Hydrosilylation-Derived Silicon-Containing Hydrocarbon-Based Polymers Exhibiting Ultralow Dielectric Losses and High Thermal Stabilities

Abstract

With the continual evolution of high-frequency communication technologies, the demand for advanced insulating materials with minimal dielectric losses has become increasingly critical. In this work, Si-containing hydrocarbon-based polymers are prepared via a hydrosilylation polymerization reaction between dihydrosilanes and diynes or dienes, which are strategically engineered to achieve both a low dielectric constant (Dk) and an exceptionally low dielectric loss tangent (Df). This polymerization method proceeded efficiently under mild conditions, yielding high-purity polymers without by-product formation. The resulting materials exhibited outstanding dielectric properties, with Dk values of ~2.6 and Df values <0.002 at 20 GHz, the latter of which reached as low as 0.0011 in optimized systems. Notably, these favorable characteristics were maintained even at frequencies exceeding 75 GHz. Thermogravimetric analysis confirmed excellent thermal stabilities, with decomposition temperatures (Td-10) surpassing 400°C. Moreover, the polymers displayed good solubilities in a wide range of organic solvents (excluding alcohols), indicating their practical processability. Collectively, these results demonstrate the potential of the synthesized materials for use as next-generation interlayer dielectrics for high-speed communication applications.