Recent Research Progress on Photothermal Ice-phobic Materials from Fabrication to Application

Abstract

The increasing frequency of extreme weather events driven by global climate change has intensified icing-related challenges across critical infrastructure, including transportation, energy systems, and aerospace applications. Conventional anti-/de-icing technologies are often limited by high energy consumption, operational inefficiency, and environmental concerns, underscoring the urgent need for more sustainable solutions. Photothermal materials have shown great potential in anti icing applications, offering efficient, eco-friendly ice mitigation by harnessing solar energy for localized heat generation. This review provides a systematic summary of the role and application prospects of photothermal anti icing materials in anti icing applications, with an emphasis on the underlying mechanisms, particularly interfacial wettability dynamics and thermal transport processes. We categorize and critically assess major classes of photothermal materials, including carbon-based, metallic, semiconductor, polymeric, and all-weather systems, discussing their fabrication strategies and associated performance trade-offs. Key barriers to commercialization are highlighted, including challenges related to mechanical durability and geometric adaptability, optical transparency and scalable production, as well as precise thermal management and longterm chemical stability. By integrating recent research progress with ongoing limitations, this review aims to establish a foundation for future material innovation and offer strategic insights for the practical deployment of photothermal ice-phobic technologies.

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Article information

Article type
Review Article
Submitted
02 Oct 2025
Accepted
29 Dec 2025
First published
09 Jan 2026

Mater. Horiz., 2026, Accepted Manuscript

Recent Research Progress on Photothermal Ice-phobic Materials from Fabrication to Application

B. Shi, M. Li, G. CHEN, S. LI, R. Song, X. Zheng, Q. He and S. Xie, Mater. Horiz., 2026, Accepted Manuscript , DOI: 10.1039/D5MH01884F

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