Issue 24, 2019

Stirring revealed new functions of ethylenediamine and hydrazine in the morphology control of copper nanowires

Abstract

Cu nanowires, as promising candidates in many fields because of their merits, are commonly prepared by the solution phase based synthesis which is a simple and scalable method. However, precise control of the morphology, particularly surface roughness, of Cu nanowires is still challenging; and moreover, detailed formation mechanisms of Cu nanowires, in solution phase based synthesis, are still unclear. We here show the morphology manipulation of Cu nanowires by adjusting the stirring rate and the amounts of ethylenediamine and hydrazine (N2H4), yielding Cu nanowires with either smooth or rough surface. Importantly, according to our experimental results and theoretical investigation, new functions of ethylenediamine and N2H4 are found, and a growth process of Cu nanowires is proposed accordingly. In addition to typically accepted roles of ethylenediamine and N2H4, we find that ethylenediamine can facilitate the growth of Cu nanowires by etching Cu oxides and even Cu on the surface of Cu nanowires. Meanwhile, N2H4 molecules can modulate the growth of Cu nanowires as a capping agent, which can be easily influenced by stirring. Additionally, the as-synthesized Cu nanowires with different morphologies exhibit different optical and catalytic properties. This study provides new fundamental insights into the growth mechanism of Cu nanowires, and thus can facilitate controlled synthesis of Cu nanowires for further applications, including electronics, catalysis, and sensing.

Graphical abstract: Stirring revealed new functions of ethylenediamine and hydrazine in the morphology control of copper nanowires

Supplementary files

Article information

Article type
Paper
Submitted
17 Feb 2019
Accepted
26 May 2019
First published
27 May 2019

Nanoscale, 2019,11, 11902-11909

Stirring revealed new functions of ethylenediamine and hydrazine in the morphology control of copper nanowires

J. Zhang, X. Li, D. Liu, S. Wang, J. Yan, M. Lu, X. Xie, L. Huang and W. Huang, Nanoscale, 2019, 11, 11902 DOI: 10.1039/C9NR01470E

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