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Correction: The effect of device geometry and crystal orientation on the stress-dependent offset voltage of 3C–SiC(100) four terminal devices

Afzaal Qamar *a, Hoang-Phuong Phan a, Jisheng Han a, Philip Tanner a, Toan Dinh a, Li Wang a, Sima Dimitrijev ab and Dzung Viet Dao ab
aQueensland Micro- and Nanotechnology Centre, Griffith University, Queensland, Australia. E-mail: afzaal.qamar@griffithuni.edu.au
bSchool of Engineering, Griffith University, Queensland, Australia

Received 25th August 2015 , Accepted 25th August 2015

First published on 2nd September 2015


Abstract

Correction for ‘The effect of device geometry and crystal orientation on the stress-dependent offset voltage of 3C–SiC(100) four terminal devices’ by Afzaal Qamar et al., J. Mater. Chem. C, 2015, 3, 8804–8809.


The details for ref. 34 are incorrect in the PDF version of this communication article. The correct details are given below1 and were updated in the HTML version of the original article and republished on 26th August 2015.

The Royal Society of Chemistry apologises for these errors and any consequent inconvenience to authors and readers.

References

  1. A. Qamar, H.-P. Phan, D. V. Dao, P. Tanner, T. Dinh, L. Wang and S. Dimitrijev, IEEE Electron Device Lett., 2015, 36(7), 708–710 CrossRef.

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