Jump to main content
Jump to site search

Issue 12, 2013
Previous Article Next Article

Rapid bonding of polydimethylsiloxane to stereolithographically manufactured epoxy components using a photogenerated intermediary layer

Author affiliations

Abstract

We describe a low cost, photo-induced, room-temperature bonding technique for bonding epoxy components to flexible PDMS membranes in less than half an hour. Bond strengths (∼350 kPa) were characterized by ISO-conform tensile testing for a popular stereolithography resin and found comparable bond strengths as reported for PDMS/PDMS bonds.

Graphical abstract: Rapid bonding of polydimethylsiloxane to stereolithographically manufactured epoxy components using a photogenerated intermediary layer

Back to tab navigation

Article information


Submitted
14 Mar 2013
Accepted
17 Apr 2013
First published
18 Apr 2013

Lab Chip, 2013,13, 2268-2271
Article type
Communication

Rapid bonding of polydimethylsiloxane to stereolithographically manufactured epoxy components using a photogenerated intermediary layer

E. Wilhelm, C. Neumann, K. Sachsenheimer, T. Schmitt, K. Länge and B. E. Rapp, Lab Chip, 2013, 13, 2268
DOI: 10.1039/C3LC50341K

Social activity

Search articles by author

Spotlight

Advertisements