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Pressure-sensitive adhesive powder

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Corresponding authors
a
Department of Applied Chemistry, Faculty of Engineering, Osaka Institute of Technology, 5-16-1, Omiya, Asahi-ku, Osaka 535-8585, Japan
E-mail: syuji.fujii@oit.ac.jp
b
Physics at Interfaces, Max-Planck Institute for Polymer Research, Ackermannweg 10, D-55128 Mainz, Germany
c
Nanomaterials Microdevices Research Center, Osaka Institute of Technology, 5-16-1, Omiya, Asahi-ku, Osaka 535-8585, Japan
Mater. Horiz., 2016,3, 47-52

DOI: 10.1039/C5MH00203F
Received 10 Sep 2015, Accepted 02 Oct 2015
First published online 05 Oct 2015
This article is licensed under a Creative Commons Attribution 3.0 Unported Licence.
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