Issue 8, 2025

Reaction mechanism study of Al/Ti alloy thin films under thermal stimulation

Abstract

Alloy films are widely used in energy-containing materials to enhance combustion efficiency and heat release, and to improve explosive or propulsive performance. However, studies on the reaction mechanism under thermal stimulation are scarce. In this study, the reaction properties of Al/Ti nanolayers under different conditions are systematically investigated using molecular dynamics simulations (NVT and NVE) and atomic embedding potentials. By constructing accurate atomic models ((Al/Ti)II, (Al/Ti)III, and (Al/Ti)IV) and using appropriate potential energy functions, the reaction was firstly relaxed at 1500 K for 20 ps, followed by reaction simulations under adiabatic conditions for 6 ns. The study reveals the microscopic mechanism of the Al/Ti nanolayer reaction, covering the key processes of reaction triggering, interfacial evolution and temperature change. The main results are as follows: at the junction of the Al and Ti layers, Ti atoms are exfoliated from the solid state and migrate to the Al liquid phase, triggering the reaction. In the “liquid-like” structure (reaction temperature in the range of 1840–1900 K), the interface atoms alloy with the Ti surface, and as the temperature increases, the Ti atoms absorb heat and transform from solid to liquid, and contact with the Al melt to drive the reaction. With the increase of the reaction period, the alloying of the transition layer is completed in advance, and the shorter the period ((Al/Ti)II, (Al/Ti)III, and (Al/Ti)IV), the faster the reaction rate (0.203, 0.398, and 0.707 K ps−1). In the adiabatic stage, the Al/Ti system exhibits self-sustained reaction properties, and the temperature increase promotes the alloying reaction. Eventually, the system reaches equilibrium. This study provides an important theoretical reference for alloy film design and reaction energy control. Simulations provide insight into the high-temperature properties, while experiments demonstrate the behavior of the alloy at lower temperatures, providing a basis for the practical application of the material in industry, and together the two studies build a more comprehensive picture of the material's behavior.

Graphical abstract: Reaction mechanism study of Al/Ti alloy thin films under thermal stimulation

Transparent peer review

To support increased transparency, we offer authors the option to publish the peer review history alongside their article.

View this article’s peer review history

Article information

Article type
Paper
Submitted
09 Dhj 2024
Accepted
17 Shk 2025
First published
28 Shk 2025
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2025,15, 6413-6423

Reaction mechanism study of Al/Ti alloy thin films under thermal stimulation

S. Chang, R. Shen and L. Wu, RSC Adv., 2025, 15, 6413 DOI: 10.1039/D4RA08413F

This article is licensed under a Creative Commons Attribution-NonCommercial 3.0 Unported Licence. You can use material from this article in other publications, without requesting further permission from the RSC, provided that the correct acknowledgement is given and it is not used for commercial purposes.

To request permission to reproduce material from this article in a commercial publication, please go to the Copyright Clearance Center request page.

If you are an author contributing to an RSC publication, you do not need to request permission provided correct acknowledgement is given.

If you are the author of this article, you do not need to request permission to reproduce figures and diagrams provided correct acknowledgement is given. If you want to reproduce the whole article in a third-party commercial publication (excluding your thesis/dissertation for which permission is not required) please go to the Copyright Clearance Center request page.

Read more about how to correctly acknowledge RSC content.

Social activity

Spotlight

Advertisements