Rational structural design of flexible thermally conductive composites for advanced thermal management: a review

Abstract

Modern electronics, particularly wearable devices and portable gadgets, are undergoing a relentless miniaturization coupled with increasing power density, creating an urgent need for advanced thermal management solutions. However, achieving the simultaneous integration of high thermal conductivity, flexibility, robust mechanical properties, and lightweight design in flexible composites remains a significant challenge. This review systematically summarizes rational structural design strategies for developing flexible thermally conductive composites. Various materials are explored, including carbon-based fibers, graphene, carbon nanotubes, boron nitride, and liquid metals. The review highlights key architectural approaches for optimizing thermal transport pathways, including filler alignment through external fields (e.g., mechanical, electric, or magnetic fields) and the construction of three-dimensional networks. The critical importance of thermal conductivity and mechanical flexibility is assessed in the context of applications spanning electronic cooling and human comfort. Furthermore, the performance of these materials is evaluated through representative applications in electronics thermal management and personal thermal management. Finally, the review outlines prevailing challenges and prospective opportunities in the field, providing insightful guidance and inspiration for further innovation toward the development of next-generation flexible thermal management materials.