Cross Reference Logo
Citations to this article as recorded by CrossRef and RSC Journals (13 citations).

Air-sinterable copper pastes for next-generation electronics: a review
Xinyi Shi, Songtang Li, Su Ding, Minggang Li, Junfeng Sun, Ke Li and Wanli Li
J. Mater. Chem. C, 2026, 14, 4696
DOI: 10.1039/D5TC04491J

Dual-function conductive silver paste: application of an epoxy system based on curing resistance evolution in packaging and flexible electronics
Tong Xue, Dalei Song, Qi Liu, Jing Yu and Jun Wang
J. Mater. Chem. C, 2026, 14, 5411
DOI: 10.1039/D5TC03861H

Enhancing Hydrophilicity of Electroplated Ag Metallization by Ar/O2 Plasma Treatment to Promote Ag Sintering Reaction
Minju Yu, Seoyeong Lee and Min-Su Kim
J. Electron. Mater., 2026, 55, 1626
DOI: 10.1007/s11664-025-12584-1

Effect of copper incorporation into silver nanoparticles on the structural, morphological, and rheological properties of lead-free pastes for solar cell applications
Hazmoune Abdessalam, Lounis Azeddine, Abdelmounaim Chetoui, Ilyas Belkhettab, Ismail Bencherifa and Ahmed Kellai
Korea-Aust. Rheol. J., 2026
DOI: 10.1007/s13367-026-00154-8

Effect of Flexible Electrode Formulation on Integrity and Conductivity
Rongrong Yuan, Yizhe Sun, Zhipeng Li, Xinhui Cui, Lu Tao and Xinqun Zhang
J. Electron. Mater., 2026, 55, 4316
DOI: 10.1007/s11664-026-12735-y

Investigation of tribological and electrical behavior of CARB-processed multilayer Cu/Ag composites for spatial conductive slip rings
Lin Yang, Pu Li, Yanyan Huang, Qinghua Zhou, Xiaowu Luo, Chaowen Deng, Penghui Xu, Yanmin Liu and Qiang Zhang
Wear, 2026, 595, 206693
DOI: 10.1016/j.wear.2026.206693

Mechanism of Free Silver Formation While Preparing Silver-Coated Copper Powder by Chemical Plating and Its Control
Junquan Chen, Xiaoyun Zhu, Nan Yang, Xiang Li and Bingzhe Yang
Coatings, 2025, 15, 169
DOI: 10.3390/coatings15020169

Molecular Dynamics Study of the Sintering Behavior and Mechanical Properties of Cu@Ag Core–Shell Nanoparticle Solder Paste
Xuezhi Zhang, Jian Gao and Lanyu Zhang
Materials, 2026, 19, 1612
DOI: 10.3390/ma19081612

Temperature Matters: Annealing Effects on Silver Protection and Tungsten Oxidation in W@Ag Core-Shell Powder
Angelina Strakošová, Pavel Lejček, Ilona Voňavková and Vojtěch Dalibor
Manufacturing Technology, 2025, 25, 689
DOI: 10.21062/mft.2025.063

Role of sintering atmosphere in controlling porosity, microstructure and performance of 3D printed polylactic acid/copper composites
Ibrahim Olalekan Lawal, Samir Mekid and Mohammad Shahid Raza
Prog Addit Manuf, 2026, 11, 3591
DOI: 10.1007/s40964-026-01539-5

Advances and challenges in conductive ink 3D printing for sustainable PCB fabrication: a comprehensive review aligned toward industry 5.0
Pruthviraj C. Chavan, Ganesh R. Chate and Vinayak R. Malik
Materials and Manufacturing Processes, 2025, 40, 2093
DOI: 10.1080/10426914.2025.2559616

Low-temperature sinterability of graphene-Cu nanoparticles:Molecular dynamics simulations and experimental verification
Hongliang Lyu, Jiahua He, Cong Wang, Xianshi Jia, Kai Li, Dejin Yan, Nai Lin and Ji’an Duan
Applied Surface Science, 2025, 682, 161683
DOI: 10.1016/j.apsusc.2024.161683

Galvanic preparation of nano-Cu@Ag from reverse micelles for conductive inks
Yu-Chang Huang, Po-Hao Tseng, Ko-Shan Ho and Yu-Min Wang
Materials Chemistry and Physics, 2025, 339, 130641
DOI: 10.1016/j.matchemphys.2025.130641