alloys show shifted spectra relative to pure exfoliated Bi2Se3 (Fig. 1c, blue line), as specified in Table S1 (ESI†). The Raman spectrum of orthorhombic Bi2S3 (Fig. 1c, green line) differs distinctly from the rhombohedral crystals, showing characteristic Raman modes at ∼101 and ∼189 cm−1 that do not appear in the grown alloy materials. This is further supported by the X-ray diffraction (XRD) pattern of the alloyed samples in which the peaks show proximity to those of the reference exfoliated Bi2Se3 sample and agree with the calculated XRD of the rhombohedral structure (Fig. S4, ESI†).
From the analysis of XRD measurements of the alloyed crystals (Fig. 3a and Fig. S4b, ESI†), the variation in the c-axis spacing was correlated with structurally optimized results of Density Functional Theory (DFT) calculations resolved by relative sulfur concentration (see ESI† for details). In a random alloy, the calculated structure predicts a trend that can be fitted to c = −4 × 10−5[%S]2 − 6.5 × 10−3[%S] + 28.669 Å (Fig. S5, ESI†), where the constant coefficient (28.669) is the experimental c value for pure Bi2Se3. The data for two alloys on monolayer graphene on Si/SiO2 (90 nm) are summarized in Table 2 relative to Bi2Se3.
| Sample | c [Å] | [%S] | x | Chemical formula | E g [eV] |
|---|---|---|---|---|---|
| Bi2Se3 | 28.669 | 0 | 0 | Bi2Se3 | 0.31 ± 1.42 × 10−3 |
| Bi2Se(3−x)Sx #1 | 28.586 | 11.9 | 0.36 | Bi2Se2.64S0.36 | 0.38 ± 1.42 × 10−3 |
| Bi2Se(3−x)Sx #2 | 28.561 | 15.2 | 0.46 | Bi2Se2.54S0.46 | 0.43 ± 2.74 × 10−3 |
The variation in the bandgap values of these samples is given in Table 2. The values were determined by applying the Tauc method on the quantity
, which was obtained by employing the Kubelka–Munk (K–M) function (eqn (1))33,34 on the reflection spectra of the samples:
![]() | (1) |
is the reflection of the sample. Pure exfoliated Bi2Se3 yielded a direct bandgap of 0.31 eV (Fig. 3b), matching with the data reported in the literature for Bi2Se3. The calculated direct bandgap values of the alloyed samples are summarized in Table 2. Correlating the sulfur content with the calculated bandgaps, we find that the bandgap increases with higher sulfur content in the sample. Particularly, replacing 15.2% of the chalcogen content with sulfur results in a nearly 40% larger bandgap than that of Bi2Se3.
Fig. 3c shows the real (n) and imaginary (k) parts of the complex refractive index of Bi2Se2.64S0.36 obtained by fitting the experimental reflection spectrum with a multiple Drude–Lorentz oscillator model, as detailed in Fig. S6 and Table S2 (ESI†). The values of n at the wavelength corresponding to the bulk energy bandgap are compared for the pure (6.34)35 and alloyed (4.90) Bi2Se(3−x)Sx TIs and are qualitatively in compliance with the Moss relation (Table 3).36 However, the metallic surface states result in the absence of an absorption edge in TIs, rendering the Moss relation as undefined. In addition, in highly doped samples, where the Fermi level is pinned to the conduction band, a Moss–Burstein shift is manifested due to the metallicity of the bulk.37–39 Interestingly, the losses manifested in the imaginary part of the refractive index are significantly smaller than previously reported chalcogenide topological insulators.7,35,40
Further characterization of the alloy TIs was exercised by measuring their electrical characteristics. Devices were fabricated on 300 nm Si/SiO2 (Fig. 4a) with metallization of Ti/Au contacts. Room temperature I–V measurements at varying gate voltages show an effective field effect (Fig. 4b and c), with some nonlinear character arising from a metal-semiconductor interface at the contacts. This is indicative of an unpinned Fermi-level in the alloyed samples as well as a narrow bulk bandgap semiconductor rather than the metallic behavior of highly doped topological insulators. Furthermore, temperature-dependent measurements (see the ESI† for details) demonstrate a typical metallic behavior, where the resistance increases with increasing temperature (Fig. 4c inset), as opposed to a semiconductor. This characteristic metallic behavior stems from a decrease in the mean free path of electrons between collisions as temperature increases. Since the bulk of the alloys exhibits a bandgap that was measured optically, the metallic transport is exclusively attributed to surface states, implying that the topological phase is maintained after alloying with sulfur. Yet, the origin of the varying temperature coefficient of resistance remains unclear. Notably, monolayer samples are highly resistive, indicating that the topological phase is not supported in monolayer Bi2Se(3−x)Sx. We associate the electrical resistance with the contact interface; however, at this stage, these observations are not conclusive and may require further investigation.
Footnote |
| † Electronic supplementary information (ESI) available: Bi2Se(3−x)Sx synthesis, mass spectroscopy mapping of the grown Bi2Se(3−x)Sx crystals, diffusion processes of chalcogen atoms, Raman spectroscopy, X-ray diffraction, lattice parameters–sulfur content relation by DFT calculations, reflection measurements, optical constants, and temperature-dependent resistance measurements. See DOI: https://doi.org/10.1039/d3tc03428c |
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