Issue 12, 2023

Bio-inspired dry adhesive pads using multi-walled carbon nanotube/polydimethylsiloxane composites for efficient wafer transfer robot arms in smart factories

Abstract

The development of dry adhesive pads (DAPs) is essential to prevent wafer detachment from high-speed wafer-transfer robot arms. However, polydimethylsiloxane (PDMS)-based DAPs, which are insulating elastomers, generate residual charges inside DAPs. These cause charge accumulation and electrostatic interactions between the DAP and the wafer interface. Furthermore, at a high processing temperature of >300 °C, the adhesive and mechanical strengths of conventional DAPs are degraded because of their low thermal and mechanical stability. In this study, we developed bio-inspired DAPs (BDAPs) with various shapes (hole, cylinder, and line patterns) and different contact areas (20, 40, and 60%) through systematic investigations to determine optimized patterns and shapes for different motions. Additionally, we fabricated a multi-walled carbon nanotube (MWCNT)/PDMS composite-based BDAP (c-BDAP), which exhibited high heat resistance and high electrical conductivity. The conductivity of c-BDAP was 6.16 × 10−3 S m−1, and it had a weight loss of ∼4% at 300 °C after 1 h. Our findings can inspire the development of low-cost and high-performance c-BDAPs, which are reliable for various robot arm movements.

Graphical abstract: Bio-inspired dry adhesive pads using multi-walled carbon nanotube/polydimethylsiloxane composites for efficient wafer transfer robot arms in smart factories

Supplementary files

Article information

Article type
Paper
Submitted
07 Aug. 2023
Accepted
13 Sept. 2023
First published
14 Sept. 2023

Mol. Syst. Des. Eng., 2023,8, 1520-1525

Bio-inspired dry adhesive pads using multi-walled carbon nanotube/polydimethylsiloxane composites for efficient wafer transfer robot arms in smart factories

B. Lee, Y. C. Ko, S. Kim, S. E. Lee, H. J. Jin, D. J. Chang, M. Park and B. H. Kim, Mol. Syst. Des. Eng., 2023, 8, 1520 DOI: 10.1039/D3ME00126A

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