Issue 17, 2024

Highly oriented BN-based TIMs with high through-plane thermal conductivity and low compression modulus

Abstract

In the pursuit of effective thermal management for electronic devices, it is crucial to develop insulation thermal interface materials (TIMs) that exhibit exceptional through-plane thermal conductivity, low thermal resistance, and minimal compression modulus. Boron nitride (BN), given its outstanding thermal conduction and insulation properties, has garnered significant attention as a potential material for this purpose. However, previously reported BN-based composites have consistently demonstrated through-plane thermal conductivity below 10 W m−1 K−1 and high compression modulus, whilst also presenting challenges in terms of mass production. In this study, low molecular weight polydimethylsiloxane (PDMS) and large-size BN were utilized as the foundational materials. Utilizing a rolling-curing integrated apparatus, we successfully accomplished the continuous preparation of large-sized, high-adhesion BN films. Subsequent implementation of stacking, cold pressing, and vertical cutting techniques enabled the attainment of a remarkable BN-based TIM, characterized by an unprecedented through-plane thermal conductivity of up to 12.11 W m−1 K−1, remarkably low compression modulus (55 kPa), and total effective thermal resistance (0.16 °C in2 W−1, 50 Psi). During the TIMs performance evaluation, our TIMs demonstrated superior heat dissipation capabilities compared with commercial TIMs. At a heating power density of 40 W cm−2, the steady-state temperature of the ceramic heating element was found to be 7 °C lower than that of the commercial TIMs. This pioneering feat not only contributes valuable technical insights for the development of high-performance insulating TIMs but also establishes a solid foundation for widespread implementation in thermal management applications across a range of electronic devices.

Graphical abstract: Highly oriented BN-based TIMs with high through-plane thermal conductivity and low compression modulus

Supplementary files

Transparent peer review

To support increased transparency, we offer authors the option to publish the peer review history alongside their article.

View this article’s peer review history

Article information

Article type
Communication
Submitted
22 Мам. 2024
Accepted
16 Шіл. 2024
First published
17 Шіл. 2024

Mater. Horiz., 2024,11, 4064-4074

Highly oriented BN-based TIMs with high through-plane thermal conductivity and low compression modulus

R. Yang, Y. Wang, Z. Zhang, K. Xu, L. Li, Y. Cao, M. Li, J. Zhang, Y. Qin, B. Zhu, Y. Guo, Y. Zhou, T. Cai, C. Lin, K. Nishimura, C. Xue, N. Jiang and J. Yu, Mater. Horiz., 2024, 11, 4064 DOI: 10.1039/D4MH00626G

To request permission to reproduce material from this article, please go to the Copyright Clearance Center request page.

If you are an author contributing to an RSC publication, you do not need to request permission provided correct acknowledgement is given.

If you are the author of this article, you do not need to request permission to reproduce figures and diagrams provided correct acknowledgement is given. If you want to reproduce the whole article in a third-party publication (excluding your thesis/dissertation for which permission is not required) please go to the Copyright Clearance Center request page.

Read more about how to correctly acknowledge RSC content.

Social activity

Spotlight

Advertisements