Chidozie
Onwudinanti
ab,
Geert
Brocks
bc,
Vianney
Koelman
ab,
Thomas
Morgan
a and
Shuxia
Tao
*b
aDIFFER–Dutch Institute for Fundamental Energy Research, Eindhoven, The Netherlands
bCenter for Computational Energy Research, Department of Applied Physics, Eindhoven University of Technology, Eindhoven, The Netherlands. E-mail: s.x.tao@tue.nl
cComputational Materials Science, Faculty of Science and Technology and MESA+ Institute for Nanotechnology, University of Twente, 7500 AE Enschede, The Netherlands
First published on 24th March 2020
Hydrogen permeation into mirrors used in extreme ultraviolet lithography results in the formation of blisters, which are detrimental to reflectivity. An understanding of the mechanism via which hydrogen ends up at the interface between the top ruthenium layer and the underlying bilayers is necessary to mitigate the blistering damage. In this study, we use density functional theory to examine the ways in which hydrogen, having entered the near-surface interstitial voids, can migrate further into the metal or to its surface. We show that with hydrogen and tin adsorbed on the ruthenium surface, diffusion to the surface is blocked for interstitial hydrogen in the metal, making diffusion further into the metal more likely than out-diffusion. The dependence on surface conditions matches and confirms similar findings on hydrogen permeation into metals. This suggests control and modification of surface conditions as a way to influence hydrogen retention and blistering.
The interaction of hydrogen and ruthenium has been studied extensively, particularly in the field of catalysis. In an altogether different technological application, the metal has found use as a capping layer on the multi-layer mirrors (MLMs) used in extreme ultraviolet (EUV) lithography.7,8 The MLM consists of 40–60 molybdenum/silicon bilayers, each about 6 to 7 nanometres thick, and is capped by a ruthenium layer. Tin plasma is the source of EUV photons for the lithographic system, and tin debris can be deposited on the mirror. Hydrogen is used as a buffer for the optics, and to etch away contaminants. It comes into contact with the metal, and may penetrate the surface. It can then diffuse through the bulk to the interface(s) of the multi-layer structure, where it recombines to form pockets of H2 gas. When these pockets reach a critical pressure, the layers separate, resulting in blistering of the mirror and loss of reflectivity.9,10 This process appears to be facilitated by tin.
Ruthenium ought to be an ideal capping material, protecting the MLM against hydrogen. In addition to its suitable mechanical and optical properties, it also exhibits low H solubility.11 Although H2 dissociates and asdsorbs on the surface,12 the resulting atoms do not penetrate the Ru lattice easily. In a previous publication,13 we reported that the energy of formation of interstitial hydrogen in ruthenium was found to be positive for both interstitial sites. Our calculations showed that the DFT-calculated energy barrier to subsurface penetration is large for hydrogen, but the presence of tin on the surface leads to a significant lowering of the barrier. These results, and the observed blistering after tin contamination, led to the question: since hydrogen exhibits low solubility in ruthenium, why does the hydrogen injected by tin (hydrides) remain in the ruthenium, and subsequently form blisters at the interface(s)?
We posit that the coverage of the ruthenium surface by adsorbates obstructs the exit of hydrogen from the near-surface region to the surface and the gas phase, thus playing an important role in the blistering process. A number of phenomena have their basis in such restriction of access to the surface. Livshits et al.14 linked superpermeability of a metal membrane to the presence of chemically active adlayers on the upstream surface. Carbon impurities in a hydrogen plasma were found to increase blistering in tungsten targets.15 A palladium–gold alloy was shown to accumulate hydrogen in the near-surface region when the hydrogen exit path was affected by adsorbed CO.16 This effect also occurs without impurities; Soroka et al.17 proposed that the saturation of a ruthenium thin-film surface with hydrogen inhibits hydrogen removal from the underlying yttrium hydride layer. In all these cases, the exit of hydrogen from the bulk metal is impeded by conditions on the surface which cause reduced bulk-to-surface diffusion, recombination, and desorption.
In this article, we examine the different paths and mechanisms through which hydrogen, having reached the interstitial sites in the metal, eventually leaves the bulk and ends up either in the gas phase above the ruthenium capping layer or in the pockets of molecular hydrogen which form the blisters. We show that the availability of sites on the metal surface plays a key role in the out-diffusion of hydrogen. Thus, saturation of the surface with adsorbed hydrogen hinders the removal of hydrogen from the bulk. Our calculations therefore indicate that near-complete coverage of the ruthenium surface will result in more hydrogen reaching the interface between the thin ruthenium layer and its substrate, where it can form blisters.
The calculated lattice parameters for hexagonal close-packed (hcp) ruthenium are a = 2.69 Å and c/a = 1.58, which are in good agreement with experimental results, 2.71 Å and 1.58, respectively.23 The Ru(0001) surface is modelled as a slab of seven layers using a (2 × 2) cell, with ∼ 15 Å of vacuum between the periodic images in the z-direction. The number of layers and the vacuum height were found to give accurate results at reasonable computational cost—the calculated surface energy changes by less than 2% from 7 layers to 11 layers.
For hydrogen, the energy of adsorption is computed per the definition
![]() | (1) |
![]() | (2) |
Due to the low mass of the hydrogen atom, its adsorption and diffusion are, in general, influenced by zero-point energy (ZPE). The ZPE is calculated by the relation
![]() | (3) |
Diffusion coefficients are commonly expressed in the general form,
![]() | (4) |
![]() | (5) |
![]() | (6) |
The Ru(0001) surface offers a number of adsorption sites. Two of these sites, labelled fcc and hcp sites, allow three-fold coordination of H with surface Ru atoms, and have the most negative adsorption energies (see Fig. 1). Indeed, all sites show negative adsorption energies, with the top site least favourable. The values remain negative at 100% coverage, i.e. up to 1 H atom per surface Ru atom, with all fcc sites occupied. Previously-published first-principles calculations27,28 show a similar trend in energies of adsorption, with the slight variations in absolute values explained by differences in parameters and software used for the DFT calculations. We thus confirm that hydrogen adsorption on the ruthenium surface is favourable, and that exposing ruthenium to hydrogen will result in saturation of the surface by dissociated hydrogen atoms.
In the close-packed lattice, the octahedral sites, which are formed by 6 atoms at the vertices, are larger than the tetrahedral voids, formed by 4. The calculated formation energy of the interstitial hydride, shown at 154 concentration (H/Ru) in Fig. 2, indicates that the octahedral site is preferable. Its 0.34 eV formation energy is much lower than the 0.84 eV of the tetrahedral site. For the subsurface octahedral site which we focus on subsequently, the energy value is nearly the same, 0.30 eV at 128 concentration; this is calculated for a slab, as opposed to the preceding bulk values. Nonetheless, we can conclude that the subsurface state is very similar to the bulk interstitial state.
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Fig. 2 Interstitial sites and the corresponding hydride formation energies at hydrogen concentration (H/Ru) equal to 154. |
In general, the endothermic nature of interstitial hydride formation makes it unfavourable, and the concentration of the interstitial hydrogen will remain low. An estimate of the fractional concentration of dissolved H atoms in ruthenium is 10−9 relative to the gas, at 1 bar and room temperature; this is according to a lattice gas model with all H atoms in the lower-energy octahedral sites. The low solubility is confirmed by experimental data11 and other computational studies.28
The elementary hops for hydrogen diffusion in the Ru lattice, as well as their effective frequencies and energy barriers are shown in Fig. 3. We obtain for the diffusion prefactors the values D0⊥ = 1.44 × 10−6 m2 s−1 and D0‖ = 1.70 × 10−7 m2 s−1. The corresponding activation energies are Q⊥ = 0.80 eV and Q‖ = 0.69 eV. Experimental values for hydrogen diffusion in ruthenium are lacking in the literature. However, our results are of comparable magnitude to those reported in ab initio studies for H diffusion in α-titanium.29
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Fig. 3 Jump paths, ZPE-corrected energy barriers, and effective frequencies for H in Ru. The blue spheres show the interstitial sites and the red spheres show transition states between the sites. |
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Fig. 4 Diffusion paths for H atom in first Ru subsurface interstitial site. The sideways arrow shows one of six (6) possible diffusion paths within the same subsurface layer. |
We distinguish three main example surface/subsurface scenarios, and model the hydrogen atom jumps. As illustrated in Fig. 5, these configurations are: (a) with the surface clear of hydrogen; (b) with adsorbed hydrogen; (c) and with adsorbed hydrogen and tin. For each case, the diffusion paths for the hydrogen atom in the subsurface are calculated using the Climbing Image Nudged Elastic Band (CINEB) algorithm. The results are presented in detail below, and summarised in Table 1.
![]() | ||
Fig. 5 H in subsurface interstitial sites under a (a) clean Ru surface; (b) Ru surface with H adsorbed; and (c) Ru surface with Sn and H adsorbed. |
Energy barrier (ΔE) [eV] | |||
---|---|---|---|
Clean surface | H adsorbed | H & Sn adsorbed | |
Sideways | 0.73 (+0.00) | 0.78 (+0.00) | 0.95 (+0.12) |
Downwards | 0.78 (+0.02) | 0.48 (−0.17) | 0.56 (+0.06) |
Upwards | 0.17 (−0.93) | — | — |
Upwards (AD) | — | 1.20 (+0.13) | 1.89 (+0.03) |
The sideways jump faces different barriers for the clear and occupied states of the surface, though the 0.05 eV difference is quite slight. In other words, the conditions for the atom diffusing within the layer are essentially unchanged by the presence of hydrogen on the surface. However, when Sn is present, this sideways diffusion changes: the barrier and ΔE are higher. This is explained by the proximity of the Sn atom, as the change in energy is a result of the change in position relative to the Sn atom and its immediate neighbours.
Moving deeper into the bulk is a relatively simple one-step process, from one octahedral site to another, over a barrier of 0.48–0.78 eV. There is only one destination site, directly below the initial site. If this site happens to be occupied, this migration becomes impossible. This site is unlikely to be occupied, however, owing to the +0.34 eV formation energy and the consequent low solubility of H in Ru. It is notable that this downwards hop results in a lowering of energy (−0.17 eV) relative to the subsurface site when the surface is covered with hydrogen, tilting the situation in favour of deeper migration.
The interstitial atom can also move to the fcc site on the surface, over a barrier that is only 0.17 eV when the surface is clear of adsorbates. This is a much lower barrier than the others faced by the diffusing atom, much more likely to be scaled. Moreover, due to the lower total energy of the adsorbed state, this is an exothermic process, with the end state 0.93 eV lower in energy than the starting point in the interstitial site. However, this escape is contingent on the fcc site being unoccupied. In the case of an occupied surface site, the subsurface-to-surface transition becomes a multi-step process which must involve the vacation of a surface site for the H atom, due to diffusion or recombination. When there is a steady supply of H atoms and molecules to the surface (as is the case when the multi-layer mirror is exposed to H plasma), the interstitial H atom is also in competition for surface sites with this H supply. Each of these conditions reduces the probability of escape, and increases the likelihood of deeper penetration.
A similar site-blocking effect has been proposed to explain the retarded dissociation of YH3 under a Ru film.17 Soroka et al. observed that the unavailability of surface sites prevented the escape of hydrogen. By raising the temperature of the sample above the desorption temperature, the hydrogen atoms released from the YH3 layer were able to diffuse to the surface much more rapidly, allowing the decomposition of the yttrium trihydride to proceed. In this instance, only hydrogen adatoms were present. In other studies, the presence of other species, such as carbon or chemically active gases, will reinforce the blocking effect not just by occupying the surface but also by impeding the recombination and desorption of hydrogen.15
In the case of a ruthenium thin film exposed to plasma containing a large fraction of atomic hydrogen, the availability of surface sites is limited. Hydrogen readily adsorbs on the ruthenium surface. This means that any hydrogen which ends up within the ruthenium faces an obstacle to escape. The “injection” of hydrogen into the subsurface is caused by the presence of tin, which lowers the penetration barrier.13 The diffusion coefficients we have calculated indicate that hydrogen diffusion within the ruthenium proceeds at a rate similar to that of hydrogen in other metals, and poses no great obstacle. Tin on the surface also affects surface diffusion of hydrogen, i.e. it may reduce the rate at which sites are freed.13 Thus the likelihood of diffusion to the interface and subsequent blistering is greatly increased when the concentration of hydrogen in the subsurface is significantly raised. In this way, the surface site blocking effect of hydrogen and tin plays a key role in the blistering of the ruthenium film. To be perfectly accurate in answering our initial question: the hydrogen which enters the ruthenium thin film does eventually leave; it simply ends up in the blisters at the opposite face.
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