Issue 6, 2019
From the journal:

Chemical Society Reviews

Materials chemistry in flexible electronics

Xiaodong Chen,a   John A. Rogers,bcd   Stéphanie P. Lacour,e   Wenping Huf  and  Dae-Hyeong Kimgh  

a Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore
E-mail: chenxd@ntu.edu.sg

b Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA

c Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, USA

d Departments of Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical Engineering, and Computer Science, Simpson Querrey Institute for Nano/Biotechnology, Northwestern University, Evanston, Illinois 60208, USA
E-mail: jrogers@northwestern.edu

e Bertarelli Foundation Chair in Neuroprosthetic Technology, Laboratory for Soft Bioelectronic Interfaces, Institute of Microengineering, Institute of Bioengineering, Centre for Neuroprosthetics, École Polytechnique Fédérale de Lausanne (EPFL), 1202 Geneva, Switzerland
E-mail: stephanie.lacour@epfl.ch

f Tianjin Key Laboratory of Molecular Optoelectronic Science, Department of Chemistry, School of Science, Tianjin University & Collaborative Innovation Center of Chemical Science and Engineering (Tianjin), Tianjin 300072, China
E-mail: huwp@tju.edu.cn

g Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, Republic of Korea

h Institute of Chemical Processing (ICP), Seoul National University, Seoul 08826, Republic of Korea
E-mail: dkim98@snu.ac.kr

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Article information

DOI
https://doi.org/10.1039/C9CS90019E
Article type
Editorial
Submitted
25 Лют 2019
First published
08 Бер 2019

Chem. Soc. Rev., 2019,48, 1431-1433

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Materials chemistry in flexible electronics

X. Chen, J. A. Rogers, S. P. Lacour, W. Hu and D. Kim, Chem. Soc. Rev., 2019, 48, 1431 DOI: 10.1039/C9CS90019E

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