One-step transformation of Cu to Cu2O in alkaline solution

Jin You Zheng, Thanh-Khue Van, Amol U. Pawar, Chang Woo Kim and Young Soo Kang*
Korea Center for Artificial Photosynthesis(KCAP), Department of Chemistry, Sogang University, Seoul 121-742, South Korea. E-mail: yskang@sogang.ac.kr; Fax: +82-2-701-0967

Received 10th February 2014 , Accepted 10th April 2014

First published on 10th April 2014


Abstract

Cu can be directly transformed to Cu2O before forming CuO in high concentration NaOH aqueous solution by facile surface oxidation reaction without additional oxidant. By using different Cu substrates, pure Cu2O films with different dominant facets can be obtained.


Copper (Cu), an abundant and ductile metal element with very high electrical and thermal conductivity, has two oxides: cuprous oxide (Cu2O) and cupric oxide (CuO). Both of them are p-type semiconductors with narrow band gaps of 1.9–2.2 eV and 1.2–1.7 eV, respectively;1 they are good candidates for solar energy conversion photocatalysts, sensor materials, stable electron sources and optoelectronic device materials. Normally, CuO is dark color since it can absorb all of the visible light even in the infrared range. Although both of them as photocathode materials have poor chemical stabilities for water oxidation and reduction in aqueous solutions, CuO is more unstable than Cu2O because its redox potential of ECuO/Cu2O (+0.60 V vs. NHE) is more positive than the redox potential of ECu2O/Cu (+0.47 V vs. NHE);2 CuO will become Cu2O followed by Cu2O reduction to Cu. Therefore, Cu2O is more valuable than CuO in water splitting area and researchers have focused on improving the stability of Cu2O by depositing protective layers such as ZnO/Al2O3/TiO2.2

Many works have been done for the synthesis of copper oxides regardless of one intractable issue of chemical stability in electrolyte. The copper oxides/hydroxide (CuO, Cu2O and Cu(OH)2) and Cu can be transformed to one of them by different methods. Cu can be transformed to CuO and Cu2O by thermal oxidation at high temperature in oxygen atmosphere. Cu2O is stable at limited ranges of temperature and oxygen pressure and during thermal oxidation of Cu at atmospheric pressure, Cu2O can be transformed to CuO after a sufficient oxidation time.3 Musa et al.4 reported that the oxide layer resulting from oxidation at 1050 °C consist only of Cu2O and those grown below 1040 °C gave mixed oxides of Cu2O and CuO; they also observed that, in general, the lower temperature of oxidation is, the lower amount of Cu2O is formed. Choi's group5 also reported that Cu2O film can be converted to transparent CuO film by heating in air. For morphology control, CuO wires can also be easily synthesized by heating copper substrates such as Cu TEM grid, foil and conventional electrical wire, even the electrodeposited Cu particle films.1c,6 Wang's group7 reported the growth of a scroll-type nanotube structure of Cu(OH)2 arrayed on copper foil at ambient temperature and pressure by surface oxidation of the Cu foil in an alkaline aqueous solution with the oxidant (NH4)2S2O8. Later, Yat Li's group8 reported that the Cu(OH)2 nanowires obtained via the method mentioned above can be converted into Cu2O nanowires with a small fraction of CuO nanowires by thermal treatment at 450 °C for 1 h in air. Pike et al.9 have shown, using in situ time-resolved X-ray diffraction (TR-XRD), that bulk CuO was reduced directly to metallic Cu; and nanoscale CuO can be reduced completely to Cu2O by isothermal reduction.

As described above, Cu → Cu2O and/or CuO, Cu2O → CuO, Cu(OH)2 → Cu2O and CuO, CuO → Cu2O can be achieved by thermal oxidation or reduction. However, for the complete conversion of Cu to Cu2O it requires very high temperature.4 To the best of our knowledge, there are very few reports on the transformation of Cu to Cu2O under mild experimental conditions. The Cu surface can be electrochemically oxidized to Cu2O, CuO and Cu(OH)2 at different potentials in alkaline solution.10 However, the layer of Cu2O films was very thin. In addition, Allam and Grimes11 reported that the various copper oxide nanostructured thin films were synthesized by anodization of Cu foil in aqueous and non-aqueous electrolytes containing hydroxide, chloride and/or fluoride ions at room temperature. Chu et al.12 synthesized CuO crystals with different morphologies such as nanoplates, nanoribbons, nanowires, micro-polyhedrons, mat-like and chrysanthemum-like nanostructures via hydrothermal reactions with different types of surfactants and (NH4)2S2O8 in high concentration of NaOH aqueous solution (5.0 M). Liu et al.13 demonstrated a facile fabrication of flower-like and spherical CuO architectures on Cu substrates by immersing a Cu substrate into low concentrations (30.0 or 65.0 mM) of NaOH and NH3·H2O solutions at 60 °C. Very recently, Luo et al.14 showed that Cu2O polyhedrons can be directly grown from Cu foil in 0.3 M NaOH at 60 °C. Gao et al.15 have reported an introduction of Cu2O layer on Cu plate by immersing it into CuSO4 solution. To our surprise, there is no detailed report on the mechanism and process of synthesis and morphological control of pure Cu2O by simply immersing the different Cu substrates into NaOH solution. Herein, we report a facile process for transformation of Cu foil and Cu film1c to pure Cu2O layer and films without impurity of CuO or Cu(OH)2 in high concentration of NaOH aqueous solution without any surfactants and additives. On the factors influencing the Cu2O film formation, such as alkali concentration, temperature, reaction time and, especially, the most critical factor for Cu substrates with different dominant crystal facets have been discussed.

It is known that the relation of the surface energy (γ) of bulk face-centered cubic (fcc) metals is γ111 < γ100 < γ110.16 The relation of the surface energy of fcc Cu is also a decreasing order as γCu(111) < γCu(100) < γCu(110).17 Therefore, the different dominant facets of bulk fcc Cu in a solution will have different adsorption–desorption rate and chemical reaction rate. Herein, three different kinds of Cu foil and Cu/FTO film substrates, as their XRD patterns indexed as fcc-phase copper (JCPDS no. 65-9743) shown in Fig. 1(a) and 4(a2), were conducted for the experiments. The peak intensity ratios of I(111)/I(200) and I(220)/I(200) are 0.66 and 0.39 for Cu1, 0.04 and 0.13 for Cu2 and 2.92 and 0.52 for Cu/FTO, respectively. A typical experimental process of one-step transformation of Cu to Cu2O was conducted by immersion of Cu substrates in NaOH aqueous solution at 80 °C for 1 h and kept at room temperature (24 °C) during various aging times, such as 14 h, as shown in Scheme 1(a). After the reactions, the as-synthesized film was washed by deionized water, ethanol and then dried under N2 gas flow. The brownish red colored film was covered on the surface of Cu foil and the transparent film with darker orange color was formed on FTO glass as shown in Fig. 1(b). According to the description in ref. 12, 13 and 18, the possible reaction processes are given as following (see the detail explanation; ESI): Cu foil or Cu/FTO can continuously release Cu2+ ions into NaOH solution by the naturally-dissolved O2 oxidization

 
2 Cu + O2 + 2H2O → 2Cu2+ + 4OH (1)


image file: c4ra01174k-f1.tif
Fig. 1 (a) XRD patterns of two different copper foils (Cu1 and Cu2) with different intensity ratios of crystal facets; (b) the photographs to show the typical experimental processes of the one-step formation of Cu2O film on Cu foil and FTO coated glass surface by immersion in NaOH solution.

image file: c4ra01174k-s1.tif
Scheme 1 Schematic illustration of (a) the preparation process and (b) the growth mechanism.

Then, some of Cu+ ions can be produced by the process of

 
Cu2+ + Cu → 2Cu+ (2)

The maximum concentration of [Cu+] is determined by the equation of

 
log[thin space (1/6-em)][Cu+]max = −0.84 – pH (ref. 18c) (3)

If the real concentration of Cu+ exceeds the [Cu+]max given by eqn (3), the following process will be done.

 
2Cu+ + 2OH → Cu2O + H2O (4)

This process is similar to that Cu2+ ions can be reduced to Cu+ ions by Cu plate then form Cu2O layer on Cu surface through in situ redox reaction according to eqn (5) in the ref. 15.

 
Cu2+ + Cu + H2O → Cu2O + 2H+ (5)

The transformation of Cu to Cu2O in our experiment can be carried out by the net reaction as follows:

 
4Cu + O2 → 2Cu2O (6)

In summary, we present a growth mechanism of Cu2O from Cu in high concentration alkaline solution with 5 steps as shown in Scheme 1(b). Step 1, the O2 in air is dissolved in alkaline solution. Step 2, the dissolved O2 is adsorbed on the surface of Cu. Steps 3, the Cu atoms in surface are oxidized to Cu2+ ions by the adsorbed O2 as the reaction (1). Step 4, the Cu2+ ions can be reduced to Cu+ ions by neighboring Cu atoms during very short time as the reaction (2). Step 5, the Cu+ ions will react with OH in solution to form Cu2O nucleation sites and H2O molecules are released from the Cu surface as the reaction (4). The obtained Cu2O nucleation sites will grow according to reaction time. Finally, the nano/micro-sized Cu2O crystals can be formed. In the whole Cu2O growth process, steps 3 to 5 are happened in situ on Cu surface. The step 2 is a key to open the next reactions, which depends on the adsorption of O2 by Cu surface. Therefore, the surface property of Cu substrate is a critical factor for the experiment.

The XRD pattern of Cu2O/Cu1 can be fully indexed to a pure cubic phase with space group of Pn[3 with combining macron]m (no. 224) of Cu2O (JCPDS no. 65-3288) except the peaks of Cu1 substrate as shown in Fig. 2(a). The physicochemical properties of crystals such as adsorption, catalytic reactivity and selectivity etc., significantly depend on the surface atomic configuration and the degree of exposure of reactive crystal facet.19 The dominant crystal facet of Cu2O/Cu1 is (111). The corresponding SEM image as shown in Fig. 2(b) indicates that the compact and homogenous Cu2O octahedrons particle film is covered on the Cu1 foil. The low magnification SEM images, TEM image and SEAD pattern in Fig. S1 (ESI) further demonstrate that the Cu2O octahedron film with the average particle size of less than 1.5 μm is in large area scale and the particles are single crystalline. Since the surface energy order is γCu(111) < γCu(100) < γCu(110) as previously stated, the Cu1 with high I(111)/I(200) needs longer reaction time (3 days) to form regular Cu2O octahedron film.


image file: c4ra01174k-f2.tif
Fig. 2 (a) XRD pattern and (b) SEM image of Cu2O/Cu1 obtained by adding Cu1 foils in 20 ml 4 M NaOH aqueous solution followed by heating at 80 °C for around 1 h and then kept at room temperature for 4 days.

In contrast, it is assumed that the Cu substrate with very low I(111)/I(200) should have shorter reaction time to form Cu2O film by immersion in NaOH aqueous solution. To verify the assumption, the Cu2 substrates were used for experiments. The Cu2 foil was immersed in a 4.0 M hot NaOH aqueous solution of 80 °C and then kept at room temperature for 14 h. As shown in Fig. 3(a), the compact imperfect 26-facet polyhedral architecture (a perfect one with exposed 8 {111}, 6 {100} and 12 {110} facets as the inset shown in Fig. 3(a)) was obtained.20 The size of particles is in the range of several microns and the thickness of film is ca. 3.5 μm as shown in Fig. S2 (ESI). The {110} facets are exposed inhomogeneously. The dominant facet is {200} as shown in XRD pattern of Fig. 3(b). The purity of the as-obtained Cu2O was further identified by X-ray photoelectron spectroscopy (XPS). Normally, the CuO and Cu(OH)2 can be characterized by intense Cu(2p) XPS shake-up satellites and a broad O(1s) peak; Cu2O and metallic Cu show weaker/no Cu(2p) satellites and a narrower O(1s) peak.21


image file: c4ra01174k-f3.tif
Fig. 3 (a) SEM image, (b) XRD pattern and XPS spectra of (c) Cu2p and (d) O1s, (e) photocurrent and photoresponse curves under 1 sun illumination of Cu2O/Cu2 obtained by adding Cu2 foils in 20 ml 4.0 M NaOH solution with initial temperature of 80 °C and then kept at room temperature for 14 h. (f) SEM images of Cu2O/Cu2 after checking (e). The inset in (a) is a perfect 26-facet polyhedral architecture with exposed {111} × 8, {100} × 6 and {110} × 12 facets. The inset of (f) is the photograph of Cu2O/Cu2 film after checking (e).

Unfortunately, it is difficult to distinguish the Cu2O and the metallic Cu by XPS since their Cu(2p) binding energies are similar.22 However, herein, we just need to ensure non-existences of CuO and Cu(OH)2 by XPS. Some very weaker shake-up satellites peaks rather than intense satellites peaks indicate that there is no impurities of CuO and Cu(OH)2 in our samples as shown in Fig. 3(c). Considering the depth of detection of XPS (∼1 to 10 nm), the peaks of Cu(2p3/2) at 932.6 eV and Cu(2p1/2) at 952.4 eV can be attributed to Cu2O.22 The corresponding O(1s) XPS spectra show two peaks at 530.3 and 531.5 eV, attributed to Cu2O and surface hydroxide (–OH).23 The surface hydroxide comes from the adsorbed and/or residual NaOH on the surface of Cu2O. The pure Cu2O crystals can also be obtained by immersing Cu2 foils at different concentrations of NaOH solution even at room temperature (24 °C) as shown in Fig. S3 and S4. At low concentration (2.0 M), the size of particles is relatively decreased; when the concentration was increased, the films become loose and sparse. At room temperature, the Cu2O particles are much irregular and cannot be formed at very high concentration (8.0 M). The Cu2O/Cu can be further oxidized to CuO/Cu as the immersion time was extended as shown in Fig. S5. In general, the products can be affected by several parameters such as temperature, NaOH concentration and reaction time.

The photoelectrochemical photocurrent switching (PEPS) effect,1c,24 which can switch photocurrent polarity by changing photoelectrode potential, was observed with Cu2O/Cu2 sample as shown in Fig. 3(e). The cathodic photocurrent gradually decreases as the applied potential is swept from −0.7 V to the positive direction and is converted to anodic photocurrent at −0.48 V. Herein, the performance of the current-potential under chopped light illumination indicates that Cu/Cu2O and Cu2O/electrolyte Schottky type junctions exist in the Cu/Cu2O/electrolyte system. Similar results have been investigated earlier in the Ti/Cu2O/electrolyte,25 ITO/Cu2O/electrolyte26 and ITO/Cu2O/CuxS27 systems. When the potential is in the range of −0.7 to −0.48 V, the Cu/Cu2O junction is dominant and therefore a p-type photosignal (cathodic photocurrent) is produced; when the potential is in the range of −0.48 to +0.1 V, the Cu2O/electrolyte junction becomes dominant and therefore a n-type photosignal (anodic photocurrent) is obtained.25 The anodic and cathodic photocurrents were observed by photoresponses at 0 V and −0.6 V, respectively, as the inset in Fig. 3(e). The cathodic photocurrent decreased gradually as time was increased under −0.6 V. It indicates that the film is not so stable. After the photocurrent and photoresponse checking, the color of the surface of film, which was exposed in electrolyte, was changed to dark as shown in the inset in Fig. 3(f); it indicates that Cu2O was reduced to Cu on the surface as a similar result reported by Paracchine et al.2 As shown in the SEM image in Fig. 3(f) and S6 (ESI), the {110} crystal facets are partially dissolved while the others are stable. Many nano-sized Cu particles are deposited onto the {111} facets. This process is a decomposition–redeposition process. The relative surface energies of Cu2O crystals are in the order of γ{111} < γ{100} < γ{110} and the order of photocatalytic activity of facets in Cu2O is {110} > {111} > {100}.28 Therefore, the {110} facet possesses the highest surface energy and is the most photoactive facet here. The {110} should be the most active facet for the reaction such as water splitting under light illumination. However, the {110} facet is the most unstable facet. For comparison, the Cu/FTO substrate with high I(111)/I(200) ratio of 2.92 was chosen for experiment. After 5 day immersion, the Cu films can be completely transformed to Cu2O as the XRD patterns shown in Fig. 4(a). The dominant crystal facet is (111). However, the film is composed of crystals of irregular polyhedron particles as shown in Fig. 4(b). The Cu2O/FTO is not perfect because the Cu/FTO is composed of Cu particles rather than continuous and compact film as shown in Fig. S7 (ESI).


image file: c4ra01174k-f4.tif
Fig. 4 (a) XRD patterns of (a1) bared FTO, (a2) Cu/FTO and (a3) Cu2O/FTO; (b) SEM image of Cu2O/FTO obtained by immersing Cu/FTO substrate into 20 ml 4.0 M NaOH solution followed by heating at 80 °C for around 1 h and then kept at room temperature for 5 days.

To show further potential applications, the hydrophobicity properties of two kinds of Cu2O films in Fig. 2(b) and 3(a) were tested via water contact angle as shown in Fig. 5. It is found that the surfaces of Cu1 (Fig. 5(a)) and Cu2 (Fig. 5(c)) substrates are hydrophobic with similar water contact angle of 96.8 ± 3° and 92.7 ± 3°, respectively. After formed Cu2O film on the surface of Cu substrates, the surface of Cu2O/Cu1, with water contact angle of 125.6 ± 2°, is more hydrophobic than the bare Cu1 substrate. In contrast, the Cu2O/Cu2 presents hydrophilic property with water contact angle of 64.6 ± 2°. In theory, the hydrophobic solid surface has low surface energy and the hydrophilic solid surface has high surface energy. Since the relative surface energies of Cu2O crystals are in the order of γ{111} < γ{100}, the water contact angle of Cu2O/Cu1 film with dominant {111} facets should be larger than that of Cu2O/Cu2 film with dominant {100} facets. This is matched with the experimental results regardless of the other factors such as the morphology and the surface adsorption.


image file: c4ra01174k-f5.tif
Fig. 5 Contact angle measurement results of (a) bare Cu1 foil, (b) Cu2O/Cu1 film, (c) bare Cu2 foil and (d) Cu2O/Cu2 film.

In summary, Cu can be directly transformed to Cu2O before the formation of CuO in high concentrated NaOH aqueous solution by facile immersion process without any additional oxidant. According to the different type of Cu substrates, the different dominant Cu2O films can be obtained. The process of Cu oxidation in high concentration of aqueous NaOH is from Cu to Cu2O, and then Cu2O to CuO as the immersion time is prolonged. Further work will be reported for the better understanding of the mechanism of growth in the following report. However, this work gives a good way to convert Cu particle or Cu film to crystalline Cu2O particle or film and it can be a facile way to synthesize Cu2O films.

Acknowledgements

This work was supported by the Korea Center for Artificial Photosynthesis (KCAP) located in Sogang University funded by the Minister of Science, ICT and Future Planning (MSIP) through the National Research Foundation of Korea (no. 2009-0093885), and the Brain Korea 21 Plus Project 2014.

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Footnote

Electronic supplementary information (ESI) available: Experimental details and characterization (Fig. S1–S7). See DOI: 10.1039/c4ra01174k

This journal is © The Royal Society of Chemistry 2014