Thermo-Responsive Hydrophilic Amine Microcapsules for All-in-one Epoxy System: Effective Adhesion, Radiative Cooling, and Toughening via Interpenetrating Networks

Abstract

Although there has been substantial progress in functionalizing material systems today, most are still mainly designed for two-part storage and a single function. Combining various functionalities into a cohesive, unified material system remains a critical and urgent challenge. In this context, microencapsulation techniques serve as a reliable and effective method for embedding reactive triggers within polymer matrices, creating cohesive multifunctional polymer systems. This study introduces a simplified, solvent-free liquid-liquid phase-separation approach, named melt-condensation, for encapsulating tetraethylenepentamine (TEPA) within a polyethylene wax (PEW) shell, using perfluorotributylamine (PFTBA) as a cooling medium. By precisely controlling the interfacial tension between different phases, core-shell spherical microcapsules with ~61.2 wt% core content can be obtained. These microcapsules demonstrate robust sealing performance and exhibit temperature-triggered burst release (within 6 seconds at 105°C). By introducing these thermo-responsive microcapsules into the epoxy matrix, a multifunctional resin system was successfully organized. This multifunctional system, as an adhesive, increased peel distance by 201% and demonstrated excellent adhesion to aluminum and stainless-steel substrates at typical room temperature; as a functional coating, it facilitated crack repair with a recovery rate of 86.7% and achieved passive cooling of nearly 7°C during the daytime. Our research uniquely integrates distinct functions in a single system, establishing a new direction in novel material systems.

Supplementary files

Article information

Article type
Paper
Submitted
14 Mar 2026
Accepted
12 May 2026
First published
18 May 2026

J. Mater. Chem. A, 2026, Accepted Manuscript

Thermo-Responsive Hydrophilic Amine Microcapsules for All-in-one Epoxy System: Effective Adhesion, Radiative Cooling, and Toughening via Interpenetrating Networks

Z. LI, X. Liu, Z. Du and J. Yang, J. Mater. Chem. A, 2026, Accepted Manuscript , DOI: 10.1039/D6TA02214F

To request permission to reproduce material from this article, please go to the Copyright Clearance Center request page.

If you are an author contributing to an RSC publication, you do not need to request permission provided correct acknowledgement is given.

If you are the author of this article, you do not need to request permission to reproduce figures and diagrams provided correct acknowledgement is given. If you want to reproduce the whole article in a third-party publication (excluding your thesis/dissertation for which permission is not required) please go to the Copyright Clearance Center request page.

Read more about how to correctly acknowledge RSC content.

Social activity

Spotlight

Advertisements