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Konstantinos Termentzidis, Valentina M. Giordano, Maria Katsikini, Eleni Paloura, Gilles Pernot, Maxime Verdier, David Lacroix, Ioannis Karakostas and Joseph Kioseoglou

Nanoscale, 2018, 10, 21732
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Phonon dynamic behaviors induced by amorphous layers at heterointerfaces

Quanjie Wang, Jie Zhang, Yucheng Xiong, Shouhang Li, Vladimir Chernysh and Xiangjun Liu

Phys. Chem. Chem. Phys., 2024, 26, 8397
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Effect of light atoms on thermal transport across solid–solid interfaces

Ruiyang Li, Kiarash Gordiz, Asegun Henry, Patrick E. Hopkins, Eungkyu Lee and Tengfei Luo

Phys. Chem. Chem. Phys., 2019, 21, 17029
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First-principles calculations of interfacial thermal transport properties between SiC/Si substrates and compounds of boron with selected group V elements

Zhehao Sun, Kunpeng Yuan, Xiaoliang Zhang and Dawei Tang

Phys. Chem. Chem. Phys., 2019, 21, 6011
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Interfacial thermal resonance in an SiC–SiC nanogap with various atomic surface terminations

Xiangrui Li, Wentao Chen and Gyoko Nagayama

Nanoscale, 2023, 15, 8603
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Thermal Boundary Resistance: A Review of Molecular Dynamics Simulations and Other Computational Methods

Christopher M. Stanley

Physica Status Solidi (b), 2023, 260
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Low-Cost Nanostructures from Nanoparticle-Assisted Large-Scale Lithography Significantly Enhance Thermal Energy Transport across Solid Interfaces

Eungkyu Lee, Eredzhep Menumerov, Robert A. Hughes, Svetlana Neretina and Tengfei Luo

ACS Appl. Mater. Interfaces, 2018, 10, 34690
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Atomic‐Scale Interface Phonon Engineering for Thermal Management: An Electron Microscopy Review

Ziyue Xu, Ruilin Mao and Peng Gao

Adv Funct Materials, 2026
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A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces

Tianli Feng, Hao Zhou, Zhe Cheng, Leighann Sarah Larkin and Mahesh R. Neupane

ACS Appl. Mater. Interfaces, 2023, 15, 29655
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Molecular Dynamics Simulations in Nanoscale Heat Transfer: A Mini Review

Jiyoung Kim, Yuhan Liu, Tengfei Luo and Zhiting Tian

ASME Journal of Heat and Mass Transfer, 2025, 147
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First measurement of Gallium Arsenide as a low-temperature calorimeter

D. L. Helis, A. Melchiorre, A. Puiu, G. Benato, P. Carniti, A. Continenza, N. Di Marco, A. Ferella, C. Ferrari, F. Giannessi, C. Gotti, E. Monticone, L. Pagnanini, G. Pessina, S. Pirro, G. Profeta, M. Rajteri, P. Settembri, A. Shaikina, C. Tresca and D. Trotta

Eur. Phys. J. C, 2024, 84
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Thermal transport across solid-solid interfaces enhanced by pre-interface isotope-phonon scattering

Eungkyu Lee and Tengfei Luo

Applied Physics Letters, 2018, 112
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(Ultra)wide bandgap semiconductor heterostructures for electronics cooling

Zhe Cheng, Zifeng Huang, Jinchi Sun, Jia Wang, Tianli Feng, Kazuki Ohnishi, Jianbo Liang, Hiroshi Amano and Ru Huang

Applied Physics Reviews, 2024, 11
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High interfacial thermal conductance across heterogeneous GaN/graphene interface

Dan Wu, Hua Ding, Zhi-Qiang Fan, Pin-Zhen Jia, Hai-Qing Xie and Xue-Kun Chen

Applied Surface Science, 2022, 581, 152344
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Study of heat conduction in three-layered structure—a sandwich model

Tarika K Patel and P N Gajjar

Phys. Scr., 2020, 95, 045222
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Perspective on thermal conductance across heterogeneously integrated interfaces for wide and ultrawide bandgap electronics

Zhe Cheng, Samuel Graham, Hiroshi Amano and David G. Cahill

Applied Physics Letters, 2022, 120
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Enhancing Thermal Boundary Conductance of Graphite–Metal Interface by Triazine-Based Molecular Bonding

Aun Ota, Masato Ohnishi, Hisayoshi Oshima, Takuma Shiga, Takashi Kodama and Junichiro Shiomi

ACS Appl. Mater. Interfaces, 2019, 11, 37295
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Spring stiffness and heterointerface effects on GaN/AlN double-layer composites polishing

Tan-Tai Do and Te-Hua Fang

International Journal of Mechanical Sciences, 2025, 288, 110005
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Record-Low thermal boundary resistance at bonded GaN/diamond interface by controlling ultrathin heterogeneous amorphous layer

Bin Xu, Fengwen Mu, Yingzhou Liu, Rulei Guo, Shiqian Hu and Junichiro Shiomi

Acta Materialia, 2025, 282, 120458
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Evolution and influence of GaN/AlN heterointerface during the thinning process of GaN film

Yuqi Zhou, Yuhua Huang, Jinming Li and Fulong Zhu

Applied Surface Science, 2023, 608, 155151
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Interface engineering moderated interfacial thermal conductance of GaN-based heterointerfaces

Quan-Jie Wang, Yu-Ge Deng, Ren-Zong Wang and Xiang-Jun Liu

Acta Phys. Sin., 2023, 72, 226301
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Enhancing interfacial thermal conductance in Si/Diamond heterostructures by phonon bridge

Ershuai Yin, Qiang Li, Wenzhu Luo and Lei Wang

International Journal of Heat and Mass Transfer, 2026, 256, 128051
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A Modified Theoretical Model to Accurately Account for Interfacial Roughness in Predicting the Interfacial Thermal Conductance

Yingying Zhang, Dengke Ma, Yi Zang, Xiaojia Wang and Nuo Yang

Front. Energy Res., 2018, 6
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High Thermal Boundary Conductance across Bonded Heterogeneous GaN–SiC Interfaces

Fengwen Mu, Zhe Cheng, Jingjing Shi, Seongbin Shin, Bin Xu, Junichiro Shiomi, Samuel Graham and Tadatomo Suga

ACS Appl. Mater. Interfaces, 2019, 11, 33428
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Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices

Zhe Cheng, Fengwen Mu, Luke Yates, Tadatomo Suga and Samuel Graham

ACS Appl. Mater. Interfaces, 2020, 12, 8376
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Impacts of various interfacial nanostructures on spectral phonon thermal boundary conductance

Rui Xie, Janak Tiwari and Tianli Feng

Journal of Applied Physics, 2022, 132
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Enhanced Thermal Boundary Conductance across GaN/SiC Interfaces with AlN Transition Layers

Ruiyang Li, Kamal Hussain, Michael E. Liao, Kenny Huynh, Md Shafkat Bin Hoque, Spencer Wyant, Yee Rui Koh, Zhihao Xu, Yekan Wang, Dorian P. Luccioni, Zhe Cheng, Jingjing Shi, Eungkyu Lee, Samuel Graham, Asegun Henry, Patrick E. Hopkins, Mark S. Goorsky, M.Asif Khan and Tengfei Luo

ACS Appl. Mater. Interfaces, 2024, 16, 8109
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