Tingfeng
Song
a,
Romain
Bachelet
b,
Guillaume
Saint-Girons
b,
Nico
Dix
a,
Ignasi
Fina
*a and
Florencio
Sánchez
*a
aInstitut de Ciència de Materials de Barcelona (ICMAB-CSIC), Campus UAB, Bellaterra 08193, Barcelona, Spain. E-mail: ifina@icmab.es; fsanchez@icmab.es
bUniv. Lyon, Ecole Centrale de Lyon, INSA Lyon, Université Claude Bernard Lyon 1, CPE Lyon, CNRS, Institut des Nanotechnologies de Lyon – INL, UMR5270, 69134 Ecully, France
First published on 20th July 2021
Stabilization of the orthorhombic phase of HfO2 with La allows very high polarization and endurance to be achieved. However, these properties have not been confirmed yet in films having a thickness of less than 10 nm. We have grown (111)-oriented La (2 at%) doped epitaxial HfO2 films on SrTiO3(001) and Si(001) substrates, and report on the thickness dependence of their ferroelectric properties. Films of less than 7 nm thickness show a high remanent polarization of about 30 μC cm−2, slight wake-up, an endurance of at least 1010 cycles and a retention of more than 10 years, with the endurance and retention measured at the same poling voltage. La-doped HfO2 films even as thin as 4.5 nm also show robust ferroelectric properties.
Among the large radius dopant atoms studied, La has enabled excellent ferroelectric properties.5–9 Kosadaev et al.6 reported La-doped HfO2 films with Pr above 13 μC cm−2 and a very high endurance (limited by fatigue) of up to 1010 cycles. Schroeder et al.7 reported a very high Pr above 27 μC cm−2 and a moderately high endurance of 107 cycles, without fatigue and with a low wake-up effect. Schenk et al.10 concluded that the high polarization of polycrystalline La:HfO2 films is due to the strong orientation of the [001] polar axis towards the normal in these films. However, La:HfO2 films with a very high polarization do not show good endurance,7 as often occurs in HfO2 films doped with other dopants due to the endurance–polarization dilemma.11 Doping Hf0.5Zr0.5O2 (HZO) films with La was effective to enhance the endurance without diminishing the polarization.12,13 Further optimization of La:HfO2 films could perhaps allow the desired combination of high polarization and high endurance. On the other hand, ferroelectricity with Pr around 9 μC cm−2 was reported in La:HfO2 films of up to 1 μm thickness.8 In contrast, to our knowledge, the ferroelectric properties of La:HfO2 films thinner than 10 nm have not been reported.
Recently, the ferroelectric phase was stabilized in epitaxial La-doped HfO2 films.14 Films of thickness t = 8, 12 and 16 nm were grown on different oxide monocrystalline substrates buffered with La0.67Sr0.33MnO3 (LSMO) electrodes. The t = 12 nm film on (001)-oriented SrTiO3 (STO) exhibited the best properties, with Pr = 16 μC cm−2 and an endurance (limited by fatigue) of 107 cycles, while the high leakage of the thinner film (t = 8 nm) did not allow the measurement of the ferroelectric properties. We report here on (111)-oriented epitaxial La:HfO2 films with thicknesses ranging from 4.5 to 17.5 nm and showing excellent ferroelectric properties, including polarization, endurance and retention, which have not yet been achieved in polycrystalline or epitaxial La:HfO2 films. Epitaxial films, enabling better control of microstructure and crystal orientation, can help to better understand the properties of ferroelectric HfO2.15–21 We show that films with a 6.9 nm thickness, deposited on LSMO/STO(001), have a high Pr of up to about 30 μC cm−2 with an endurance greater than 1010 cycles. Robust ferroelectricity is preserved in 4.5 nm films, with Pr above 25 μC cm−2 and an endurance of 109 cycles. We also show that epitaxial La:HfO2 films on buffered Si(001) wafers exhibit excellent ferroelectric properties: a film with t = 6.9 nm has Pr above 32 μC cm−2 and an endurance of more than 5 × 109 cycles. All films show good extrapolated retention beyond 10 years.
The crystal structure was characterized by X-ray diffraction (XRD) with Cu Kα radiation using a Siemens D5000 and a Bruker D8-Discover diffractometer equipped with a point detector, and a Bruker D8-Advance diffractometer equipped with a 2D detector. The surface topography was studied by atomic force microscopy (AFM) using a Keysight 5100 in dynamic mode.
Ferroelectric polarization loops, leakage current, endurance and retention were measured at room temperature by using an AixACCT TFAnalyser2000 platform, and connecting the LSMO bottom electrode to the ground and biasing the top Pt contact. Ferroelectric polarization loops were obtained in dynamic leakage current compensation (DLCC) mode with a frequency of 1 kHz.24,25 Endurance was evaluated using bipolar square pulses, and after cycling the memory window was extracted by DLCC. Retention was measured by poling the sample using a triangular pulse of 0.25 ms and determining the Pr from the first polarization curve of the polarization loop measured at 1 kHz using the positive-up negative-down protocol after a delay time. Leakage current has been measured with an integration time of 2 s and averaging the data collected with increasing and decreasing voltage. Capacitance (C) loops were measured using an impedance analyzer (HP4192LF, Agilent Co.) operated with an excitation voltage of 0.3 V at 20 kHz. Relative dielectric permittivity (εr)–voltage loops were extracted from capacitance values using the C = ε0εrA/t relation, where A is the electrode area and t is the film thickness.
![]() | ||
Fig. 1 XRD measurements of the La:HfO2 films on STO(001): (a) XRD 2θ–χ maps obtained with a 2D detector. The χ range is from −10° to +10°. (b) XRD θ–2θ scans obtained with a point detector. (c) Out-of-plane lattice distance, do-(111) (black circles). The red circles are the do-(111) values of the La:HfO2 films on Si(001), determined from the θ–2θ scans shown in Fig. S1, ESI.† Blue and green triangles represent the do-(111) values of epitaxial La-doped (1 at%) Hf0.5Zr0.49O2 films on STO(001) and Si(001), respectively.26 (d) Pole figures around o(−111) and STO(111) reflections of the t = 17.5 nm film on STO(001). |
The AFM topographic images (Fig. 2) of the La:HfO2 films on STO(001) show extremely flat surfaces. The morphology of terraces and steps presented by the STO substrates31 is replicated in the deposited LSMO and La:HfO2 films. The terraces in the films are well-visible, and the root mean square roughness, calculated in 5 μm × 5 μm areas, is 2.8 Å in the t = 17.5 nm film and less than 2 Å in the thinner films.
![]() | ||
Fig. 2 Topographic AFM images (5 μm × 5 μm) of La:HfO2 films on STO(001) with a thickness of (a) 4.5 nm, (b) 6.9 nm, (c) 9.2 nm, and (d) 17.5 nm. Insets: 1 μm × 1 μm topographic images. |
The ferroelectric polarization loops of the La:HfO2 films on STO(001), measured using a high maximum applied field, are shown in Fig. 3a. The maximum electric field applied to measure the loops was lower in the thicker films, since the coercive electric field EC and the breakdown electric field decrease with the thickness. The two thinner films have a very high polarization, with Pr around 26 and 32 μC cm−2 in the t = 4.5 nm and t = 6.9 nm films, respectively. The polarization is decreases with increasing thickness, with Pr around 10 μC cm−2 in the t = 17.5 nm film. The t = 6.9 nm La:HfO2 film on Si(001) has the largest Pr of about 32 μC cm−2 (Fig. 3b). Note that the round shape of the loops near the maximum applied electric field is a signature of the residual leakage contribution, which results in a possible overestimation of the remanent polarization within 2 μC cm−2.32 All the loops shown in Fig. 3 have been collected at the largest applied electric field before breakdown, at saturation and after cycling the sample 10 times to avoid the wake-up effect discussed as follows and obtain comparable results. The dependences of Pr on the thickness of the La:HfO2 films on STO(001) and Si(001) are presented in Fig. 3c. Both series exhibit a similar thickness dependence, with the maximum Pr in the t = 6.9 nm films. The Pr of the La:HfO2 films ranges from 10 to 30 μC cm−2 on STO(001) and from 12 to 32.5 μC cm−2 on Si(001). We reported a similar Pr dependence for HZO33 and La-doped HZO13 films on STO(001). In contrast, epitaxial HZO34 and La-doped HZO13 films on Si(001) did not exhibit a peak and films thinner than 5 nm had the highest Pr. The dependence of the coercive electric field with thickness is shown in Fig. 3d. The EC of the films on both STO(001) and Si(001) decreases linearly with the thickness (in the logarithmic scale), with a slope of about 0.5. Thus, it follows approximately the EC ∝ t−2/3 dependence usually observed in high-quality ferroelectric perovskite films35–37 and epitaxial HfO2-based films,13,15,33,34 but scarcely observed in polycrystalline HfO2-based films.38
The films exhibit a small wake-up effect, basically observed only in the first cycle and when the applied maximum voltage was lower than that used to obtain fully saturated loops (Fig. 4). The wake-up is evidenced by a double peak in the current–voltage curves, causing a slight shrinkage in the polarization loop. Redistribution of oxygen vacancies or phase transitions induced by an electric field have been proposed as wake-up mechanisms.11 The wake-up effect in our epitaxial films is more pronounced if the maximum applied electric field is reduced (Fig. S3, ESI†). The minimal wake-up effect is in sharp contrast with the persistent wake-up effects commonly observed in polycrystalline La:HfO2 films,5–7 which were explained by the displacement of oxygen vacancies that induce the transformation from the monoclinic phase to the orthorhombic phase.7 However, the wake-up effect is usually null in epitaxial doped HfO2 films, even in epitaxial HZO films on STO(001) that have a significant amount of monoclinic phase. See the recent review of Fina and Sánchez15 for a description of the wake-up effects in epitaxial HfO2 films and the differences with polycrystalline HfO2 films. Some specific properties of epitaxial films can be responsible for the generally negligible wake-up effect compared to polycrystalline films: (i) use of electrodes (LSMO and Pt) more stable against oxidation, (ii) a lower number of defects in optimized epitaxial films, and (iii) a semi-coherent interface between the bottom electrode and the epitaxial HfO2 film. The fact that the here-reported La:HfO2 films show a more pronounced wake-up effect can be related to the larger number of defects compared with Zr doped films as a consequence of the larger dopant radii. In the case of epitaxial La:HfO2 films on Si(001), the wake-up effect is similar and also limited to a few cycles (Fig. S4, ESI†). Note also that the residual leakage contribution, signalled by a current increase near the maximum applied voltage and more prominent in thinner films, also reduces during cycling. This is in agreement with the oxygen vacancy redistribution upon cycling scenario proposed in polycrystalline films, although here the effects are minimal, indicating that the oxygen vacancy number is smaller in epitaxial films.
The leakage current curves of the films on STO(001) are shown in Fig. 5a. The leakage of the t = 4.5 nm film (3 × 10−6 A cm−2 at 1 MV cm−1) is moderately low considering the ultra-low thickness. The leakage of the thicker film, t = 17.5 nm, ranges from around 5 × 10−8 A cm−2 at a low field up to about 4 × 10−7 A cm−2 at 2 MV cm−1. The t = 6.9 nm film is highly insulating, with a leakage well below 10−8 A cm−2 at a low field and less than 5 × 10−8 A cm−2 at 1 MV cm−1. Therefore, the t = 6.9 nm film combines a very high Pr of about 30 μC cm−2 and a very low conductivity. The films on buffered Si(001) show more leakage, and only the t = 17.5 nm film exhibits a low leakage of less than 10−7 A cm−2 at 1 MV cm−1 (Fig. S5, ESI†). The dielectric permittivity loops of the films on STO(001) (Fig. 5b) vary greatly with the thickness of the films. The loop corresponding to the t = 4.5 nm film has a well-defined butterfly shape. The hysteresis reduces with increasing thickness, and it is barely appreciated in the t = 17.5 nm film. The value of the dielectric constant also depends on the thickness. The permittivity at a high electric field is ∼30 in the t = 4.5 and 6.9 nm films, and it is reduced to ∼28 in the t = 9.2 nm film and to ∼24.5 in the t = 17.5 nm film. The decrease of the dielectric constant is in agreement with the observation by XRD of an increase of the monoclinic phase fraction with thickness, and with the reported dependences of the permittivity of other doped HfO2 films on the ratio between orthorhombic and monoclinic phases.34,39–41
The endurance of the films on STO(001) is shown in Fig. 6a–d. The polarization of the t = 4.5 nm film (Fig. 6a), cycled by electric pulses of amplitude 6.7 MV cm−1, increases from 2Pr = 19.5 μC cm−2 in the pristine state to 24.5 μC cm−2 after a few (less than ten) cycles, evidencing the small wake-up effect described above. With additional cycles the capacitor is fatigued and 2Pr decreases to 18.8 μC cm−2 after 105 cycles and then more abruptly to 6 μC cm−2 after 109 cycles. The loss of polarization is, on average, about 75% after eight magnitudes. The t = 6.9 nm film exhibits a similar behavior when cycled at 5.8 MV cm−1, 2Pr being 2.8 μC cm−2 after 1010 cycles (Fig. 6b). The polarization was higher for applied pulses of 6.5 MV cm−1, and 2Pr was 4 μC cm−2 when the measurement was stopped after 1010 cycles. A higher cycling electric field, 7.2 MV cm−1, causes a larger switchable polarization, but the capacitor undergoes hard breakdown after 109 cycles (open blue triangle in Fig. 6b). Representative polarization loops of the t = 6.9 nm film, measured applying several maximum electric fields and a number of cycles, are shown in Fig. S6, ESI.† The endurance of the t = 9.2 nm film (Fig. 6c) is similar, while it is highly degraded in the t = 17.5 nm film (Fig. 6d). This degradation is because hard breakdown occurs at a lower field as the film is thicker, which limits the applied field that can be applied. Breakdown occurs through conductive filaments formed after high enough electrical stress.42 Ionic conduction through incoherent boundaries between monoclinic and orthorhombic grains, more abundant in thicker films, can be a relevant contribution.43 Thus, there is not a direct relation with the thickness dependence of the current leakage (Fig. 5). A similar degradation of endurance with thickness has been observed in other epitaxial13,34 and polycrystalline44 doped-HfO2 films.
Li et al. reported an endurance of up to 107 cycles in epitaxial La-doped (5.5 cat%) HfO2 films.14 The endurance was limited by fatigue, and they found that the loss of polarization was much more severe when the electrical stress was lower (lower pulse amplitude or shorter pulse width) and also when the interval between pulses was longer. It was argued that the high density of charged domain walls in incompletely switched capacitors could be pinned and then cause fatigue. In the case of polycrystalline doped HfO2 films, increased fatigue with decreasing electric field has been reported,45–47 as well as with increasing cycling frequency.46 Schroeder and coworkers46 proposed that the faster degradation of polarization by cycling with pulses of lower amplitudes or higher frequencies was caused by the less saturated switching in these cases (the frequency effect was due to the fact that the coercive field increases with the frequency). The fatigue mechanism suggested by Schroeder and coworkers46 considered that oxygen vacancies migrate during each cycle from switchable regions to non-switchable regions, creating local fields. The intensity of the local field strength would increase with cycling until the domains of the initially switchable regions would be pinned. On the other hand, Starschich et al.48 observed that hard breakdown occurred earlier, as the cycling frequency was lower, and they assumed that this was due to the suppression of generation of oxygen vacancies at high frequencies. In our epitaxial films, the amplitude of the electric field has a critical effect on the capacitor breakdown if it is too high. However, the amplitude of the electric field has no impact on the fatigue (Fig. S7, ESI†). It determines the fraction of ferroelectric domains that are switched and thus influences the polarization, but not the reduction of the normalized polarization with the number of cycles. On the other hand, the endurance of our films is also degraded by a lower cycling frequency, which causes here more fatigue or even breakdown (Fig. S8, ESI†). Note that low frequency measurements we performed implied long period pulses. Using the data shown in Fig. S7 (ESI†) as an example, a capacitor cycled N times by bipolar pulses of 3 V at 10 kHz is poled for a total time 100 times longer than another one cycled at 1 MHz. Therefore, the degradation effects induced by the applied field scale exponentially with the decrease of frequency (longer pulse duration and longer time between pulses), as expected in the redistribution of defects in the bulk of the device.49 Besides, a longer pulse also promotes the migration of free carriers towards domain walls, thus inducing a severer pinning effect.45
The retention of the films on STO(001) is shown in Fig. 7, where the remanent polarization is plotted as a function of the delay time after poling (td). Each film was poled at the same electric field used in the endurance measurements (Fig. 6), and for positive (blue squares) and negative (red circles) poling fields. The experimental data are fitted (blue and red dashed lines) to the rational dependence Pr = P0⋅t−nd.50 The vertical black dashed line corresponds to a time of 10 years. The extrapolated data indicate that the four films retain a high fraction of the initial polarization. The memory window (2Pr) extrapolated to 10 years of the thicker film, which has a high amount of paraelectric monoclinic phase, is 54% of the initial value. The percentage of the initial memory window of the thinnest film, t = 4.5 nm, is 53% despite the expected high depolarization fields. The t = 6.9 and 9.2 nm films maintain 69 and 63% of the initial memory window, respectively. Therefore, all films exhibit excellent retention after being poled with the same electric field used to determine the endurance properties. The retention of more than 10 years is accompanied by an endurance of at least 109 cycles in the t = 4.5 nm film and 1010 cycles in the t = 6.9 nm film. The equivalent t = 6.9 nm film on Si(001) also exhibits an endurance of at least 5 × 109 cycles and a retention of more than 10 years (Fig. S9, ESI†).
Footnote |
† Electronic supplementary information (ESI) available: XRD 2θ–χ maps and θ–2θ scans of films on Si(001). XRD reciprocal space maps. The wake-up effect of films on a STO substrate at lower voltages. The wake-up effect of films on Si(001). The leakage current of the films on Si(001). The polarization loops after different cycles. Normalized polarization of a t = 6.9 nm film on STO(001) as a function of the number of cycles. Endurance measurement at different cycling frequencies. Endurance and retention of a 6.9 nm film on Si(001). See DOI: 10.1039/d1tc02512k |
This journal is © The Royal Society of Chemistry 2021 |