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Issue 65, 2019
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High rate laser deposition of conductive copper microstructures from deep eutectic solvents

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Abstract

In this communication, the phenomenon of the laser chemical deposition of copper using deep eutectic solvents (DESs) on a dielectric substrate has been shown for the first time. The use of eutectic solvents made it possible to greatly simplify the procedure of metal deposition and increase the deposition rate by more than 150 times compared to the use of aqueous solutions.

Graphical abstract: High rate laser deposition of conductive copper microstructures from deep eutectic solvents

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Article information


Submitted
06 Jul 2019
Accepted
18 Jul 2019
First published
26 Jul 2019

Chem. Commun., 2019,55, 9626-9628
Article type
Communication

High rate laser deposition of conductive copper microstructures from deep eutectic solvents

A. Shishov, D. Gordeychuk, L. Logunov and I. Tumkin, Chem. Commun., 2019, 55, 9626
DOI: 10.1039/C9CC05184H

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