Texture-structure-based liquid metal filling for blind-end microchannels and its application on multi-layer chips

Abstract

This research work reports a novel method to achieve fast liquid metal (LM) injection in blind-end microchannels which is especially suitable for multi-layer microfluidic chips. This method is based on a texture-like surface bonding technology. The texture-like surface is fabricated on a polydimethylsiloxane (PDMS) slab with standard soft-lithography technology and bonded with another PDMS slab with microelectrode patterns on it. When injected with LM, the texture-like structure can prevent the LM from entering but allows the air inside to be released during the injection to achieve perfect blind-end complex LM electrodes. The experimental results show that it can achieve fast and perfect LM injection in the blind-end pattern and can also prevent the large area of the flat chamber from collapsing during bonding. We also parametrically studied the texture structure's size for bonding strength between the texture structure and the blank PDMS surface. In addition, we integrate three layers of blind-end complex liquid metal patterns into one multi-layer chip using this technology and later use this structure to realize series connection of two LM-based electroosmotic micropumps (EOP). Compared with the conventional LM-based EOP, the structure of the EOP chip was greatly simplified and resulted in a higher level of integration.