Issue 30, 2022

Variation of bending rigidity with material density: bilayer silica with nanoscale holes

Abstract

Two dimensional (2D) materials are a young class of materials that is foreseen to play an important role as building blocks in a range of applications, e.g. flexible electronics. For such applications, mechanical properties such as the bending rigidity κ are important. Only a few published measurements of the bending rigidity are available for 2D materials. Nearly unexplored is the question of how the 2D material density influences the bending rigidity. Here, we present helium atom scattering measurements on a “holey” bilayer silica with a density of 1.4 mg m−2, corresponding to 1.7 monolayers coverage. We find a bending rigidity of 6.6 ± 0.3 meV, which is lower than previously published measurements for a complete 2D film, where a value of 8.8 ± 0.5 meV was obtained. The decrease of bending rigidity with lower density is in agreement with theoretical predictions.

Graphical abstract: Variation of bending rigidity with material density: bilayer silica with nanoscale holes

Article information

Article type
Communication
Submitted
29 apr 2022
Accepted
06 jun 2022
First published
06 jun 2022
This article is Open Access
Creative Commons BY license

Phys. Chem. Chem. Phys., 2022,24, 17941-17945

Variation of bending rigidity with material density: bilayer silica with nanoscale holes

M. Tømterud, S. D. Eder, C. Büchner, M. Heyde, H. Freund, J. R. Manson and B. Holst, Phys. Chem. Chem. Phys., 2022, 24, 17941 DOI: 10.1039/D2CP01960D

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