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Chapter 7

Chemical Vapor Deposition of Metals: W, Al, Cu and Ru

Metal films are used as diffusion barriers, anticorrosion surfaces, interconnects and resistors in microelectronics, reflective surfaces, antifriction and wear surfaces and decorative applications. They can be deposited by dip and powder coating methods, electrochemical and electroless depositions f...
Print publication date: 22 Dec 2008
Copyright year: 2009
Print ISBN: 978-0-85404-465-8
PDF eISBN: 978-1-84755-879-4