Issue 42, 2021

Strong Fermi-level pinning at metal contacts to halide perovskites

Abstract

The performance of halide perovskite-based electronic and optoelectronic devices is often related to interfacial charge transport. To shed light on the underlying physical and chemical properties of CH3NH3PbI3 (MAPbI3) in direct contact with common electrodes Al, Ti, Cr, Ag, and Au, the evolution of interfacial properties and Fermi level pinning is systematically studied. Given a unique experimental facility, pristine interfaces without any exposure to ambient air were prepared. We observe aggregation of substantial amounts of metallic lead (Pb0) at the metal/MAPbI3 interface, resulting from the interfacial reaction between the deposited metal and iodine ions from MAPbI3. It is found that the Schottky barrier height at the metal/MAPbI3 interface is independent of the metal work function due to strong Fermi level pinning, possibly due to the metallic Pb0 aggregates, which act as interfacial trap sites. The charge neutrality level of MAPbI3 is consistent with the energy level of Pb0-related defects, indicating that Pb0 interfacial trap states can be nonradiative recombination sites. This work underlines that control of chemical bonding at interfaces is a key factor for designing future halide perovskite-based devices.

Graphical abstract: Strong Fermi-level pinning at metal contacts to halide perovskites

Supplementary files

Article information

Article type
Paper
Submitted
19 jul 2021
Accepted
12 okt 2021
First published
13 okt 2021

J. Mater. Chem. C, 2021,9, 15212-15220

Author version available

Strong Fermi-level pinning at metal contacts to halide perovskites

K. Hong, K. C. Kwon, K. S. Choi, Q. V. Le, S. J. Kim, J. S. Han, J. M. Suh, S. Y. Kim, C. M. Sutter-Fella and H. W. Jang, J. Mater. Chem. C, 2021, 9, 15212 DOI: 10.1039/D1TC03370K

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