Issue 40, 2017

Heat-controlled micropillar array device for microsystems technology

Abstract

A new temperature-controlled smart soft material micropillar array has been fabricated via in situ integration of the liquid-crystalline elastomer-based component into the hybrid microdevice. Such design allows for developing pushing elements with fast lifetime values of ca. 5 s, and opens huge opportunities for the use of hybrid smart microdevices with total control on the actuation time/response, repeatability, stability and energy saving.

Graphical abstract: Heat-controlled micropillar array device for microsystems technology

Supplementary files

Article information

Article type
Paper
Submitted
26 جوٗلایی 2017
Accepted
18 ستمبر 2017
First published
18 ستمبر 2017

Soft Matter, 2017,13, 7264-7272

Heat-controlled micropillar array device for microsystems technology

N. Torras, M. Duque, C. J. Camargo, J. Esteve and A. Sánchez-Ferrer, Soft Matter, 2017, 13, 7264 DOI: 10.1039/C7SM01480E

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