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Issue 12, 2013
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Rapid bonding of polydimethylsiloxane to stereolithographically manufactured epoxy components using a photogenerated intermediary layer

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Abstract

We describe a low cost, photo-induced, room-temperature bonding technique for bonding epoxy components to flexible PDMS membranes in less than half an hour. Bond strengths (∼350 kPa) were characterized by ISO-conform tensile testing for a popular stereolithography resin and found comparable bond strengths as reported for PDMS/PDMS bonds.

Graphical abstract: Rapid bonding of polydimethylsiloxane to stereolithographically manufactured epoxy components using a photogenerated intermediary layer

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Publication details

The article was received on 14 Mar 2013, accepted on 17 Apr 2013 and first published on 18 Apr 2013


Article type: Communication
DOI: 10.1039/C3LC50341K
Citation: Lab Chip, 2013,13, 2268-2271
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    Rapid bonding of polydimethylsiloxane to stereolithographically manufactured epoxy components using a photogenerated intermediary layer

    E. Wilhelm, C. Neumann, K. Sachsenheimer, T. Schmitt, K. Länge and B. E. Rapp, Lab Chip, 2013, 13, 2268
    DOI: 10.1039/C3LC50341K

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