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Issue 44, 2011
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Tuning the morphology of copper nanowires by controlling the growth processes in electrodeposition

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Abstract

We present an alternative route to fabricate Cu nanowires having various classes of morphologies by controlling the deposition temperature. A rough nanowire with an irregular wire diameter along the wire axis is obtained at a high deposition temperature, whereas a smooth, compact nanowire is obtained as the temperature is lowered. However, as the temperature is dropped further down to subzero degrees, an unusual behavior is observed where the nanowires exhibit rough, dendritic morphologies with relatively uniform wire diameters. We explain this peculiar growth behavior on the basis of kinetic and thermodynamic growth processes.

Graphical abstract: Tuning the morphology of copper nanowires by controlling the growth processes in electrodeposition

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Publication details

The article was received on 06 Sep 2011, accepted on 15 Sep 2011 and first published on 12 Oct 2011


Article type: Paper
DOI: 10.1039/C1JM14403K
Citation: J. Mater. Chem., 2011,21, 17967-17971
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    Tuning the morphology of copper nanowires by controlling the growth processes in electrodeposition

    S. Shin, B. S. Kim, K. M. Kim, B. H. Kong, H. K. Cho and H. H. Cho, J. Mater. Chem., 2011, 21, 17967
    DOI: 10.1039/C1JM14403K

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