Issue 43, 2016

Selective metallization of alumina ceramics by inkjet printing combined with electroless copper plating

Abstract

A convenient and efficient approach for selective metallization of alumina ceramics has been developed. The Ag+-bearing ink was firstly inkjet-printed on alumina ceramics to create catalytic activating layers for subsequent electroless copper plating (ECP), and then ECP was initiated to fabricate the desirable conductive patterns. A continuous copper layer with dense packing could be obtained by controlling the electroless plating process. A low resistivity of about 2.37 μΩ cm of the copper layer was achieved, which was only about 1.4 times higher than that of bulk copper. Moreover, such a copper layer exhibited satisfactory solderability, reliable adhesion to substrates and good stability in an ambient atmosphere. This approach proposed a potential way to realize surface metallization on ceramic substrates without high temperature and any sophisticated equipment.

Graphical abstract: Selective metallization of alumina ceramics by inkjet printing combined with electroless copper plating

Article information

Article type
Paper
Submitted
02 八月 2016
Accepted
10 十月 2016
First published
10 十月 2016

J. Mater. Chem. C, 2016,4, 10240-10245

Selective metallization of alumina ceramics by inkjet printing combined with electroless copper plating

J. Chen, Y. Guo, Y. Wang, J. Zhang, H. Li and Z. Feng, J. Mater. Chem. C, 2016, 4, 10240 DOI: 10.1039/C6TC03315F

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