Issue 8, 2022

Demonstration of temperature-sensitive paints with rigorously controlled thickness applied to variously shaped metal substrates with a highly stable connection based on a demulsification-induced fast solidification strategy

Abstract

Large area and mechanically stable temperature-sensitive paints (TSPs) with excellent temperature sensing properties are highly desired by industry for temperature measurement applications. Along these lines, a novel compound of TSPs composed of WPU/PCD/Eu(DBM)3Bipy (WPU: waterborne polyurethane, PCD: waterborne polycarbodiimide, DBM: dibenzoylmethane) was fabricated on a pure zinc (Zn) substrate by employing the demulsification-induced fast solidification method. On top of that, the luminescent molecular probe of Eu(DBM)3Bipy was in situ dispersed into the WPU/PCD emulsion. The thickness of the TSPs was rigorously controlled within micrometers. The TSPs can be employed based on the principle of temperature quenching for the detection of temperature change from the range of 25 °C to 85 °C. Interestingly, the highest temperature sensitivity of TSPs with 4.46 wt% Eu(DBM)3Bipy reaches the value of 48.34 × 10−3 °C (65–75 °C). Moreover, the WPU/PCD/Eu(DBM)3Bipy TSPs can be used twice without observing a reduction of the fluorescence emission intensity. In addition, the proposed TSPs exhibit excellent impact resistance (at 100 cm height and 1 kg weight) and stable mechanical connection with the Zn substrate.

Graphical abstract: Demonstration of temperature-sensitive paints with rigorously controlled thickness applied to variously shaped metal substrates with a highly stable connection based on a demulsification-induced fast solidification strategy

Supplementary files

Article information

Article type
Paper
Submitted
20 Dec 2021
Accepted
17 Jan 2022
First published
17 Jan 2022

New J. Chem., 2022,46, 3623-3630

Demonstration of temperature-sensitive paints with rigorously controlled thickness applied to variously shaped metal substrates with a highly stable connection based on a demulsification-induced fast solidification strategy

D. Wang, Y. Wang, C. He, J. Li, A. O. Omoniyi, S. Lu, X. Li, J. Zhang, J. Sun and Z. Su, New J. Chem., 2022, 46, 3623 DOI: 10.1039/D1NJ06054F

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