Weizhen Li*,
Zonglian Xia,
Ao Li,
Yang Ling,
Baoyu Wang and
Wenjun Gan*
Department of Macromolecular Materials and Engineering, College of Chemistry and Chemical Engineering, Shanghai University of Engineering Science, 201620, Shanghai, China. E-mail: liweizhen@sues.edu.cn; wjgan@sues.edu.cn
First published on 24th December 2014
Hydrophilic silica nanoparticles were introduced into the epoxy/polyetherimide (epoxy/PEI) binary system to study their effect on the reaction induced phase separation (RIPS) by differential scanning calorimetry (DSC), optical microscopy (OM), and time-resolved light scattering (TRLS). Depending on the specific interaction between the silica surface and the epoxy, the silica nanoparticles selectively distribute in the epoxy-rich domain, leading to a slow down of the diffusion of the epoxy molecules. And the coarsening mechanism was forced towards the diffusion-controlled regime, which enhanced the viscoelastic effect and produced a more dynamic asymmetric epoxy/PEI system. Based on this, the final morphology was stopped at an earlier stage of an inverted phase structure (isolated epoxy-rich droplet and PEI-rich matrix). The silica nanoparticles showed a critical impact on the balance of the diffusion and geometrical growth of epoxy molecules. Further, the activity energy of the curing reaction and the phase separation temperatures were decreased by existence of the silica nanoparticles.
Recently, literatures reported that the phase behavior of binary polymer mixtures can be significantly altered by nano- or microfillers, such as fibers, silica particles and nanoclay.8,9 The addition of nanofillers leads to significant effects on the system with UCST or LCST, such as increasing or decreasing the temperatures of phase separation, modifying the shape of the phase diagram or changing the kinetics of phase separation. Lipatov et al. found the phase boundary can be shifted either up or down depending on the particles concentration with addition of silica nanoparticles in the chlorinated poly(ethylene)/poly(ethylene-co-vinyl acetate) (EVA) blends.10,11 Ivan Kelnar et al. showed that the addition of the layered silicate in polyamide/polystyrene blends leaded to remarkable refinements of both particulate and co-continuous structures.12
Generally, the final phase separation morphology of an epoxy/thermoplastic binary system is determined by the competition between cure-reaction rate and phase separation rate.13 Nanofillers could tailor the phase behavior by altering the diffusion or the cure-reaction rate of the components. Guijun Yu et al. reported that an enhancement effect of methylenedianiline-modified graphene oxide (GO–MDA) on the complex viscosity and cure-reaction rate of the diglycidyl ether of a bisphenol A/polyetherimide (DGEBA/PEI) binary system, therefore arresting the final morphology of the composites at an earlier stage of co-continuous structure.14 Mao Peng et al. studied the effect of organic modified layered silicates (OLS) on the RIPS of epoxy and poly(ether imide) (PEI). The onset of phase separation and the gelation or vitrification time were greatly brought forward and the periodic distance of phase-separated structure was reduced when OLS was incorporated.15,16 Since that, nanofillers attract much attention to regulate the morphology of the complex mixture, and control the macroscopic properties of the polymer blends. It is essential to obtain a co-continuous or phase inversion morphology for toughening purposes in material designing and property control with small amount of modifier.
In this study, we selected a ternary mixture of DGEBA, PEI, and hydrophobic silica particles as a model system to evaluate the influence of silica nanoparticles on the process of phase separation and the final morphology of the thermosetting/thermoplastic blends with optical microscopy (OM), time-resolved light scattering (TRLS), and scanning electron microscopy (SEM). Besides, the curing behavior of the epoxy/PEI system was studied by differential scanning calorimetry (DSC).
Sample | DGEBA (pbw) | PEI (pbw) | MEK–SiO2 (pbw) | Me-THPA (pbw) |
---|---|---|---|---|
M0025 | 100 | 25 | 0 | 80 |
M0125 | 100 | 25 | 1.0 | 80 |
M0225 | 100 | 25 | 2.0 | 80 |
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Fig. 1 Dynamic DSC thermograms of epoxy/PEI (100![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() |
Tp (K) | 2.5 K min−1 | 5 K min−1 | 10 K min−1 | 15 K min−1 | 20 K min−1 | Ea (kJ mol−1) |
---|---|---|---|---|---|---|
M0025 | 426.6 | 437.1 | 450.2 | 460.1 | 465.8 | 78.8 |
M0125 | 417.6 | 430.8 | 444.8 | 456.3 | 463.7 | 65.2 |
M0225 | 415.8 | 428.3 | 443.3 | 454.8 | 461.7 | 64.2 |
More information can be obtained from the calculation of the activation energy. According to Kissinger equation,19 a plot of ln(β/Tp2) versus 1000/Tp allows the determination of activation energy, which is shown in Fig. 2. The activation energy calculated for epoxy/PEI (100:
25), epoxy/PEI/SiO2 (100
:
25
:
1) and epoxy/PEI/SiO2 (100
:
25
:
2) blends were 78.8 kJ mol−1, 65.2 kJ mol−1, 64.2 kJ mol−1, respectively. The decrease of the activation energy with the incorporation of silica nanoparticles could be explained by the status that the hydroxyl groups on the surface of the particle participate in the curing reaction and act as an epoxy ring-opening accelerator (quickly open the ring of the anhydrides or the epoxy ring), therefore bringing down the energy barrier of curing reaction. This result is consistent with the work of Alice Mija et al. that silica particles act as a catalytic in the epoxy ring-opening reaction, although the curing agent used in that study was m-phenylenediamine.18 Scheme 1 shows the proposed mechanism for the reaction between epoxy and anhydrides in the presence of silica nanoparticles.
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Fig. 2 Determination of the Ea values for epoxy/PEI (100![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() |
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Scheme 1 Proposed mechanisms for the reaction between epoxy and anhydrides in the presence of silica nanoparticles. |
Besides, as shown in Table 2, similar Tp and Ea were observed in the epoxy/PEI/SiO2 (100:
25
:
1) and epoxy/PEI/SiO2 (100
:
25
:
2) systems. The extent of silica content does not show a further coincident decrease of the peak temperature and activation energy of curing reaction. This may indicate that the aggregation of the silica particles occurred at higher loading content and only part of the Si–OH group work as an accelerator of the curing reaction.
In other words, the thermal stability of the epoxy/PEI systems is increased with the addition of MEK–ST silica. The changes of phase separation temperatures may be explained as followed. It is known that, there are border layers on the surface of the fillers, which differs with the polymer bulk. In this study, the hydroxyl groups on the silica surface induce the formation of the border layer. As Lipatov Y. S. et al.10,11 declared that the border layer will differ from the bulk in relation to the molecular weight distribution, due to preferential adsorption of the polymer fraction of higher molecular weight. In this case, DSC results show that the activation energy was decreased with the addition of MEK–ST silica because of the hydroxyl groups on the surface of the particle.17 As explained, the hydroxyl groups of silica surface self-participate the epoxy ring-opening reaction and accelerate the curing rate, therefore leading to a selective adsorption of the epoxy fraction of higher molecular weight and diminishing the molecular mobility of epoxy. As a result, the phase separation of the bulk occurs at a lower temperature in the MEK–ST silica-filled blends, meaning that the thermodynamics interaction of the bulk was changed. To further study the phase separation of the binary blends, the evolution of phase separation was studied by OM.
As mentioned, the studied epoxy/PEI blend is a dynamic asymmetric system. During the cure process, large differences occur in mobility between epoxy molecular and PEI. At the late stage of phase separation, the molar mass of epoxy increases, therefore the diffusion of epoxy molecules is not able to follow the growth of the size of the epoxy-rich domain. As a result, the secondary phase separation occurred. It is shown that the small droplets of epoxy-rich phase appear in the PEI-rich phase, or in the opposite way, seen in Fig. 4e. And as the same reason, the slow dynamic phase (PEI-rich phase) was fixed as a phase inversion structure despite of its lower proportion.
The evolution of phase structure was influenced by the addition of MEK–ST silica nanoparticles. It showed a similar microcontinuous phase structure (Fig. 5a) at the beginning of phase separation compared with the neat epoxy/PEI blend. However, during the curing reaction of epoxy molecules, the microcontinuous epoxy-rich phase coarsened and aggregated into anisotropic-shape domains quickly, which was shown as isolating dispersed epoxy-rich droplets in the PEI-rich matrix at phase separation time of 100 s (Fig. 5c). As followed, the size of the epoxy-rich domains increased till the chemical gelation of the epoxy. Compared to the neat epoxy/PEI blend, the extent of coarsening was suppressed by the MEK–ST silica nanoparticles (the microcontinuous phase was broken earlier and more isolated epoxy-rich droplets were formed).
For the dynamic asymmetric system (epoxy/PEI), Tanaka proposed that the effect of viscoelastic would play an important role in the phase separation and the diffusion of the fast dynamic phase (epoxy-rich phase) was prevented by the elastic force of the slow dynamic phase (PEI-rich phase). At the moment, dynamic asymmetric is the main driving force of the secondary phase separation.21 In this study, the hydroxyl groups of the silica nanoparticles participated the reaction between the anhydrides and epoxy molecules and restricted the molecular mobility of epoxy molecules, therefore slowing down the diffusion of the epoxy, which will be further demonstrated in TRLS experiments. Since that, the diffusion of epoxy molecules (fast dynamic phase) was even unable to follow the growth of the size of the epoxy-rich domain. Afterwards, the microcontinuous phase had to break into isolated droplets earlier, which grew slowly till the chemical gelation. As a result, the final phase separation morphology stopped at an earlier stage of inverted phase structure. Moreover, the secondary phase separations occurred as the same as in the neat PEI/epoxy blend.
Fig. 6 shows the PEI-rich droplet (black domain) dispersed in the epoxy-rich matrix (grey domain). And it seems that the MEK–ST silica nanoparticles prefer to be dispersed in the epoxy matrix, although showing the silica aggregation. This preferential location of silica nanoparticles is the result of that the hydroxyl group catalyzed curing reaction on the silica surface. The strong hydrogen bonding interaction between the hydroxyl groups on MEK–ST silica nanoparticles and the carbonyl groups of the Me-THPA-cured epoxy could also be the reason.
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Fig. 9 The scattering profiles of epoxy/PEI with 1 wt% MEK–ST silica (a and b) and 2 wt% (c and d) curing at 110 °C. |
As shown in Fig. 8, at the beginning of the curing process, qm shifted to a lower value and the light intensity increases, indicating that the reaction induced phase separation was initiated and the periodic structure size Λm grew. When the light intensity got to the maximum, a second peak at a higher scattering vector value appeared at about 200 s, which implied the occurrence of secondary phase separation. Afterwards, the scattering intensity of qm stopped increasing after 150 s and then began to decrease slightly before it finally became invariant, which resulted from the decrease in the difference of the reflection indices of the two phases.24 The profiles after 300 s kept similar since the final phase structure was fixed till the occurrence of chemical gelation. These results are in good agreement with the OM observations.
Fig. 9 showed the scattering profiles of epoxy/PEI with 1 wt% MEK–ST silica and 2 wt% curing at 110 °C. For the silica-filled epoxy/PEI (1 wt% MEK–ST silica), at the early stage of phase separation, it was same as the neat blend that qm shifted to lower value with a quick increase of light intensity. However, when the light intensity got to the maximum, a second peak at high scattering vector value appeared at the same time (46 s), which is much faster than the neat epoxy/PEI blend. Corresponding to the OM results (Fig. 5c and d), the secondary phase separation occurred after 50 s, showing that the number of the epoxy droplets gradually increased in the PEI-rich domain. In Fig. 9b, the qm got to a higher value with a quick increase of light intensity, meaning that the appearance of small particles made the average phase domain size decrease. When the content of MEK–ST silica was increased to 2 wt%, the morphology evolution was similar to that of epoxy/PEI/SiO2 (100/15/1) blend. But the onset time of the secondary phase separation was earlier (25 s) and the average periodic distance Λm was much smaller.
It is generally known that the increase of the domain size of the separated phase is mainly caused by the hydrodynamic forces and diffusion. And the phase growth can be analyzed with a power-law scaling equation. The position of the scattering ring, qmax(t), as a function of time, can be linked by the following equations:
qmax(t) ∝ t−α | (2) |
With regards to the TRLS results, the plots of the peak scattering vector, qmax, versus time t was shown in Fig. 10. The qmax follows the power law and the slope of logqmax versus log
t (power-law scaling coefficient α) are 0.77, 0.62, 0.47 for epoxy/PEI (100/25) without and with 1%, 2% MEK–SiO2, respectively. The scaling coefficient α varies from 0.47 to 0.77, which means that all systems are between diffusion-controlled and hydrodynamics-controlled. The α decreases significantly when the blend is filled with a certain amount of MEK–SiO2 nanoparticles, implying that the nanoparticles force coarsening mechanism towards the diffusion-controlled regime. That is to say, the migration of MEK–SiO2 nanoparticles to the epoxy-rich phase can lead to a concomitant reduction of the mobility of epoxy and then indeed slow down the diffusion of the fast dynamic phase (epoxy-rich phase).
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Fig. 10 The changes of peak scattering vector qm, versus time t: epoxy/PEI (100![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() |
Based on the above results, the significant effect of the MEK–SiO2 can be found in the epoxy/thermoplastic blend, which leads to a more complicated phase separation. The TRLS results show the secondary phase separations occur earlier in this silica-filled system compared to the neat blend. As discussed before, the main driving force of the secondary phase separation is the dynamic asymmetric of thermosetting/thermoplastic system, which is forced to more asymmetric because of the reduction of the diffusion of the fast dynamic phase. For that reason, the more diffusion-controlled regime makes the secondary phase separations occur earlier and the final morphology will be fixed at earlier time, showing an inverted structure (the component with high weight proportion as dispersed phase and the component with low weight proportion as matrix).
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