Issue 2, 2024
From the journal:

Industrial Chemistry & Materials

A new metallization method of modified tannic acid photoresist patterning†

Zicheng Tang,‡a   Xubin Guo,‡a   Haihua Wang, ORCID logo a   Huan Chena  and  Wenbing Kang ORCID logo *a  

* Corresponding authors

a National Engineering Research Center for Colloidal Materials, School of Chemistry and Chemical Engineering, Shandong University, Jinan, Shandong province, China
E-mail: wbkang@sdu.edu.cn

Abstract

Metal patterning from a modified tannic acid (TA-Boc-MA) photoresist and the processes are designed using protection of hydroxyl groups in tannic acid, formulation into a photoresist, an exposure and pattern treatment process, and metallization by electroless Ag deposition with silver ion solution.

Keywords: Tannic acid; Positive photoresist; Metallization method; Metal patterning; Ag pattern.

Graphical abstract: A new metallization method of modified tannic acid photoresist patterning

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Article information

DOI
https://doi.org/10.1039/D3IM00066D
Article type
Communication
Submitted
26 jun 2023
Accepted
14 ago 2023
First published
15 ago 2023
This article is Open Access
Creative Commons BY license

Ind. Chem. Mater., 2024,2, 284-288

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A new metallization method of modified tannic acid photoresist patterning

Z. Tang, X. Guo, H. Wang, H. Chen and W. Kang, Ind. Chem. Mater., 2024, 2, 284 DOI: 10.1039/D3IM00066D

This article is licensed under a Creative Commons Attribution 3.0 Unported Licence. You can use material from this article in other publications without requesting further permissions from the RSC, provided that the correct acknowledgement is given.

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