Analysis of slumping on nanoimprint patterning with pseudoplastic metal nanoparticle fluid

Abstract

Slumping of patterning in the demolding process is a significant problem when pseudoplastic metal nanoparticle fluid is used as the resist material in nanoimprinting, which adversely affects the fidelity of imprint patterning. A theoretical slumping model is proposed to study the influence of the shear-thinning of pseudoplastic fluid on the patterning. The model revealed, on the basis of the microstructure force analysis at the end of demolding, that the critical viscosity increased with the increase of consistency coefficient or rheological index, decreased with the increase of surface tension coefficient, and was independent of density. It was also confirmed that a larger demolding velocity led to a greater degree of viscosity decrease. These results provide a theoretical reference for higher fidelity patterning in nanoimprint lithography with pseudoplastic metal nanoparticle fluid.