Issue 4, 2017

A simple and low-cost chip bonding solution for high pressure, high temperature and biological applications

Abstract

The sealing of microfluidic devices remains a complex and time-consuming process requiring specific equipment and protocols: a universal method is thus highly desirable. We propose here the use of a commercially available sealing tape as a robust, versatile, reversible solution, compatible with cell and molecular biology protocols, and requiring only the application of manually achievable pressures. The performance of the seal was tested with regards to the most commonly used chip materials. For most materials, the bonding resisted 5 bars at room temperature and 1 bar at 95 °C. This method should find numerous uses, ranging from fast prototyping in the laboratory to implementation in low technology environments or industrial production.

Graphical abstract: A simple and low-cost chip bonding solution for high pressure, high temperature and biological applications

Supplementary files

Article information

Article type
Communication
Submitted
24 10 2016
Accepted
15 1 2017
First published
16 1 2017
This article is Open Access
Creative Commons BY-NC license

Lab Chip, 2017,17, 629-634

A simple and low-cost chip bonding solution for high pressure, high temperature and biological applications

M. Serra, I. Pereiro, A. Yamada, J.-L. Viovy, S. Descroix and D. Ferraro, Lab Chip, 2017, 17, 629 DOI: 10.1039/C6LC01319H

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