Ultra-high thermally conductive graphite microplatelet/aramid nanofiber composites with reduced interfacial thermal resistances by engineered interface π–π interactions

Yu-Yang Song, Niu Jiang, Shuang-Zhu Li, Lu-Ning Wang, Lu Bai, Jie Yang and Wei Yang

Mater. Horiz., 2025, 12, 4260
DOI: 10.1039/D5MH00070J

Composition–structure–property relationships of polyethylene vitrimers crosslinked by 8-arm polyhedral oligomeric silsesquioxane

Mikaela Sadri, Andrew Barbour, Travis L. Thornell, J. Kent Newman and Zhe Qiang

Soft Matter, 2025, 21, 2694
DOI: 10.1039/D4SM01518E

Leveraging lignin's ortho-methoxy groups for intramolecular hydrogen bonding to reduce the dielectric constant of epoxy resins

Fengyuan Zhang, Haoyang Jin, Haoyu Shen, Longtao Wang, Shanshan Dai, Shuai Du, Shuaiqi Yang, Ben-Lin Hu and Songqi Ma

Green Chem., 2026, 28, 2376
DOI: 10.1039/D5GC04984A

Interfacial engineering of boron nitride/epoxy resin composites for enhanced compatibility and dielectric properties

Tong Wang, Ran Zhuang, Yunxin Chen, Mingxin Feng, Jiehua Bao, Zewu Zhang, Shuang Liang and Yuming Zhou

Materials Letters, 2026, 405, 139787
DOI: 10.1016/j.matlet.2025.139787

Mitigation of interfacial thermal resistance in thermally conductive composite materials through optimization of phonon transport pathway

Rui Chen, Yageng Bai, Yuxuan Gu, Yuqing Zou, Shijian Liu, Ling Wang, Haipeng Qiu, Zhongke Yuan, Zetong Ma, Cheng Wang, Jianxin Mu and Xudong Chen

Journal of Materials Science & Technology, 2026, 250, 83
DOI: 10.1016/j.jmst.2025.06.032

Study on the dielectric properties of fluorinated graphene

Zixuan Gou, Weibin Xi, Wei Jiang, Zekai Zhang, Jinping Zhao, Jin Zhou and Yang Su

FlatChem, 2025, 51, 100862
DOI: 10.1016/j.flatc.2025.100862

Low-temperature-resilient, lightweight long-range communication module

Puti Yan, Wei Tang, Binglin Wang, Xu Tang, Shaoxiong Cai and Ruolei Wu

Device, 2026, 101114
DOI: 10.1016/j.device.2026.101114

Enhancing the properties of deconstructable thermosets through comonomer topology engineering

Dai-Lin Zhou, Ying-Han Guo, Di Han and Qiang Fu

Polymer, 2025, 336, 128882
DOI: 10.1016/j.polymer.2025.128882

Achieving enhanced thermal conductivity and low dielectric constants using double-oriented fluorinated graphene skeleton in silicone gel composites

Potao Sun, Haoyue Yang, Wenxia Sima, Tao Yuan, Ming Yang, Xinyu Tang, Wenlong Pang and Shuofei Huang

Composites Communications, 2025, 53, 102162
DOI: 10.1016/j.coco.2024.102162

A spherical h-BN agglomerates-filled composite with high thermal conductivity and low dielectric loss

Jiaqi Li, Yujie Yang, Wenjie Ge, Yang Gao, Huixing Lin, Changming Xu, Jingyi Liu, Xiangyu Zhao, Haiyi Peng and Xiaogang Yao

Ceramics International, 2025, 51, 44821
DOI: 10.1016/j.ceramint.2025.07.129

Customizing Adaptive Thermoplastic Polyimide Interfaces in Bismaleimide/Boron Nitride Composites: A Synergistic Approach to Achieving Insulation and Cyclic Durability

Hengyan Lu, Jiahao Shi, Xiaorui Zhang, Hang Xu, Xiaoming Wang, Tianqi Zhang, Chunmei Ming, Huinan Zhao and Yingqiao Li

Polymer Composites, 2026, 47, 3470
DOI: 10.1002/pc.70367

A Mini Review of Flexible Heat Spreaders Based on Functionalized Boron Nitride Nanosheets

Mengying Wu, Jingyao Gao, Wen Dai, Hongbing Ma, Kazuhito Nishimura, Jinhong Yu, Ya Tang, Nan Jiang and Cheng-Te Lin

ASME Journal of Heat and Mass Transfer, 2025, 147
DOI: 10.1115/1.4067474

Multiple crosslinking-Stretch-induced multi-level orientation structure BNNS/Ca-SA/D films with high thermal conductive performance

Zhengyang Miao, Guangzheng Zhu, Lei Yang, Peng Ding and Fang Jiang

Composites Part B: Engineering, 2026, 309, 113032
DOI: 10.1016/j.compositesb.2025.113032

Robust Flexible Microwave Dielectric Film with High Thermal Conductivity and Ultralow Loss

Yani Lu, Jiangbo Chi, Wenjin Chen, Xinwei Xu, Wenmei Luo, Boshen Zhang, Liang Sun, Jin Cheng and Hong Wang

Adv Funct Materials, 2026, 36
DOI: 10.1002/adfm.202523628

h-BN-based lamellar films with ultralow dielectric constant and high thermal conductivity

Zesheng Shen, Kaifeng Wang, Yulong Chen, Xingchao Mao, Shichen Xie and Yingxia Liu

Materials & Design, 2026, 261, 115323
DOI: 10.1016/j.matdes.2025.115323

Synergistically enhanced mechanical properties, wave-transparency, and low dielectric properties of cyanate ester resins by furfuryl-based diglycidyl-containing hollow polymer microspheres with nanoconfinement effects

Quanbing Shen, Beibei Yu, Dong Chen, Fen Zhang, Li Wang, Yuhong Ma and Wantai Yang

Chemical Engineering Journal, 2026, 535, 175734
DOI: 10.1016/j.cej.2026.175734

Molecular dynamics simulation of the thermal conductivity and dielectric properties of PI/FG composites

Sihao Bi, Tong Zhao, Jinghui Tuo, Xiaolong Wang, Ying Sun and Yuantao Zhang

Surfaces and Interfaces, 2025, 56, 105569
DOI: 10.1016/j.surfin.2024.105569

Reprocessable non-isocyanate polyurethane foams from lignin: A sustainable route to high-performance thermal insulation materials

Jun Zhu, Yumeng Gao, Maoxu Zhang, Kang Shen, Jian Chen, Can Jin, Guomin Wu and Guifeng Liu

Chemical Engineering Journal, 2025, 525, 170558
DOI: 10.1016/j.cej.2025.170558

Research Progress on Engineering Low-Dielectric Polymer Resins

Longtao Wang, Haoyang Jin, Fengyuan Zhang and Songqi Ma

ACS Appl. Mater. Interfaces, 2026, 18, 4667
DOI: 10.1021/acsami.5c24084

Boron Nitride‐Polymer Composites with High Thermal Conductivity: Preparation, Functionalization Strategy and Innovative Structural Regulation

Mengsha Li, Shufen Han, Chun Dan, Tao Wu, Feng You, Xueliang Jiang, Yunhui Wu and Zhi‐Min Dang

Small, 2025, 21
DOI: 10.1002/smll.202412447

Norbornenyl‐Modified Nanosilica for Reinforced Polydicyclopentadiene Composites

Nengde Liang, Jingyue Li, YingJian Chen, Miao Zhang, Bin Xie, Zelin Sun, Liu Zhong, Qiwei Wang and Wai‐Yeung Wong

Polymer Composites, 2026, 47, 710
DOI: 10.1002/pc.70177

Brick-mud structured epoxy/boron nitride thermally conductive composites based on hot-pressing technology

Xiaowei Lu, Zijian Wu, Yue Zhao, Zhaojun Wang, Yue Zhang, Mingpeng He, Mingqi Sun, Ning Guo, Hassan Algadi, Ling Weng, Juanna Ren, Renbo Wei and Junguo Gao

Polymer, 2026, 346, 129655
DOI: 10.1016/j.polymer.2026.129655