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Issue 10, 2012
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Thermal fingerprint of silica encapsulated phase change nanoparticles

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Abstract

This paper describes a new type of silica microspheres that contain a panel of phase change nanoparticles (Field's alloy, indium, tin or lead–tin eutectic alloy). The thermophysical properties of solid–liquid phase change nanoparticles, i.e., composition-dependent melting temperatures, sharp melting peaks, and large thermal scan range, allow construction of a large number of silica microspheres that have thermally distinguishable patterns of melting temperatures.

Graphical abstract: Thermal fingerprint of silica encapsulated phase change nanoparticles

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Publication details

The article was received on 11 Jan 2012, accepted on 06 Mar 2012 and first published on 13 Mar 2012


Article type: Paper
DOI: 10.1039/C2NR30092C
Citation: Nanoscale, 2012,4, 3237-3241
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    Thermal fingerprint of silica encapsulated phase change nanoparticles

    C. Wang, Y. Hong, M. Zhang, M. Hossain, Y. Luo and M. Su, Nanoscale, 2012, 4, 3237
    DOI: 10.1039/C2NR30092C

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