An atomic surface of an aluminum alloy induced by novel green chemical mechanical polishing using hybrid rare earth abrasives and mechanisms unraveled

Zeyun Wang, Zhenyu Zhang, Pengfei Hu, Ganggang Liu, Jianjun Hu, Jianan Xu, Huaxiang Cai, Zehong Pang and Peng Ding

Nanoscale, 2025, 17, 22145
DOI: 10.1039/D5NR02599K

A novel atomic removal model for chemical mechanical polishing using developed mesoporous shell/core abrasives based on molecular dynamics

Zhensong Liu, Zhenyu Zhang, Junyuan Feng, Xian Yi, Chunjing Shi, Yang Gu, Feng Zhao, Shihao Liu and Jingru Li

Nanoscale, 2024, 16, 85
DOI: 10.1039/D3NR04420C

Tribochemical mechanisms of abrasives for SiC and sapphire substrates in nanoscale polishing

Qiufa Luo, Jing Lu, Feng Jiang, Jiaming Lin and Zige Tian

Nanoscale, 2023, 15, 15675
DOI: 10.1039/D3NR02353B

Classification, performance and recycling of ceria-based materials used for chemical mechanical polishing

Meiwen Tie, Yifei Wang, Cheng Zhang and Xiubing Huang

Nanoscale, 2026, 18, 5638
DOI: 10.1039/D5NR04766H

Atomic surface achieved through a novel cross-scale model from macroscale to nanoscale

Feng Zhao, Zhenyu Zhang, Xingqiao Deng, Junyuan Feng, Hongxiu Zhou, Zhensong Liu, Fanning Meng and Chunjing Shi

Nanoscale, 2024, 16, 2318
DOI: 10.1039/D3NR05278H

Review on chemical mechanical polishing for atomic surfaces using advanced rare earth abrasives

Xiangyan Chen, Zhenyu Zhang, Feng Zhao, Hao Luo, Jianmei Wang, Fanning Meng, Hongxiu Zhou, Xuye Zhuang and Guo Li

J. Phys. D: Appl. Phys., 2025, 58, 023004
DOI: 10.1088/1361-6463/ad8453

Nanocasting synthesis of mesoporous CeO2 particle abrasives from mesoporous SiO2 hard templates for enhanced chemical mechanical polishing performance

Yang Chen, Yifan Xia, Chao Wang, Jie Pan, Tianyu Wang and Ailian Chen

Ceramics International, 2024, 50, 53818
DOI: 10.1016/j.ceramint.2024.10.236

Ionic liquid-mediated morphology and structure of CeO2 nanoparticles for silicon wafers ultra-precision chemical mechanical polishing applications

Siyuan Zhao, Zhenyu Zhang, Na Fan, Qun Hu, Feng Zhao, Yang Liu, Yanying Cui, Shuaijun Yue, Fan Yang and Xiaopei Li

Journal of Materials Research and Technology, 2026, 41, 1314
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The influence of CeO2 abrasive size on the performance of photocatalytic assisted chemical-mechanical polishing by Y/Pr co-doping strategy

Ning Xu, Yuxin Luo, Yu Lin, Jiahui Ma and Yongping Pu

Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2024, 684, 133107
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Developing a sustainable grease from jojoba oil with plant waste based nanoadditives for enhancement of rolling bearing performance

Ndabezinhle Ngubhe Dube, Marwa ElKady, Hussien Noby and Mohamed G. A. Nassef

Sci Rep, 2024, 14
DOI: 10.1038/s41598-023-50003-9

Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding

Shang Gao, Haoxiang Wang, Han Huang, Zhigang Dong and Renke Kang

Int. J. Extrem. Manuf., 2025, 7, 035103
DOI: 10.1088/2631-7990/adae67

Chemical-mechanical synergies effects of multi-purpose pH regulators on C-, A-, and R-plane sapphire polishing

Yida Zou, Xinhuan Niu, Ni Zhan, Jianghao Liu, Xinjie Li, Chao He, Changxin Dong and Yunhui Shi

Tribology International, 2024, 195, 109603
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Fast control of material removal for copper chemical-mechanical lapping

Di Wu and Zhengqiang Tang

Results in Engineering, 2025, 27, 106258
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Sustainable utilization of the vegetable oil manufacturing waste product in the formulation of eco-friendly emulsifiable cutting fluids

Toka Hassan, Eman M. Kandeel, M. S. Taher, Entsar E. Badr and A. S. El-Tabei

Sci Rep, 2023, 13
DOI: 10.1038/s41598-023-46768-8

Innovative temperature-based texturization process for reducing reflectivity in boron-doped as-cut multi-crystalline silicon wafers

Madhesh Raji, Keerthivasan Thamodharan, Srinivasan Manikkam and Ramasamy Perumalsamy

J Mater Sci: Mater Electron, 2024, 35
DOI: 10.1007/s10854-024-12367-0

Improvement in the planarization of 4H-SiC(0001) achieved by photo-assisted chemical mechanical polishing (P-CMP) using nano TiO 2-based composite abrasive with heterostructure

Shidong Chen and Hong Lei

Friction, 2025, 13, 9440993
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Polishing mechanism of single-crystal silicon in fixed-abrasive chemical mechanical polishing with different solutions

Xiaozhe Yang, Shenglong Zhang, Fangming Lian, Xu Yang, Kazuya Yamamura and Zhuangde Jiang

Applied Surface Science, 2025, 705, 163494
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Recent Development of Abrasive Machining Processes Enhanced with Non-Newtonian Fluids

Linghong Zhu, Xiaofeng He, Xiaoming Wu, Jixuan Wu and Tao Hong

Coatings, 2024, 14, 779
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Application of surfactants in enhancing chemical mechanical polishing slurry performance for microelectronics: A review

Song Ma, Yiwen Chen, Caoxu Wang, Yan Li, Yang Xu and Yue Wu

Materials Today Communications, 2025, 46, 112547
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Cetyltrimethylammonium bromide reformed ceria nanocomposites of chemical mechanical planarization for silica wafers

You‒Sheng Lin, Kuen‒Song Lin, Wei‒Chin Tsai, Ndumiso Vukile Mdlovu, Cheng‒Yan Tang and U‒Ser Jeng

Journal of the Taiwan Institute of Chemical Engineers, 2023, 150, 105079
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Preparation of SiO2@MnO2 composite abrasives and their performance in chemical-mechanical polishing of SiC substrates

Ruixing Yang, Hong Lei and Jianhua Zhang

Ceramics International, 2024, 50, 34796
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Crack propagation mechanisms in laser slicing of 4° off-axis 4H-SiC and separation strength regulation via multi-beam processing

Heng Wang, Qiang Cao, Tianhao Wu, Lulu Yu, Zhenzhong Wang, Sheng Peng and Du Wang

Materials Science in Semiconductor Processing, 2026, 201, 110100
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Study of abrasive grain motion characteristics in ultrasonic-assisted chemical mechanical polishing process

Yangyang Zhang, Yingshuai Wang, Yujie Yuan, Xiaojing Li, Jiarun Xie, Xiaofeng Liu, Mengmeng Liu and Yuanyuan Cui

J Mech Sci Technol, 2025, 39, 7009
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Novel ceria/graphene oxide composite abrasives for chemical mechanical polishing

Chuandong Chen, Yanying Cui, Xiaopei Li, Sida Shen, Wuping Liao and Hongpeng You

Ceramics International, 2024, 50, 26325
DOI: 10.1016/j.ceramint.2024.03.193

The influence of the types of cluster composite abrasives on the performance of fixed abrasive pads in processing quartz glass

Zhankui Wang, Pengzhan Wang, Xiaokun Wei, Minghua Pang, Wei Feng, Yunlong Yao and Jianxiu Su

Materials Today Communications, 2024, 39, 108998
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Sn-seeded Si nanowire growth on N-doped rGO for high-power lithium-ion battery anodes

Aaron Hennessy, Luigi Jacopo Santa Maria, Miguel Granados-Moreno, Jon Ajuria, Hugh Geaney, Michela Ottaviani and Kevin M. Ryan

Journal of Power Sources, 2026, 667, 239126
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Development of core–shell SiO2@A-TiO2 abrasives and novel photocatalytic chemical machinal polishing for atomic surface of fused silica

Chunjing shi, Yuanhang Fan, Zhenyu Zhang, Xingqiao Deng, Jiaxin Yu, Hongxiu Zhou, Fanning Meng and Junyuan Feng

Applied Surface Science, 2024, 652, 159293
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Cleaning mechanisms during post chemical mechanical polishing (CMP) using particle removal of surfactants via a citric acid-based solution

Haoyu Du, Renhao Liu, Baimei Tan, Fangyuan Wang, Xiaolong Wang, Xinyu Han, Xinyu Zhao and Jiadong Zhao

Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2024, 697, 134428
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Study on the Synergistic Effect of Water-soluble Polymers on the Surface Properties of Silicon Wafers

Peng Zhao, Yulin Chen, Jige Wang, Zhiyuan Zhao, Meng Yang and Zefang Zhang

Silicon, 2026, 18, 1279
DOI: 10.1007/s12633-025-03581-4

A High-Efficiency Environmentally Friendly Polishing Slurry for K9 Glass Utilizing Cerium-Based Compounds

Shaoping Li, Rui Ye, Zhemin Zou, Zhaobo He, Kai Feng, Huidong Cui, Ruan Chi, Yukun Chen and Yue Luo

Molecules, 2025, 30, 4546
DOI: 10.3390/molecules30234546

Unprecedented developed composite polishing system to achieve atomic surface integrating rough and fine polishing using a novel hyper-conjugated pad through controlling the temperature of a proposed green slurry

Feng Zhao, Zhenyu Zhang, Hongxiu Zhou, Leilei Chen, Kuo Hai, Liwei Wu, Jiahao Yu, Zefang Zhang and Cheng Fan

Adv Compos Hybrid Mater, 2025, 8
DOI: 10.1007/s42114-025-01306-0

Development and characterization of CeO2 polishing powder: Calculation of microstructure parameters using XRD profile analysis and its heterogeneous Fenton-like oxidation process investigation

Elaziouti Abdelkader, Laouedj Nadjia and Taibi Mohamed

Appl. Phys. A, 2025, 131
DOI: 10.1007/s00339-025-08927-8

Bridging efficiency and scalability: A systematic evaluation of diamond wire sawn silicon wafer texturing technologies for high-performance photovoltaics

Yanfeng Wang, Fengshuo Xi, Kuixian Wei, Zhongqiu Tong, Shaoyuan Li, Zhao Ding and Wenhui Ma

Applied Energy, 2025, 386, 125591
DOI: 10.1016/j.apenergy.2025.125591

Chemical mechanical polishing of sapphire elucidated by densely discrete phase model and verified using atomic force microscopy

Mufang Zhou, Min Zhong, Wenhu Xu, Meirong Yi, Xiaobing Li and Jianfeng Chen

Tribology International, 2024, 197, 109834
DOI: 10.1016/j.triboint.2024.109834

Promoting effect of LaOF on chemical mechanical polishing performance of cerium-based abrasives

Yan Zhang, Juan Liang, Peng Jing, Kaiwen Chi, Junchao Yu, Xiaozheng Jia, Xuan Xu, Baocang Liu, Tao Bai and Jun Zhang

Journal of Rare Earths, 2025, 43, 2005
DOI: 10.1016/j.jre.2024.10.001

A Novel Approach for Atomic-Scale Manufacturing via Enzymatic Hydrolysis Machining

Bing Wu, Yongjie Zhang, Yinhui Wang, Yongyu Fan, Rongyan Sun and Hui Deng

Engineering, 2026
DOI: 10.1016/j.eng.2026.01.024

Fabrication and Application of Glass Fiber-reinforced Sol–Gel Tools for Optical Glass Polishing

Zilong Zhao, Jing Lu, Yun Shen and Lingyu Xi

Int. J. Precis. Eng. Manuf., 2026, 27, 453
DOI: 10.1007/s12541-025-01331-5

Atomic-Scale Interface Engineering via Ultrasonic-Electrochemical Hybrid Polishing: Achieving Damage-Free NiTi Bipolar Plates with Ultra-Low Contact Resistance for Hydrogen Fuel Cells

Jianwei Che, Xinyue Zhang, Hui Li and Guangfeng Shi

Langmuir, 2025, 41, 23389
DOI: 10.1021/acs.langmuir.5c02233

Online monitoring and prediction for surface roughness in rotational electro-magnetic finishing using acoustic emission and vision-based neural network

Jung-Hee Lee, Dave Farson, Hideo Cho and Jae-Seob Kwak

Int J Adv Manuf Technol, 2023, 129, 5219
DOI: 10.1007/s00170-023-12654-w

Simulation modeling of wafer grinding topography considering spindle inclination angle

Tianyu Li, Xianglong Zhu, Renke Kang, Meng Li, Jiahui Xu and Lihao Dai

International Journal of Mechanical Sciences, 2025, 304, 110619
DOI: 10.1016/j.ijmecsci.2025.110619

Uniting Ultrahigh Plasticity with Near‐Theoretical Strength in Submicron‐Scale Si via Surface Healing

Wei Xu, Jinhua Yu, Jun Ding, Yunna Guo, Lei Deng, Liqiang Zhang, Xiaoxuan Wan, Shaochuan Zheng, Yuecun Wang and Zhiwei Shan

Adv Funct Materials, 2024, 34
DOI: 10.1002/adfm.202404694

Surface evolution mechanism for atomic-scale smoothing of Si via atmospheric pressure plasma etching

Bing Wu, Rong Yi, Xuemiao Ding, Tom Chiu, Quanpeng He and Hui Deng

Journal of Manufacturing Processes, 2024, 132, 353
DOI: 10.1016/j.jmapro.2024.10.080

Insights into the role of electrolytes in slurry performance for photoelectrochemical mechanical polishing of GaN wafers

Yuewen Sun, Zhigang Dong, Jihao Zhang, Jiajian Feng, Renke Kang and Shang Gao

Journal of Materials Research and Technology, 2025, 36, 2096
DOI: 10.1016/j.jmrt.2025.03.267

Unveiling superior chemical mechanical polishing properties of a novel shell-core structure: Insights from an atomic-scale perspective

Chuandong Chen, Shuaijun Yue, Yang Liu and Hongpeng You

Applied Surface Science, 2024, 672, 160845
DOI: 10.1016/j.apsusc.2024.160845

Insight into the mechanism of lattice damage in ground and polished InAs substrates

Xinyu Lv, Hui Xie, Chenhui Li, Wenwen Yang, Yihan Bai, Guowei Wang, Youwen Zhao, Yingqiang Xu, Lijie Liu, Li He and Guiying Shen

Journal of Vacuum Science & Technology A, 2025, 43
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Review on polishing of atomic-level surfaces for potassium dihydrogen phosphate

Fanning Meng, Zhenyu Zhang, Zinuo Zeng, Cheng Fan, Yang Gu, Fei Gao, Hao Luo, Jianmei Wang and Guo Li

Tribology International, 2024, 198, 109872
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Towards atomic-scale smooth surface manufacturing of β-Ga2O3 via highly efficient atmospheric plasma etching

Yongjie Zhang, Yuxi Xiao, Jianwen Liang, Chun Zhang and Hui Deng

Int. J. Extrem. Manuf., 2025, 7, 015105
DOI: 10.1088/2631-7990/ad8711

Experimental investigation on crack evolution and separation strength in 4H-SiC slicing by sub-nanosecond laser

Heng Wang, Qiang Cao, Tianhao Wu, Zhenzhong Wang, Yuting Hou, Sheng Peng and Du Wang

Optics & Laser Technology, 2025, 187, 112826
DOI: 10.1016/j.optlastec.2025.112826

Atomic surface of AlSi10Mg produced by novel green chemical mechanical polishing using hybrid abrasives and material removal mechanism elucidated by nanoscratching

Zeyun Wang, Zhenyu Zhang, Yujie Chen, Jingsheng Luo, Jiang Li, Jianjun Hu, Longliang Huang, Pengfei Hu and Haisong Huang

Tribology International, 2026, 214, 111310
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Damage evolution and plastic deformation mechanism of passivation layer during shear rheological polishing of polycrystalline tungsten

Lin Wang, Maoxi Wu, Hongyu Chen, Wei Hang, Xu Wang, Yunxiao Han, Heng Chen, Pengqi Chen, Tufa Habtamu Beri, Laima Luo and Binghai Lyu

Journal of Materials Research and Technology, 2024, 28, 1584
DOI: 10.1016/j.jmrt.2023.12.122

Improvement of Field Emission Performance of Multilayered Porous Silicon-Based Electron Source Through Hydrogen Passivation

Li He, Sailei Li, Qi He, Biqi Miao, Qinglei Jiang, Guiying Shen and Wei Luo

IEEE Electron Device Lett., 2024, 45, 1706
DOI: 10.1109/LED.2024.3435405

Chemical Mechanical Polishing of Zerodur® Using Silica and Ceria Nanoparticles: Toward Ultra-Smooth Optical Surfaces

Houda Bellahsene, Saad Sene, Gautier Félix, Nicolas Fabregue, Michel Marcos, Arnaud Uhart, Jean-Charles Dupin, Erwan Oliviero, Joulia Larionova, Marc Ferrari and Yannick Guari

Nanomaterials, 2025, 15, 1391
DOI: 10.3390/nano15181391

Improvement of chemical mechanical polishing performance by introducing N–Si bond via external coating of cerium oxide with ZIF-8

Chuandong Chen, Yang Liu, Xiaopei Li, Yanying Cui, Sida Shen, Wuping Liao and Hongpeng You

Surfaces and Interfaces, 2024, 50, 104488
DOI: 10.1016/j.surfin.2024.104488

A review on the development of ceria for chemical mechanical polishing

Jiahui Ma, Ning Xu, Jie Cheng and Yongping Pu

Powder Technology, 2024, 444, 119989
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Application of amino acids as auxiliary reagents in chemical mechanical polishing: an in-depth review

Jiakai Zhou, Chao He, Changxin Dong, Xinjie Li, Zheng Wu, Bin Hu, Jiahui Li, Ziliang Liu, Qing Ma, Shaobo Song, Mengqi Wang and Xinhuan Niu

Surf. Sci. Technol., 2025, 3
DOI: 10.1007/s44251-025-00077-6

Radiation defects as probes for the copper and nickel contamination during the chemomechanical polishing of Si wafers

Nikolai Yarykin and Jörg Weber

Materials Science in Semiconductor Processing, 2024, 169, 107938
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Efficient solid dielectric electrochemical polishing with minimal electrolyte consumption and reusable conductive media

Shenggui Liu, Chaojiang Li, Zilong Guo, Xin Jin, Dongyi Zou, Xun Cao and Guodong Liu

Journal of Cleaner Production, 2024, 467, 142888
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Zirconium and/or cerium-containing mesoporous silica as functional active abrasive particles for radical-facilitated chemical mechanical polishing

Zichen Tang, Yang Chen, Wenjin Zhou, Luning Zhong and Ailian Chen

Journal of Alloys and Compounds, 2025, 1010, 178090
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A review of organic additives in CMP slurry

Jiaqi Fu, Zuozuo Wu, Yiting Li, Daming Wang, Wuju Qin, Yangjian Li, Shuai Yuan, Jianwei Cao and Deren Yang

Next Research, 2025, 2, 100493
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Nanoscale Surface Refinement of CoCrMo Alloy for Artificial Knee Joints via Chemical Mechanical Polishing

Hanji Zhang, Jiangliang Zhang, Jinghui Lai, Yilin Chen, Mengqiang Tian, Guofeng Pan, Xueli Yang and Yuhang Qi

Materials, 2023, 17, 8
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Ion beam smoothing of fused silica at atomic-scale assisted by damage recovery using inductively coupled plasma

Bing Wu, Shaoxiang Liang, Junqi Zhang, Xuemiao Ding, Tom Chiu, Pei Huang, Yinhui Wang and Hui Deng

Precision Engineering, 2024, 90, 71
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Cyclic Oxidation–Reduction Cleaning for Microstructural and Chemical Restoration of Copper after Chemical Mechanical Polishing

Cheng-Hsuan Kuo, Jit Dutta, Hyeokin Ko, Dipayan Pal, Madison Manley, Rohan Sahay, Danish Baig, Muhannad Bakir, Charles H. Winter, Carl V. Thompson and Andrew C. Kummel

ACS Appl. Electron. Mater., 2026, 8, 1588
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The impact of the combination of xanthan gum and polyvinyl pyrrolidone (PVP) on the chemical mechanical polishing of through silicon via (TSV) barrier layer

Tao Zheng, Ru Wang, Yanwei Dong, Xuhua Chen and Zhanjie Du

Materials Today Communications, 2024, 38, 107749
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Synthesis of bismuth-doped praseodymium ortho ferrite nanomaterials for LPG sensing

Keval Bharati, Prabhat Ranjan Tiwari, Rahul Pratap Singh, Ajeet Singh, Bal Chandra Yadav, Manish Pratap Singh and Santosh Kumar

Appl Nanosci, 2024, 14, 277
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Multi-pole magnetorheological shear thickening polishing on inner surface of aluminum alloy slender tubes

Jiyong Li, Zenghua Fan, Jun Gao, Zihao Yang and Yebing Tian

Journal of Materials Research and Technology, 2023, 27, 8258
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Preparing an ultra-smooth TaW alloy surface with chemical mechanical polishing via controlling galvanic corrosion

Qijian Zhao, Chuandong Tian, Jiaxin Zheng, Pengfei Sun, Liang Jiang and Linmao Qian

J Appl Electrochem, 2024, 54, 839
DOI: 10.1007/s10800-023-01986-w