Min Hyuk Park, Dong Hyun Lee, Kun Yang, Ju-Yong Park, Geun Taek Yu, Hyeon Woo Park, Monica Materano, Terence Mittmann, Patrick D. Lomenzo, Thomas Mikolajick, Uwe Schroeder and Cheol Seong Hwang
J. Mater. Chem. C, 2020, 8, 10526
DOI: 10.1039/D0TC01695K
Fei Huang, Xing Chen, Xiao Liang, Jun Qin, Yan Zhang, Taixing Huang, Zhuo Wang, Bo Peng, Peiheng Zhou, Haipeng Lu, Li Zhang, Longjiang Deng, Ming Liu, Qi Liu, He Tian and Lei Bi
Jae Hee Song, Kyung Do Kim, Jonghoon Shin, Seong Jae Shin, Suk Hyun Lee, Seung Yong Byun, In Soo Lee, Han Sol Park, Yeon Jae Kim, Hyun Woo Nam and Cheol Seong Hwang
J. Mater. Chem. C, 2025, 13, 14751
DOI: 10.1039/D5TC01449B
Tae Won Park, Jiwon Moon, Dong Hoon Shin, Hae Jin Kim, Seung Soo Kim, Jea Min Cho, Hyungjun Park, Kyung Seok Woo, Dong Yun Kim, Sunwoo Cheong, Haewon Song, Jong Hoon Shin, Soo Hyung Lee, Néstor Ghenzi and Cheol Seong Hwang
Min Hyuk Park, Han Joon Kim, Gwangyeop Lee, Jaehong Park, Young Hwan Lee, Yu Jin Kim, Taehwan Moon, Keum Do Kim, Seung Dam Hyun, Hyun Woo Park, Hye Jung Chang, Jung-Hae Choi and Cheol Seong Hwang
Claudia Richter, Tony Schenk, Min Hyuk Park, Franziska A. Tscharntke, Everett D. Grimley, James M. LeBeau, Chuanzhen Zhou, Chris M. Fancher, Jacob L. Jones, Thomas Mikolajick and Uwe Schroeder
Baek Su Kim, Seung Dam Hyun, Taehwan Moon, Keum Do Kim, Young Hwan Lee, Hyeon Woo Park, Yong Bin Lee, Jangho Roh, Beom Yong Kim, Ho Hyun Kim, Min Hyuk Park and Cheol Seong Hwang
Nanoscale Res Lett, 2020, 15 DOI: 10.1186/s11671-020-03301-4
Puyang Cai, Hao Li, Zhiwei Liu, Tianxiang Zhu, Min Zeng, Zhigang Ji, Yanqing Wu, Andrea Padovani, Luca Larcher, Milan Pešić, Runsheng Wang and Ru Huang
IEEE Trans. Electron Devices, 2022, 69, 2384
DOI: 10.1109/TED.2022.3161894
Seung Dam Hyun, Hyeon Woo Park, Yu Jin Kim, Min Hyuk Park, Young Hwan Lee, Han Joon Kim, Young Jae Kwon, Taehwan Moon, Keum Do Kim, Yong Bin Lee, Baek Su Kim and Cheol Seong Hwang
Kun Yang, Gi-Yeop Kim, Jin Joo Ryu, Dong Hyun Lee, Ju Yong Park, Se Hyun Kim, Geun Hyeong Park, Geun Taek Yu, Gun Hwan Kim, Si Young Choi and Min Hyuk Park
Materials Science in Semiconductor Processing, 2023, 164, 107565
DOI: 10.1016/j.mssp.2023.107565