Issue 8, 2021

Intrinsically stretchable polymer semiconductors: molecular design, processing and device applications

Abstract

Stretchable electronics have received great attention in recent years because they are able to accommodate large mechanical deformation without damage to their electronic properties. These features are highly desirable for novel applications, including wearable devices, health-monitoring electronics, electronic skin, and artificial neural devices. A key factor in the area of stretchable electronics is the development of intrinsically stretchable polymer semiconductors. This review will survey different approaches that can significantly enhance the stretchability of polymer semiconductors without sacrificing their charge-transport properties. To develop stretchable polymer semiconductors, two approaches have been reported: (1) the engineering of the chemical structures of conjugated polymers; and (2) the physical blending of conjugated polymers in an elastomeric matrix. In addition to these two approaches, the influence of the fabrication process (e.g., solution shearing, nanoconfinement, and electrospinning) on the mechanical and electrical properties of polymer semiconductor films is also reviewed. In the final part, we will introduce novel applications of stretchable polymer semiconductors (e.g., electronic skin, artificial neural electronics, and self-healing polymer semiconductors) and the challenges facing these emerging technologies. This review provides a comprehensive introduction to the development of intrinsically stretchable polymer semiconductors covering molecular design, solution processes, and novel applications.

Graphical abstract: Intrinsically stretchable polymer semiconductors: molecular design, processing and device applications

Article information

Article type
Review Article
Submitted
27 ဒီ 2020
Accepted
09 ဖေ 2021
First published
10 ဖေ 2021

J. Mater. Chem. C, 2021,9, 2660-2684

Intrinsically stretchable polymer semiconductors: molecular design, processing and device applications

H. Tien, Y. Huang, Y. Chiu, Y. Cheng, C. Chueh and W. Lee, J. Mater. Chem. C, 2021, 9, 2660 DOI: 10.1039/D0TC06059C

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