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Synthesis of High-Performance Colorless Polyimides with Asymmetric Diamine: Application in Flexible Electronic Devices

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Fluorinated Colorless Polyimides with High Heat-resistance and Low Birefringence

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Hot‐Pressing/Salt‐Leaching Method Assisted by Boronic Ester Dynamic Bond to Prepare Vitrimer Foams with Ultra‐Low Relative Permittivity and Superhydrophobic Performance

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Achieving an Ultralow-κ yet Strong and Transparent Film by Antisolvent-Confined Nanowelding of Electrospun Polyimide Nanofibers

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Effects of rigid end-capped groups on the structure and properties of colorless polyamide-imide films

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Comprehensive advantages of colorless, transparent, and thermally stable aromatic polyimides via fluorinated terphenyl dianhydride

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Comprehensive properties study of polyimide with fluorinated nanofillers

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Effect of Diamine Monomers with Varied Backbone Structures on Dielectric and Other Comprehensive Properties of Fluorinated Polyimide Films

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Low dielectric constant of soluble polyimides containing diisopropyl, trifluoromethyl, and methyl structures

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Intrinsic low-dielectric Cardo polyimide with high heat resistance, high transparency, and low birefringence

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Intrinsic low dielectric thermally crosslinked fluorinated polystyrene siloxanes at high frequency with good thermostability and optical properties

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Cross-linked porous polyarylene ether nitrile films with ultralow dielectric constant and superior mechanical properties

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Graft Architectured Poly(phenylene oxide)-Based Flexible Films with Superior Dielectric Properties for High-Frequency Communication Above 100 GHz

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Freely Tailorable Yolk‐Shell Encapsulation: Versatile Applications in Ultralow‐k Dielectric, Drug Delivery Systems, and Catalysts

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Polymer-based low dielectric constant and loss materials for high-speed communication network: Dielectric constants and challenges

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Acyloxy-Containing Fluorene- and Benzimidazole-Based Polyimides with Improved Solubility, Transparency, and Dielectric Properties by Postmodification

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A facile in‐situ fabrication of black polyimide films with ultrahigh electrical properties

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Decoding high-frequency dielectric loss of Poly(ester imide)s: Molecular simulation and experiment validation

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Synchronous improvement in mechanical properties and dielectric performance of poly(silylene arylether arylacetylene) by introducing trifluoromethyl groups

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Intrinsically Low Dielectric Constant and Low Dielectric Loss Polyimides Enabled by Rigid-Soft Structure

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Monomer ratio‐controlled polyimides with enhanced dielectric properties and thermal stabilities through crosslinking network

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High-frequency 5G substrate: Low dielectric biphenyl polyimide with low CTE and high thermal stability

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The influence of diamine structure on low dielectric constant and comprehensive properties of fluorinated polyimide films

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In Situ Preparation of Siloxane-Linked Colorless Polyimides with Low Dielectric Constant

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Transparent polyimides derived from phenyl group substituted 2,2′-bis(trifluoromethyl)benzidines with low dielectric constant at high frequencies

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Preparation and dielectric properties research of a novel kind of intrinsic silane-containing polyimide

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Crown Ether Copolymerized Polyimide Film: Enhanced Mechanical, Thermal Properties and Low Dielectric Constant under High Frequency

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Optimizing the Charge Transfer Complex Structure of Polyimides with Fluorinated Side Biphenyl for Superior High‐Temperature Capacitive Performance

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Preparation of hollow mesoporous silica/polyimide composite films and study of their properties

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A strategy to prepare low-temperature curable photosensitive polyimide with good comprehensive performance

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Synthesis and characterization of polyimides with rigid folded fragments

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Vanillin-based degradable thermosets with superior dielectric properties via regulation of imine cross-linked structure

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High Performance Polyimide Films with Low Dk and Low Df at 10 GHz via Cross-Linking of Bulky Pendant Groups

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Development of flexible, robust, freestanding PTFE fiber film/PTFE particles-fluorinated polyimide hierarchical sandwich composites with ultra-low dielectric constant for high-frequency applications

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Recyclable, reprocessable, self-healing elastomer-like epoxy vitrimer with low dielectric permittivity and its closed-loop recyclable carbon fiber reinforced composite

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Colorless polyimides derived from rigid trifluoromethyl-substituted triphenylenediamines

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High-performance 2D electronic devices enabled by strong and tough two-dimensional polymer with ultra-low dielectric constant

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Adjustable Plane Curvature of Covalent Organic Framework Enabling Outstanding Dielectric, Electret, and High‐Temperature Processing Properties

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Synergistic Enhancement of Mechanical and Dielectric Properties in Transparent Polyimides by Regulating Hydrogen Bonding and Microbranched Cross-Linking Structure

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Facile Preparation of an Intrinsically Low Dielectric and High Thermal Conductivity Biobased (Magnolol) Polysiloxane Film

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Macromolecules, 2025, 58, 562
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Synergistic synthetic strategy for thermal-resistant, low dielectric, and colorless poly(fluorenyl ether sulfone/phenyl-s-triazine)s design: spatial obstruction and polarizability coupling

Linyan Zhu, Lishuai Zong, Wenguang Zhang, Jiaming Wang, Yabin Zhang, Yuming Lu, Jinyan Wang and Xigao Jian

European Polymer Journal, 2025, 236, 114109
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High Thermally Stable Anthracene-Based Polyimides with Low Dielectric Constants and Dissipation Factors

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ACS Appl. Polym. Mater., 2023, 5, 10196
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Improvement in Insulation and Corona Resistance of PI by Incorporating SiO2 and AlN

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Preparation and Properties of Fluorinated Poly(aryl ether)s with Ultralow Water Absorption and Dielectric Constant by Cross-Linked Network Strategy

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ACS Appl. Mater. Interfaces, 2024, 16, 46834
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Fluorinated polyimide with enhanced ultraviolet-resistant radiation via a self-sacrificial strategy

Bo Xu, Rui Feng, Tingting Zhao, Ling Zhou, Yanyun Ju, Jiaqi Chen, Qimeng Zhang and Lijie Dong

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The application of organic materials used in IC advanced packaging:A review

Liu Jikang

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High Transverse Relaxation Microsphere Induced Low K Toughness Polyimide Films

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ACS Appl. Polym. Mater., 2025, 7, 5394
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Effect of fluorine hybridization on dielectric response of epoxy polymer

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Preparation and characterization of low-κ co-polyimide films

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J Polym Res, 2025, 32
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APDS modified several bisphenol A polyimides with low dielectric constant under high frequency

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Dual-functional molecular engineering of silicon-alkyne polyimides: A novel strategy for balancing processability and thermal stability in high-performance composites

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Characterization of Gamma‐Ray‐Irradiated Polyimide Flyer and Effect of Electric Explosion Driving Velocity

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J of Applied Polymer Sci, 2025, 142
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High-frequency low-dielectric-loss in linear-backbone-structured polyimides with ester groups and ether bonds

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Aromatic copolyesters with tunable dielectric and thermal properties enabled by aryl building blocks

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Synthesis of Low-k Poly(ether ether ketone) Films and Surface Functionalization for Exceptional Copper Adhesive Properties

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Development of Fluorinated Colorless Polyimides of Restricted Dihedral Rotation toward Flexible Substrates with Thermal Robustness

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Nacre‐Inspired Coordination Networks for Transparent, Ultra‐Stable Polyimide Films in Flexible Electronics

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Adv Funct Materials, 2025
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Fluorine-Free Thermoplastic High-Frequency Low Dielectric Poly(ether imide)s for Flexible Copper Clad Laminates

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Perfluorocyclobutyl Aryl Ether‐Based Polymethacrylates with High Heat Resistance

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Multifunctional polyimides for resistive switching memory devices based on flexible transparent polyimide–silver nanowires hybrid electrodes

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Fluorinated polyimide with triphenyl pyridine structure for 5G communications: Low dielectric, highly hydrophobic, and highly transparent

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European Polymer Journal, 2023, 197, 112327
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Improving the Dimensional Stability of Polyphenylene Oxide without Reducing Its Dielectric Properties for High-Frequency Communication Applications

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Engineering the Dielectric Constants of Polymers: From Molecular to Mesoscopic Scales

Jie Chen, Zhantao Pei, Bin Chai, Pingkai Jiang, Lin Ma, Lei Zhu and Xingyi Huang

Advanced Materials, 2024, 36
DOI: 10.1002/adma.202308670

Design and Verification of Thermosetting Benzoxazoles with Excellent Dielectric Properties and Thermostability via the Materials Genome Approach (MGA)

Xiaoyun Liu, Tiantian Duan, Wei Yin, Rui Yang, Yong Yu, Peiyuan Zuo and Qixin Zhuang

ACS Appl. Polym. Mater., 2024, 6, 4547
DOI: 10.1021/acsapm.4c00009

A Facile Method for Preparing Fluorinated Poly(aryl ether)s Toward High‐Frequency Low Dielectric Materials

Yinquan Liu, Tianjiao Hu, Jing Sun and Qiang Fang

Macromol. Rapid Commun., 2025, 46
DOI: 10.1002/marc.202401017

Poly(phenylene sulfide) derivatives as ultralow dielectric loss materials with stable frequency response

Seigo Watanabe, Shuma Miura, Tomohiro Miura, Yoshino Tsunekawa, Daisuke Ito and Kenichi Oyaizu

Commun Mater, 2025, 6
DOI: 10.1038/s43246-025-00917-w

Versatile Landscape of Low-k Polyimide: Theories, Synthesis, Synergistic Properties, and Industrial Integration

Xiaodi Dong, Baoquan Wan and Jun-Wei Zha

Chem. Rev., 2024, 124, 7674
DOI: 10.1021/acs.chemrev.3c00802

Fluorinated poly(aryl ether)s with extremely low dielectric constant and high thermal stability by amino and epoxy cross-linking networks

Yan Ma, Jingyi Zhu, Jian Li, Qiang Ren, Xu Meng and Chenyi Wang

Journal of Macromolecular Science, Part A, 2025, 62, 334
DOI: 10.1080/10601325.2025.2471842

Rising of Dynamic Polyimide Materials: A Versatile Dielectric for Electrical and Electronic Applications

Baoquan Wan, Xiaodi Dong, Xing Yang, Jiangqiong Wang, Ming‐Sheng Zheng, Zhi‐Min Dang, George Chen and Jun‐Wei Zha

Advanced Materials, 2023, 35
DOI: 10.1002/adma.202301185

Mechanical enhancement and dielectric properties of SiO2 contained polyimides under high frequency

Heming Li, Xinming Wang, Tao Wu, Yuze Gong, Hongbin Zhao, Zhaobin Liu, Davoud Dastan, Ke Ma and Zhizhi Hu

J Mater Sci: Mater Electron, 2023, 34
DOI: 10.1007/s10854-023-11731-w

Bioinspired construction of size adjustable hollow polydopamine microspheres for ultra-low dielectric polyimide composites

Wanjing Zhao, Yizhang Tong, Chonghao Lu, Qilong Huang, Xianwu Cao, Robert K.Y. Li and Wei Wu

Applied Surface Science, 2024, 643, 158714
DOI: 10.1016/j.apsusc.2023.158714