Laser writing of a TiVC film for high rate supercapacitors with ultrahigh capacitance

Abstract

To overcome the layer stacking effect in TiVC films, a laser writing technique was applied. With optimized laser power, an interlayer expansion of 23 times was achieved without compromising the structural integrity. This structural modification effectively facilitates ion transport while preserving the intrinsic high capacity of TiVC. As a result, the electrode retained 42.7% of its capacitance at an ultrahigh scan rate of 1000 mV s⁻¹, demonstrating an exceptional combination of high capacity and outstanding rate performance.