Issue 1, 2023
From the journal:

Molecular Systems Design & Engineering

Introduction to molecular assembly of organic electronics

Dean M. DeLongchampa  and  Ying Diaob  

a Materials Science and Engineering Laboratory, Materials Measurement Laboratory, National Institute of Standards and Technology, USA

b Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA

Abstract

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Graphical abstract: Introduction to molecular assembly of organic electronics

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Article information

DOI
https://doi.org/10.1039/D2ME90036J
Article type
Editorial
Submitted
07 Nov. 2022
Accepted
07 Nov. 2022
First published
07 Dec. 2022

Mol. Syst. Des. Eng., 2023,8, 8-10

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Introduction to molecular assembly of organic electronics

D. M. DeLongchamp and Y. Diao, Mol. Syst. Des. Eng., 2023, 8, 8 DOI: 10.1039/D2ME90036J

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