Facile preparation of a high-quality copper layer on epoxy resin via electroless plating for applications in electromagnetic interference shielding

Yan Wang, Li-juan Ni, Fan Yang, Fu-qiang Gu, Kun Liang, Kyle Marcus, Ya-dong Wan, Jin-ju Chen and Zhe-sheng Feng

J. Mater. Chem. C, 2017, 5, 12769
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Selective Ru ALD as a Catalyst for Sub-Seven-Nanometer Bottom-Up Metal Interconnects

Ivan Zyulkov, Mikhail Krishtab, Stefan De Gendt and Silvia Armini

ACS Appl. Mater. Interfaces, 2017, 9, 31031
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Single-step selective metallization on insulating substrates by laser-induced molten transfer

Shujia Xu, Lei Ren, Bin Liu, Jiarui Wang, Biao Tang, Wei Zhou and Lelun Jiang

Applied Surface Science, 2018, 454, 16
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Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers

Yousef Farraj, Michael Layani, Avi Yaverboim and Shlomo Magdassi

Adv Materials Inter, 2018, 5
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Interface structure and macroscale performance trade-offs in hydrogen-reduced Cu/Al2O3 electronic packaging: An integrated experimental and DFT study on time-dependent interfacial engineering

Yunjia Hu, Renli Fu, Guoping Bei, Xiumei Li, Zhenguo Wang, Guangming Liu and Bingjie Xie

Journal of the European Ceramic Society, 2026, 46, 117926
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Assessment and improvement of adhesion of printed silver-based inks on alumina produced by fused filament fabrication

Daniel Utsch, Marcel Sippel, Christian Voigt, Felix Häußler and Jörg Franke

Power Electronic Devices and Components, 2024, 8, 100067
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3D Structural Strengthening Urchin‐Like Cu(OH)2‐Based Symmetric Supercapacitors with Adjustable Capacitance

Peng Chang, Hui Mei, Yu Zhao, Weizhao Huang, Shixiang Zhou and Laifei Cheng

Adv Funct Materials, 2019, 29
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Photocatalysis electroless plating of copper pattern on Al2O3 ceramic substrate combined with template shape control method

Min Liu and Xuefeng Liu

Ferroelectrics, 2018, 529, 1
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Laser-Induced Selective Metallization on Polymer Substrates Using Organocopper for Portable Electronics

Jihai Zhang, Jin Feng, Liyang Jia, Huiyuan Zhang, Gaixia Zhang, Shuhui Sun and Tao Zhou

ACS Appl. Mater. Interfaces, 2019, 11, 13714
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Nano-silver Doped Zinc Oxides Adhesion Layer for Wet Copper Metallization of Glass Substrates

Le Xu, Guo-Liang Liu, Hao-Wen Zhang, Yan Wang and Zhe-Sheng Feng

J. Electrochem. Soc., 2025, 172, 012507
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Fabrication of Flexible Microneedle Array Electrodes for Wearable Bio-Signal Recording

Lei Ren, Shujia Xu, Jie Gao, Zi Lin, Zhipeng Chen, Bin Liu, Liang Liang and Lelun Jiang

Sensors, 2018, 18, 1191
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Self-activating metal-polymer composites for the straightforward selective metallization of 3D printed parts by stereolithography

Caterina Credi, Roberto Bernasconi, Marinella Levi and Luca Magagnin

Journal of Materials Research and Technology, 2023, 22, 1855
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Multi-parameter synergistic optimization and sintering densification of EHD-printed silver nanoparticle ink on alumina ceramic substrates

Yulong Li, Jinke Tian, Ruijie Hao, Feng Ding, Haoyue Wu, Wei Lin, Jinhua Hong, Min Lei and Xuewen Li

Soldering & Surface Mount Technology, 2026, 1
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The design of nano-porous photocatalytic intermediate layer to fabricate the copper layer on AlN ceramic with high bonding strength through the interlocking microstructure

Jifan Yang, Yuxuan Yang, Fei Long, Xuan Li, Fei Sun, Chenhao Qian, Xinyu Yan, Tong Zhou and Lei Liu

Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2024, 703, 135140
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Copper bonding silicon nitride substrate using atmosphere plasma spray

Guanghua Liu, Dan Wang, Yan Xing, Xiqiang Zhong and Wei Pan

Journal of the European Ceramic Society, 2023, 43, 3981
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Selective metallization of piezoelectric ceramics by laser-induced surface modification combined with electroless copper plating

Seung Ho Han, Bo-Young Kim, Jae Kwang Lee, Intae Seo, Hyung-Won Kang and Myong Jae Yoo

Ceramics International, 2022, 48, 9998
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Surface resistivity and bonding strength of atmosphere plasma sprayed copper‐coated alumina substrate

Guanghua Liu, Xiqiang Zhong, Yan Xing, Tianjun Li and Wei Pan

J. Am. Ceram. Soc., 2021, 104, 1193
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Photosensitive polyimide enabled simple, reversible and environmentally friendly selective metallization on diverse substrates

Wei Jie Mo, Ze Ping Zhang, Min Zhi Rong and Ming Qiu Zhang

Applied Materials Today, 2024, 38, 102159
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A facile process combined with roll-to-roll flexographic printing and electroless deposition to fabricate RFID tag antenna on paper substrates

Yan Wang, Yan Huang, Yun-ze Li, Pan Cheng, Si-yuan Cheng, Qingle Liang, Zhao-quan Xu, Hai-jun Chen and Zhe-sheng Feng

Composites Part B: Engineering, 2021, 224, 109194
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Regulation of bonding strength and activation mechanism of laser-induced metallization on Al2O3 ceramic surface

Kun Xu, Yang Sun, Yu Chang, Xingteng Lu, Jianguo Liu, Kun Liu, Ningzhong Huang, Zhaoyang Zhang, Hao Zhu, Dongqiang Li, Jingtao Wang, Yang Liu and Sishui Liu

Ceramics International, 2025, 51, 56440
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Graphene Conformal‐Coated Ceramics in Arbitrary Shape Targeting Smart Widgets

Lifang Tan, Jiangli Han, Junlai Zuo, Ke Huang, Jilei Chen, Chenxiao Wang, Wenjing Lu and Lei Fu

Adv Materials Inter, 2017, 4
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Laser assisted surface activation and selective copper metallization for ceramic substrates: a review

Yadi Wang, Shufeng Sun, Xingbo Zhang, Jin Wang, Fengyun Zhang, Tao Wei, Pingping Wang, Peter Monka and Harith Bin Ahmad

Optics & Laser Technology, 2025, 192, 114106
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Low temperature brazing between pre-metallized ZrO2 ceramics and medical pure titanium using AuSn20 filler metal

Nan Jiang, Hong Bian, Jiachen Li, Xiaoguo Song, Yuzhen Lei, Weimin Long, Hongwei Niu and Yinyin Pei

Vacuum, 2022, 206, 111537
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Highly thermally conductive, superior flexible and surface metallisable boron nitride paper fabricated by a facile and scalable approach

Hua Xiao, Ze Ping Zhang, Zi Xin Huang, Min Zhi Rong and Ming Qiu Zhang

Composites Communications, 2021, 23, 100584
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Design of metallization layers for PZT piezoelectric ceramics and joining to 4J29 Kovar alloy

Bo Zhou, Ziyan Zhao, Hui Zhang, Xuejian Liu, Zhengren Huang and Yan Liu

Journal of Alloys and Compounds, 2024, 986, 174131
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Electroless silver plated flexible graphite felt prepared by dopamine functionalization and applied for electromagnetic interference shielding

Yun Mao, Shengqi Zhang, Wei Wang and Dan Yu

Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2018, 558, 538
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