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Issue 65, 2019
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High rate laser deposition of conductive copper microstructures from deep eutectic solvents

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Abstract

In this communication, the phenomenon of the laser chemical deposition of copper using deep eutectic solvents (DESs) on a dielectric substrate has been shown for the first time. The use of eutectic solvents made it possible to greatly simplify the procedure of metal deposition and increase the deposition rate by more than 150 times compared to the use of aqueous solutions.

Graphical abstract: High rate laser deposition of conductive copper microstructures from deep eutectic solvents

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Publication details

The article was received on 06 Jul 2019, accepted on 18 Jul 2019 and first published on 26 Jul 2019


Article type: Communication
DOI: 10.1039/C9CC05184H
Chem. Commun., 2019,55, 9626-9628

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    High rate laser deposition of conductive copper microstructures from deep eutectic solvents

    A. Shishov, D. Gordeychuk, L. Logunov and I. Tumkin, Chem. Commun., 2019, 55, 9626
    DOI: 10.1039/C9CC05184H

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