Issue 10, 2023

3D printed microstructured ultra-sensitive pressure sensors based on microgel-reinforced double network hydrogels for biomechanical applications

Abstract

Hydrogel-based wearable flexible pressure sensors have great promise in human health and motion monitoring. However, it remains a great challenge to significantly improve the toughness, sensitivity and stability of hydrogel sensors. Here, we demonstrate the fabrication of hierarchically structured hydrogel sensors by 3D printing microgel-reinforced double network (MRDN) hydrogels to achieve both very high sensitivity and mechanical toughness. Polyelectrolyte microgels are used as building blocks, which are interpenetrated with a second network, to construct super tough hydrogels. The obtained hydrogels show a tensile strength of 1.61 MPa, and a fracture toughness of 5.08 MJ m−3 with high water content. The MRDN hydrogel precursors exhibit reversible gel–sol transitions, and serve as ideal inks for 3D printing microstructured sensor arrays with high fidelity and precision. The microstructured hydrogel sensors show an ultra-high sensitivity of 0.925 kPa−1, more than 50 times that of plain hydrogel sensors. The hydrogel sensors are assembled as an array onto a shoe-pad to monitor foot biomechanics during gaiting. Moreover, a sensor array with a well-arranged spatial distribution of sensor pixels with different microstructures and sensitivities is fabricated to track the trajectory of a crawling tortoise. Such hydrogel sensors have promising application in flexible wearable electronic devices.

Graphical abstract: 3D printed microstructured ultra-sensitive pressure sensors based on microgel-reinforced double network hydrogels for biomechanical applications

Supplementary files

Article information

Article type
Communication
Submitted
11 5月 2023
Accepted
25 7月 2023
First published
26 7月 2023

Mater. Horiz., 2023,10, 4232-4242

3D printed microstructured ultra-sensitive pressure sensors based on microgel-reinforced double network hydrogels for biomechanical applications

J. Zheng, G. Chen, H. Yang, C. Zhu, S. Li, W. Wang, J. Ren, Y. Cong, X. Xu, X. Wang and J. Fu, Mater. Horiz., 2023, 10, 4232 DOI: 10.1039/D3MH00718A

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