Pattern transfer during deposition and fixation of oligomeric bisphenol A on pre-structured copper surfaces

Pattern transfer during deposition of oligomeric bisphenol A (OBA) on pre-structured Cu surfaces is investigated by means of a combined experimental–computational approach. Aiming for quantitative prediction of experiments, as characterized by atomic force microscopy (AFM), we explore the capabilities of stochastic rate equations to quantitatively account for the spatio-temporal evolution of surface topography. While surface diffusion and deposition noise constitute the main mechanisms, pattern transfer is affected by the inclusion of retardation in the interface potential, which appears to be necessary beyond a critical initial surface slope. In addition, routes for successful surface fixation by cross-linking are also demonstrated, which may pave the way for further technological use.