Jump to main content
Jump to site search
PLANNED MAINTENANCE Close the message box

Scheduled maintenance upgrade on Thursday 4th of May 2017 from 8.00am to 9.00am (BST).

During this time our websites will be offline temporarily. If you have any questions please use the feedback button on this page. We apologise for any inconvenience this might cause and thank you for your patience.


Issue 10, 2012
Previous Article Next Article

Thermal fingerprint of silica encapsulated phase change nanoparticles

Author affiliations

Abstract

This paper describes a new type of silica microspheres that contain a panel of phase change nanoparticles (Field's alloy, indium, tin or lead–tin eutectic alloy). The thermophysical properties of solid–liquid phase change nanoparticles, i.e., composition-dependent melting temperatures, sharp melting peaks, and large thermal scan range, allow construction of a large number of silica microspheres that have thermally distinguishable patterns of melting temperatures.

Graphical abstract: Thermal fingerprint of silica encapsulated phase change nanoparticles

Back to tab navigation
Please wait while Download options loads

Publication details

The article was received on 11 Jan 2012, accepted on 06 Mar 2012 and first published on 13 Mar 2012


Article type: Paper
DOI: 10.1039/C2NR30092C
Citation: Nanoscale, 2012,4, 3237-3241
  •   Request permissions

    Thermal fingerprint of silica encapsulated phase change nanoparticles

    C. Wang, Y. Hong, M. Zhang, M. Hossain, Y. Luo and M. Su, Nanoscale, 2012, 4, 3237
    DOI: 10.1039/C2NR30092C

Search articles by author