Multi-Functional Engineering of Mesoporous TiO2 Interlayer via Cu-Loading for Highly Efficient and Stable Hybrid Perovskite Solar Cells

Abstract

Titanium dioxide (TiO2 )-based electron transport layers (ETLs) are widely used in perovskite solar cells (PSCs) but suffer from low electron mobility, deep-level defects, and detrimental interfacial recombination, which lower open-circuit voltage (VOC) and short-circuit current density (JSC) and ultimately limit power conversion efficiency (PCE). In this study, a multifunctional mesoporous TiO2 (mfm-TiO2 ) has been developed that integrates the inherent structural advantages of conventional mesoporous TiO2 (m-TiO2 ) with interlayer engineering functionalities to overcome these limitations. In contrast to conventional m-TiO2, mfm-TiO2 provides optimized electronic structure, surface chemistry, and interfacial energetics through strategic Cu incorporation via photodeposition. This approach enables synergistic improvements in electron transport, defect passivation, and energy level alignment while preserving the intrinsic benefits of m-TiO2 , including efficient charge extraction and interfacial carrier separation. Consequently, PSCs incorporating mfm-TiO2 demonstrated a VOC of 1.162 V, JSC of 26.19 mA/cm2, and fill factor (FF) of 84.4%, achieving a champion PCE of 25.68%, significantly higher than the 23.12% obtained with m-TiO2 . Beyond efficiency enhancement, mfm-TiO2 substantially improved device longevity, retaining 94.6% of initial PCE after 2,450 h under dry-room conditions without encapsulation. This multi-functional approach demonstrates transitioning from conventional single-function layers to multi-functional integrated layers for enhanced device performance.

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Article information

Article type
Paper
Submitted
13 Nov 2025
Accepted
06 Jan 2026
First published
07 Jan 2026

Nanoscale, 2026, Accepted Manuscript

Multi-Functional Engineering of Mesoporous TiO2 Interlayer via Cu-Loading for Highly Efficient and Stable Hybrid Perovskite Solar Cells

J. Kim, K. An, N. S. Lopa, S. V. Mohite, Y. Kim and T. W. Kim, Nanoscale, 2026, Accepted Manuscript , DOI: 10.1039/D5NR04808G

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