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Issue 51, 2018
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Construction of molecular regular tessellations on a Cu(111) surface

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Abstract

Three types of molecular regular tessellations, i.e., hexagonal, square and triangular tessellations, were constructed on Cu(111) by using 4,4′-dihydroxydiphenyl as the precursor through molecular assembly. These tessellations are stabilized by multiple intermolecular hydrogen bonds and the proportion of each tessellation can be tuned by thermal treatment.

Graphical abstract: Construction of molecular regular tessellations on a Cu(111) surface

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Article information


Submitted
02 Mar 2018
Accepted
29 May 2018
First published
29 May 2018

Chem. Commun., 2018,54, 7010-7013
Article type
Communication

Construction of molecular regular tessellations on a Cu(111) surface

Z. Tao, T. Wang, D. Wu, L. Feng, J. Huang, X. Wu and J. Zhu, Chem. Commun., 2018, 54, 7010
DOI: 10.1039/C8CC01719K

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