Issue 38, 2025

Electrochemistry-induced deposition for controlled formation of metal–organic framework films on insulator and conductor substrates

Abstract

A number of technological applications of metal–organic frameworks (MOFs) require the formation of their thin films on insulator and/or conductor substrates at selected areas with desired thicknesses. However, fabrication of such MOF films often requires multi-step processes and/or sophisticated instruments. Herein, we discuss electrochemistry-induced MOF deposition, which permits the direct formation of a thin MOF film with controlled thickness at a desired area on various substrates. So far, we have reported the applicability of this deposition method for the formation of zeolitic imidazolate framework-8 (ZIF-8) films. In this method, a ZIF-8 film is formed on an insulator or a conductor substrate upon applying a cathodic potential to a working electrode that is placed above the substrate. Importantly, the film is formed just below the cathodic working electrode, indicating that the position and lateral dimensions (on the mm- to μm-scale) of the film can be controlled by those of the working electrode. In addition, film thickness is controllable in the range of tens to hundreds of nanometers by adjusting potential application conditions at the cathodic working electrode. These results show that the electrochemistry-induced deposition method will provide a simple means for the fabrication of a patterned MOF film on various substrates without additional lithographic processes.

Graphical abstract: Electrochemistry-induced deposition for controlled formation of metal–organic framework films on insulator and conductor substrates

Article information

Article type
Highlight
Submitted
22 Jul 2025
Accepted
21 Aug 2025
First published
21 Aug 2025
This article is Open Access
Creative Commons BY license

CrystEngComm, 2025,27, 6274-6282

Electrochemistry-induced deposition for controlled formation of metal–organic framework films on insulator and conductor substrates

T. Ito and E. A. Skinner, CrystEngComm, 2025, 27, 6274 DOI: 10.1039/D5CE00727E

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