Issue 10, 2019
From the journal:

Chemical Communications

Construction of 3D Si@Ti@TiN thin film arrays for aqueous symmetric supercapacitors†

Binbin Wei,a   Hanfeng Liang,*a   Zhengbing Qi,b   Dongfang Zhang,a   Hao Shen,a   Wenshen Hua  and  Zhoucheng Wang ORCID logo *a  

* Corresponding authors

a College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, People's Republic of China
E-mail: hfliang@xmu.edu.cn, zcwang@xmu.edu.cn
Fax: +86-592-2180738
Tel: +86-592-2180738

b Key Laboratory of Functional Materials and Applications of Fujian Province, School of Materials Science and Engineering, Xiamen University of Technology, Xiamen 361024, People's Republic of China

Abstract

We report the preparation of 3D binder-free Si@Ti@TiN thin film array electrodes for supercapacitors using deep silicon etching and magnetron sputtering for the first time. This work not only offers the 3D array structure of Si@Ti@TiN thin films, but also paves a promising way for the construction of high-energy storage systems.

Graphical abstract: Construction of 3D Si@Ti@TiN thin film arrays for aqueous symmetric supercapacitors

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Article information

DOI
https://doi.org/10.1039/C8CC08219G
Article type
Communication
Submitted
14 okt 2018
Accepted
06 jan 2019
First published
07 jan 2019

Chem. Commun., 2019,55, 1402-1405

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Construction of 3D Si@Ti@TiN thin film arrays for aqueous symmetric supercapacitors

B. Wei, H. Liang, Z. Qi, D. Zhang, H. Shen, W. Hu and Z. Wang, Chem. Commun., 2019, 55, 1402 DOI: 10.1039/C8CC08219G

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