Surface Properties of Ga-Cu Based Liquid-Metal Alloys: Impact of Cu Dilution, Topography, and Alloy Liquefaction

Abstract

We studied the surface properties of Ga-Cu based liquid metal alloys – a promising material system for supported catalytically active liquid metal solutions (SCALMS). The impact of Cu dilution in the (liquid) Ga matrix is in-detail investigated by X-ray and UV photoelectron spectroscopy (XPS/UPS) and Machine-Learned-Force Field (ML-FF) calculations. With decreasing Cu content, microscopic and macroscopic Ga-Cu model samples exhibit a shift of the Cu 2p core level line to higher binding energies (Eb) as well as a correspondingly shifted and narrowed d-band with respect to pure Cu, which we ascribe to site isolation. To study the property evolution of Ga-Cu at SCALMS reaction conditions, i.e., where Cu is present in liquid Ga, additional XPS measurements were performed between 100 and 500 oC. The observed Cu 2p shift to lower Eb is tentatively ascribed to changes in the local environment with increasing temperature, i.e. bond elongation, which is corroborated by ML-FF simulations; the increased Cu surface content at low temperatures is attributed to the presence of crystallized Cu-rich intermetallic compounds, as evidenced by transmission electron microscopy images. In an attempt to generalize the findings for filled d-band transition metals (TMs) in liquid Ga also first results on Ga-Ag and Ga-Au model systemsare presented. The observed insights may be another step of paving the way for an insight-driven development of low-temperature melting liquid metals for heterogeneous catalysis.

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Article information

Article type
Paper
Submitted
31 Oct 2025
Accepted
05 Jan 2026
First published
06 Jan 2026
This article is Open Access
Creative Commons BY license

RSC Appl. Interfaces, 2026, Accepted Manuscript

Surface Properties of Ga-Cu Based Liquid-Metal Alloys: Impact of Cu Dilution, Topography, and Alloy Liquefaction

T. Hsieh, M. Moritz, A. Mölkner, C. Wichmann, J. Frisch, J. Steffen, C. J. Parker, V. Krishnamurthi, T. Daeneke, H. Steinrück, A. Görling, C. Papp and M. Bär, RSC Appl. Interfaces, 2026, Accepted Manuscript , DOI: 10.1039/D5LF00335K

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