Issue 18, 2023

Elaborating the interplay between the detecting unit and emitting unit in infrared quantum dot up-conversion photodetectors

Abstract

The quantum dot up-conversion device combines an infrared photodetector (PD) and a visible quantum-dot light-emitting diode (QLED) to directly convert infrared targets to visible images. However, large efficiency loss is usually induced by the integration of the detecting unit and the emitting unit. One of the important reasons is the performances of the PD and QLED units restraining each other. We regulated the equilibrium between infrared absorption and visible emission by changing the thicknesses of infrared active layers in up-conversion devices. A good balance could be achieved between the absorption of 980 nm incident light and the out-coupling of the 634 nm emission when the active layer thickness is 140 nm, leading to the best performance of the up-conversion device. As more photogenerated carriers are produced with the increase of infrared illumination intensity, the external quantum efficiency (EQE) of the QLED unit in the up-conversion device remains little changed. This suggests the limited amount of photogenerated holes in the PD unit does not limit the EQE of the QLED unit. However, a PD unit with a high ratio of photogenerated holes trapped near the interconnection decreased the EQE in the QLED unit. This work provides new insights into the interplay between the PD and QLED units in up-conversion devices, which is crucial for their further improvements.

Graphical abstract: Elaborating the interplay between the detecting unit and emitting unit in infrared quantum dot up-conversion photodetectors

Associated articles

Article information

Article type
Paper
Submitted
17 Marts 2023
Accepted
12 Apr. 2023
First published
17 Apr. 2023

Nanoscale, 2023,15, 8197-8203

Elaborating the interplay between the detecting unit and emitting unit in infrared quantum dot up-conversion photodetectors

Q. Xu, X. Yang, J. J. Liu, F. Li, R. Chang, L. Wang, A. Q. Wang, Z. Wu, H. Shen and Z. Du, Nanoscale, 2023, 15, 8197 DOI: 10.1039/D3NR01237A

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