F. Arabpour Roghabadia,
V. Ahmadi*a and
K. Oniy Aghmiunib
aFaculty of Electrical and Computer Engineering, Tarbiat Modares University, P.O. Box: 14115-194, Tehran, Iran. E-mail: v_ahmadi@modares.ac.ir; Fax: +98-21-8288-3368; Tel: +98-21-8288-3368
bMaterial Engineering Department, Faculty of Engineering and Technology, Tarbiat Modares University, Tehran, Iran
First published on 21st November 2016
In this work, a full surface coverage CH3NH3PbI3 layer is achieved by controlling the growth mechanism of crystals according to the Stranski–Krastanov mode. This pin-hole free perovskite layer is achieved from a one-step solution process at low temperature (100 °C) and short time (20 s) which provides the means for the fabrication of highly efficient flexible devices. As a result, perovskite solar cells (PSC) with 15.01% power conversion efficiency (PCE) on a glass substrate and 11.25% PCE on a flexible substrate (PET) are fabricated by the applied method.
Planar heterojunction configuration is similar to polymer solar cells. The strong s–p anti-bonding coupling in halide perovskites leads to small effective masses for electrons and holes which provides the means for the fabrication of an efficient solar cell with p–i–n configuration.13 In this architecture, a perovskite absorber layer is sandwiched between electron transporting layer (ETL) and hole transporting layer (HTL) without a mesoporous scaffold. Two heterojunctions are provided which are the junction between absorber and HTL, and the junction between the absorber and ETL.14,15 The planar perovskite solar cells can be fabricated in an inverted manner which are more similar to polymer solar cells in comparison to normal planar devices. In contrast to the other types of perovskite cells, in invert devices, photogenerated electrons are collected in the cathode and photogenerated holes are collected in the anode. Poly[3,4(ethylenedioxythiophene)]:poly(styrenesulfonate) (PEDOT:PSS) and fullerene derivatives are commonly used as HTL and ETL, respectively.16,17 The advantages of this structure are as follows; (1) TiO2 compact layer is replaced by organic ETM which avoids the high temperature annealing process18,19 and the device structure is simpler.20 (2) The stability of the device is improved by removing TiO2 layer which causes instability under UV light.6 (3) The materials and process method of this structure provide the fabrication of flexible perovskite solar cell.1,21 (4) Due to the high cost associated with spiro-MeOTAD, it can be replaced by other organic materials.6
Because of the advantages of solution processing, the widely used method for perovskite deposition is in fact the solution process. In this method, the absorber is deposited via one-step or two-step processes. In the one-step process, a solution of mixture of methylammonium halide and lead iodide (PbI2) is spin-coated on the substrate.15 In the two-step process, first a solution of PbI2 is coated and then a solution of methylammonium halide is spun on it.6 There are some challenges about the fabrication of these devices via both one-step17,22 and two-step processes.6,23 However, the morphology of the film prepared by the one-step method is more uncontrollable than the two-step, the one-step possesses the most cost effective and straightforward technology for large-scale production. While low temperature spin-coating is the simplest methods to fabricate low-cost solar cell devices, it has been found very challenging to form continuous and uniform perovskite films by spin-coating of the directly mixed PbI2 and methylammonium halide blend precursor. Up to now, some methods were used to achieve a high quality perovskite layer from one-step process.16,24 Several researchers reported the perovskite film improvement quality by solvent engineering,9,25–28 using additives,7,29–31 and controlling the process condition.32,33 Also, solution-based hot-casting technique was demonstrated to grow continuous thin films of organometallic perovskite with millimeter-scale crystalline grains for fabrication of perovskite solar cells.17 In this technique, processing at high temperature is a limitation for flexible substrates. Qiu et al. fabricated a high coverage perovskite film by developing a new precursor combination including Pb(CH3CO2)2·3H2O, PbCl2 and CH3NH3I.7 A high coverage CH3NH3PbI3−xClx film was fabricated with a one-step process followed by a 10 min annealing step at 130 °C.7 Using hole transporting materials (HTM) with desired surface properties is another approach for enhancing grain size of perovskite and achieving more uniform layers. As reported, non-wetting surface of HTL is more beneficial for grain growth. Morphology improvement of perovskite layer by using doped poly(triaryl amine) (PTAA)34 and poly[N,N′-bis(4-butylphenyl)-N,N′-bisphenylbenzidine] (poly-TPD)35 as HTLs was reported which led to device performance enhancement. Wang et al. achieved a perovskite film with 94.2% coverage by utilizing aligned perylene microstructure film as the underlayer.36
Moisture sensitivity of halide perovskite is another challenge in this field which causes a complex effect on the perovskite film formation and degradation especially at higher temperatures.37–39 Moisture can play a desired effect in the formation of perovskite film during crystallization. It also has a damaging effect on the formed perovskite crystals resulting in degradation.40,41 As the favored atmosphere for device fabrication is ambient condition,42 the fabrication time of the device plays an important role in controlling the properties and reproducibility of the final products. Therefore, the exposure time of the perovskite layer to the air during spin-coating, annealing and other layers deposition should be reduced.
As stated, in one-step solution processing, achieving a uniform perovskite thin film at a short casting time and low temperature would create the opportunity to step towards the large-scale production of perovskite solar cells. Therefore, in this work, a new approach is reported to achieve a full surface coverage perovskite film at low temperature and short time for fabricating high efficient inverted planar perovskite solar cells on glass and flexible substrates.
:
PSS (Lumtec, 1
:
6 weight ratio) is spin-coated at 5000 rpm for 30 s and annealed for 20 min at 100 °C. The deposition of perovskite layer on the PEDOT:PSS layer is conducted using a one-step process at ambient condition with relative humidity of 27% ± 3. First, MAI and PbI2 are separately dissolved in anhydrous N,N-dimethylformamide (DMF) at 1 M concentration, and kept at 70 °C. For achieving high coverage and low roughness perovskite films, these two precursors are mixed at various ratios and deposited at different temperatures. Before deposition, the substrates are kept at the selected temperature for 2 min and then quickly transferred to the spin coater chuck. 50 μl of precursor solution is poured on substrate and subsequently spin-coated at 4000 rpm for 10 s. After deposition, the substrates are quickly transferred to the hot plate and annealed for 10 s at the selected temperature for casting. The ETM is deposited on the perovskite layer by spin-coating of a 20 mg ml−1 solution of phenyl-C61-butyric acid methyl ester (PCBM) (Lumtec, 99.5%) in 1,2-dichlorobenzene. Finally, a 100 nm-thick Ag layer is deposited on the top of the PCBM film by thermal evaporator in vacuum condition (∼10−5 torr), yielding an active area of 0.1 cm2.
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| Fig. 1 (a) Schematic of the inverted perovskite device architecture, (b) schematic of the perovskite film deposition process. | ||
| Sample | MAI/PbI2 molar ratio | Substrate temp. | Annealing temp. and time | Crystal growth mode | Coverage (%) | Thickness |
|---|---|---|---|---|---|---|
| P1-100 | 0.7 : 1 |
100 °C | 100 °C, 10 s | Stranski–Krastanov | ∼100 | ∼280 nm |
| P1-80 | 0.7 : 1 |
80 °C | 80 °C, 10 s | Stranski–Krastanov | ∼100 | ∼270 nm |
| P2-100 | 0.8 : 1 |
100 °C | 100 °C, 10 s | Volmer–Weber | ∼94 | ∼320 nm |
| P2-80 | 0.8 : 1 |
80 °C | 80 °C, 10 s | Volmer–Weber | ∼91 | ∼310 nm |
| P3-100 | 1 : 1 |
100 °C | 100 °C, 10 s | Volmer–Weber | ∼65 | ∼450 nm |
| P3-80 | 1 : 1 |
80 °C | 80 °C, 10 s | Volmer–Weber | ∼72 | ∼500 nm |
| P4-100 | 1.5 : 1 |
100 °C | 100 °C, 10 s | Volmer–Weber | ∼81 | ∼300 nm |
| P4-80 | 1.5 : 1 |
80 °C | 80 °C, 10 s | Volmer–Weber | ∼83 | ∼290 nm |
The strong dependency of the number and size of grains, and film coverage percentage on precursor solution composition is another point of Fig. 2a and b. The SEM images (Fig. 2 and S3†) and grain size distribution (Fig. 3a and S4†) of films P3 and P4 indicate that by increasing the MAI/PbI2 molar ratio, additional number of nuclei contribute to crystal growth and thereby increasing the number of islands formed with smaller diameter (Fig. 3a and b). Due to enhanced nucleation, grain boundaries extend which can act as trapping sites for free charge carriers while, the coverage percentage increases as desired (Table 1). As demonstrated in Fig. 3b, nucleation and growth of islands are competing processes. Enhancement of the substrate temperature from 70 °C to 100 °C leads to the reduction of the number of the islands (fewer nuclei) and increment of the crystal size (further growth) (Fig. 3a and b and S5†). The reason is that, at high temperature, the critical free energy is higher due to the more equilibrium concentration of the chemical reaction.44 As the number of nuclei (n) is inversely proportional to the critical free energy (Gc) (
, where k is Boltzmann constant and T is the temperature44), along with the increase of temperature, the number of the nuclei growing into the perovskite crystals declines, leading to grain size enhancement. In both one-step and two-step processes, the temperature shows its strong effect on grain size, not their shape.17,44,47 It should be noted that, during MAI concentration variation, the observed competition between the nucleation and growth of perovskite grains in one-step process is in consistent with the reported dependency of two-step process.44,48 But, in one-step process, the crystallization mode, grains shape and size are strongly dependent on the MAI concentration, while in two-step process it merely affects the grain size.44,48
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| Fig. 3 (a) Grain size distribution of films P3 and P4, (b) number of grains and average grain size of films P3 and P4 as functions of temperature and MAI/PbI2 molar ratio. | ||
The shown topography images in Fig. 2c confirm the morphology obtained by SEM. The measured root mean square (RMS) for film P1-100, P2-100, P3-100 and P4-100 are 40 nm, 80 nm, 200 nm and 60 nm, respectively. Fig. 4a and b present the cross-sectional SEM images and height profile of perovskite layers acquired from AFM images (Fig. S6†). As observed, the lowest RMS and thickness are achieved for film P1-100 which has 100% coverage. The height profiles of the perovskite layers in Fig. 4b and c clearly demonstrate the formation of packed layer with low roughness in film P1-100 and the available holes in films P2-100, P3-100 and P4-100. Also, the high thickness and roughness of film P3 specify that the growth rate of the crystals along the c-axis direction is faster than the a- and b-axes directions (Fig. 4a and b). AFM images of films P3-100 and P4-100 reveal that the competition between nucleation and growth leads to a kinetically limited roughening of perovskite film at higher concentration of MAI. The analysis of the dependency of the crystallization mechanism and crystal structure on the precursor molar ratio and temperature indicates that precursor molar ratio is more dominant than temperature.
Fig. 5 shows the absorption and PL spectra of perovskite films. Comparison of the PbI2 spectrum with perovskite films and the broad absorption across the UV-visible range confirm the formation of perovskite structure. As distinctly observed, films containing a large amount of PbI2 have stronger absorbance in the UV range. Also, there is no significant difference between the PL spectra of samples. A small red-shift is observed for samples formed at 100 °C, compared to the samples formed at 80 °C. This shift may specify a higher electronic disorder in the films annealed at higher temperature which allows excitons to relax to lower energetic states or can be due to the significant difference between crystal size and structure.49 Also, when MAPbI3 crystallites grown in planar structure, organic cation has ordered arrangement. The interaction of organic cation with the inorganic cage and the displacement affect the electronic properties of the compound. Therefore, by changing the temperature, the ordering of the cation may be change which can cause the shift in PL.50
Fig. 6 illustrates the XRD patterns of perovskite structures formed in different condition. The major diffraction peaks at 14.2° and 28.6° corresponding to 1 1 0 and 2 2 0 planes reveal that the tetragonal perovskite structure is formed in all films.17 As shown, impurity peaks disappear merely in film P3-100 with precursor molar ratio 1
:
1, while PbI2 peaks are observed in films with precursors containing higher PbI2 molar percentage, particularly for the full covered film (P1-100). The presence of a low amount of PbI2 in these films can promote the reduction of carrier recombination in the perovskite layer, as well as in the interfaces between perovskite and the carrier transport layer.51 Furthermore, MAI peaks appear in film P4-100 which its precursor is comprised of higher MAI molar percentage. The slight difference between the XRD pattern and absorbance spectra of the prepared samples indicates that the casting temperature and precursor ratio only affect the crystallization mode, grains dimension and film coverage.
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| Fig. 6 XRD patterns of the perovskite films deposited from precursor solutions with various molar ratios. | ||
The J–V characteristic of the fabricated devices using presented perovskite layers (Table 1) are presented in Fig. 7a. It should be noted that each device is named according to the name of the used perovskite layer. The extracted photovoltaic characteristics are summarized in Table 2. The evaluation of devices performance is in consistent with the observed trends in SEM and AFM images. As seen, the highest performance (15.01%) is achieved for the device including pin-hole free perovskite layer (P1-100). Removing holes from the layer by controlling the growth mode according to Stranski–Krastanov mechanism leads to reduce the recombination rate and enables the achievement of 70%-Fill Factor (FF) device. Full covering of perovskite film prevents direct contact of HTM and ETM (Fig. 4c) and also enhances the light absorbance. Among all devices, cell P3-80 and cell P3-100 which have the lowest coverage and the highest thicknesses of perovskite layer, show the lowest PCEs, 4.35% and 4.48%, respectively. Considering that, the hysteresis appears in photovoltaic performance of the perovskite solar cells which showed strong dependency on device processing method, the J–V characteristics of the best device P1-100 scanned from different direction and by applying various voltage scan-rates are exhibited in Fig. S7 and S8.† When the device is scanned from reverse bias to forward bias, it shows a short-current density (JSC) of 22.5 mA cm−2, open-circuit voltage (VOC) of 0.94 V and FF of 0.71, leading to the 15.01% PCE. When scanning is from forward bias to reverse bias, the device shows a JSC of 22.8 mA cm−2, VOC of 0.9 V, FF of 0.7, and a PCE of 14.4%. Thus, by fabricating a uniform perovskite layer and reducing trap densities,52 a slight hysteresis in device performance is observed (Fig. S7 and S8†). Resulting uniform and reproducible perovskite layer provides the fabrication of high performance devices with the average efficiency of 14.25% ± 0.8%, measured from 50 devices.
| Device | VOC (V) | JSC (mA cm−2) | FF (%) | PCE (%) | The best PCE (%) |
|---|---|---|---|---|---|
| P1-100 | 0.97 ± 0.05 | 21 ± 2 | 70 ± 2 | 14.25 | 15.01 |
| P1-80 | 0.9 ± 0.05 | 17 ± 2 | 62 ± 3 | 9.48 | 10.02 |
| P2-100 | 0.9 ± 0.05 | 17 ± 2 | 56 ± 2 | 8.56 | 9.37 |
| P2-80 | 0.8 ± 0.1 | 16 ± 2 | 55 ± 2 | 7.04 | 8.24 |
| P3-100 | 0.72 ± 0.05 | 12 ± 2 | 46 ± 2 | 3.97 | 4.48 |
| P3-80 | 0.7 ± 0.05 | 12 ± 1 | 45 ± 1 | 3.78 | 4.35 |
| P4-100 | 0.95 ± 0.05 | 17 ± 1 | 58 ± 3 | 9.36 | 9.8 |
| P4-80 | 0.9 ± 0.05 | 14 ± 2 | 57 ± 2 | 7.18 | 8.41 |
The proposed low-temperature process for perovskite fabrication offers the fabrication of flexible devices on polymeric substrates. Fig. 8a shows the J–V characteristics of the best devices with perovskite layer P1-100 fabricated on the glass/ITO and flexible substrates. It indicates that the high level of uniformity, low temperature and short-time processing introduced the proposed method as a desired technique for fabricating high performance rigid and flexible solar cells. Fig. 8b shows the variation of current density of the best rigid and flexible devices at the maximum power point condition with a light soaking time. As observed, both cells show stable saturated current density under continuous illumination. Furthermore, the fabricated inverted MAPbI3 devices show high stability under exposure to ambient condition with 27 ± 3% relative humidity which will report in our future work.
Footnote |
| † Electronic supplementary information (ESI) available. See DOI: 10.1039/c6ra23074a |
| This journal is © The Royal Society of Chemistry 2016 |